• Design & Manufacturing
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• v.16 no.2
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• pp.13-19
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• 2022

Recently, electric vehicles are gaining popularity among many domestic and foreign users due to their eco-friendly advantages of reducing fine dust and environmental greenhouse gases. As the demand and supply of electric vehicles increase, the demand for electric vehicle charging infrastructure is also growing together. Many users are experiencing inconvenience due to poor charging infrastructure, which makes them hesitant to buy electric vehicles. Research on the user experience of chargers in apartment complexes, a common residential type in Korea, is being conducted somewhat, but research on the design of electric vehicle charging devices in public places is insufficient. The purpose of this research is to identify user requirements and complaints based on the product design of the electric vehicle charger in public places and propose a new electric vehicle product design concept that meets the requirements. The research method understood the charging base and status of electric vehicles in public places through literature research and examined and analyzed the characteristics and problems of product design cases that improved the charging problem of electric vehicles recently released in the market. It is intended to identify and analyze the problems of the charging device product design through user interviews, a qualitative research method, and based on this, it is intended to propose a user-centered product design concept that improves major complaints.

• Design & Manufacturing
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• v.16 no.2
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• pp.46-52
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• 2022

As the consumer market in the eco-friendly vehicle industry grows, the demand for water pump in a electric car parts market. This study intend to propose a mathematical model that can verify the effect of improving thermal properties when a non-conductive cooling filler liquid is introduced into an electric vehicle water pump. Also, the pros and cons of the immersion cooling method and future development way were suggested by analyzing the cooling characteristics using on the derived analysis solution. Thermal characteristics analysis of electric water pump applied with non-conductive filler liquid was carried out, and the diffusion boundary condition in the motor body and the boundary condition the inside pump were expressed as a geometric model. As a result of analyzing the temperature change for the heat source of the natural convection method and the heat conduction method, the natural convection method has difficulty in dissipating heat because no decrease in temperature due to heat release was found even after 300 sec. Also, it can be seen that the heat dissipation effect was obtained even though the non-conductive filling liquid was applied at the 120 sec and 180 sec in the heat conduction method. It has proposed to minimize thermal embrittlement and lower motor torque by injecting a non-conductive filler liquid into the motor body and designing a partition wall thickness of 2.5 mm or less.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.5
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• pp.725-731
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• 2023

In this study, the harmless crack size was evaluated using carburized, quenched-tempered SCM822H steel. The possibility of detecting cracks that reduce the fatigue limit by non-destructive inspection was evaluated. The conclusions obtained are as follows. The retained austenite of surface was reduced by SP. About 35% and 65% of the retained austenite on the surface were transformed into strain-induced martensite, increasing the hardness by 79HV and 122HV over the as-received material. The maximum compressive residual stresses introduced on the surfaces were -695 MPa and -688 MPa, respectively. The fatigue limit increased by 1.48 times and 1.67 times, respectively, compared to the as-received material. The harmless crack size of SP specimen was determined differently depending on the shot ball size.

• Design & Manufacturing
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• v.17 no.3
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• pp.28-33
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• 2023

The conventional FRP (Fiber Reinforced Plastic) manufacturing process used thermoset resins for ease of molding but faced the issue of non-recyclability. To address these shortcomings, a new process utilizing thermal plastic resin was developed. However, due to the high viscosity of thermal plastic resin, problems such as fiber deformation and a reduced fiber volume fraction occurred during the high-temperature, high-pressure process. In this study, to overcome the limitations of the conventional process, fiber-reinforced composite materials were manufactured through in-situ polymerization using PLA (Poly L-Lactide) resin in the VA-RTM (Vacuum Assistance Resin Transfer Molding) process. The fiber volume of the produced specimens was calculated, and resin impregnation and porosity were confirmed through optical microscopy. Additionally, molecular weight analysis using GPC (Gel Permission Chromatography) demonstrated improvements over the conventional process and emphasized the essential requirement of temperature control.

• Design & Manufacturing
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• v.18 no.2
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• pp.9-16
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• 2024

Recently, there has been extensive research conducted on the miniaturization of semiconductors and the improvement of their integration to achieve high-quality and high-performance electronic devices. To integrate and miniaturize multiple semiconductors, thin and precise wafers are essential. The backgrinding process, which involves high-precision processing, is necessary to achieve this. The backgrinding system is used to grind and polish the back side of the wafer to reduce its thickness to ㎛ units. This enables the high integration and miniaturization of semiconductors and a flattening process to allow for detailed circuit design, ultimately leading to the production of IC chips. As the backgrinding system performs precision processing at the ㎛ unit, it is crucial to determine the stability of the equipment's rigidity. Additionally, the flatness and surface roughness of the processed wafer must be checked to confirm the processability of the backgrinding system. IIn this paper, the goal is to verify the processability of the back grinding system by analyzing the natural frequency and resonance frequency of the equipment through computer simulation and measuring and analyzing the flatness and surface roughness of wafers processed with backgrinding system. It was confirmed whether processing damage occurred due to vibration during the backgrinding process.

• Design & Manufacturing
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• v.18 no.2
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• pp.35-40
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• 2024

Injection molding is a process widely used across various industries for molding plastics, and it is the most commonly applied process in root industries utilizing molds. Among the different types of injection molding, insert injection molding, where busbars are used as inserts, is increasingly being applied in the electric vehicle industry. However, currently, the insert injection molding process is manually performed, with workers placing insert components by hand before injection molding. This results in issues related to productivity, safety, and quality. Additionally, there is a growing demand for automation of such production lines due to hazardous working conditions, economic difficulties in the manufacturing industry, and the decline in the labor force caused by an aging population. This study focuses on the application of an automated system for the insert injection molding process used in electric vehicles. The development of an automated system for the transport and insertion of insert components, as well as the inspection and stacking processes after injection, has resulted in over a 25% improvement in productivity and more than a 27% reduction in defect rates.

• Design & Manufacturing
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• v.18 no.2
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• pp.51-56
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• 2024

In this study, a tool was developed for analyzing production lead time in turning operations. It is expected to help to reduce machining time and to identify, for example, tool change intervals. The tool was developed using Visual Basic.Net and features a user-friendly graphical user interface (GUI) that allows users to easily input cutting conditions and calculate the usage time and feeding distance for each cutting tool based on a G-code program. Object-oriented programming techniques were also used to encapsulate and classify complex logic, thereby efficiently organizing and managing the functions and data structures of this analysis tool. The analysis tool provides various outputs. It calculates the use time of each detailed process of the turning operation, the use time of each tool, the use time of each type of feeding, and also generates the data needed for cutting time analysis, which can be visualized in charts. The analysis tool developed in this study is expected to significantly contribute to improving the efficiency of manufacturing processes and increasing productivity, particularly, in the manufacturing of components requiring massive material removal, such as aircraft parts.

• Design & Manufacturing
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• v.18 no.3
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• pp.30-36
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• 2024

As the demand for biomaterials and medical devices increases due to advancements in medical technology and the rising average lifespan of the population, the importance of surface treatment technology for biometallic materials used in orthopedic implants is highlighted. Achieving stable mechanical attachment between the implant and human bone, specifically bone cell adhesion, is crucial. Without proper adhesion, issues such as inflammation and reduced load-bearing capacity can occur, leading to the need for implant reimplantation. Therefore, this paper focuses on creating a micro-groove pattern using a pulsed nanosecond laser on the surface of a titanium alloy (Ti6Al4V), a biometallic material, to promote cell adhesion. To evaluate the effectiveness of the pattern in enhancing cell adhesion, MG-63 osteoblasts were cultured on the micro-groove patterned surface, and their adhesion and morphological changes were analyzed. This study confirms the potential of laser processing as a surface treatment method for biometallic materials.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.3
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• pp.320-326
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• 2017

Multistage deep-drawing technology is used widely in the production of mobile phone battery cases to improve productivity and economy. To ensure adequate capacity and rigidity, such cases are fabricated as a rectangular cup with a high slender ratio. The multistage deep-drawing of a rectangular cup entails a high slender ratio, and the heights of the product sides may be non-uniform because of the complicated deformation mechanisms. This causes problems in product assembly that affects the surface quality of the case. This study examined a blank shape that minimizes the height variations of the product to resolve the aforementioned problems. Optimization design and analysis were performed to identify the shape that yields the least variation. The long and short sides of an oval blank were set as the design variables. The objective function was set to yield the lowest height difference, and the thickness reduction rate of the product was set to the target range. In addition, the height of the final shape was set as a constraint. The height difference was minimized successfully using the optimized design. The design process of the initial blank for all rectangular shapes can be automated in the future.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.