• Journal of the Korean institute of surface engineering
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• v.49 no.4
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• pp.368-375
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• 2016

MoN-Cu thin films were prepared to achieve appropriate properties of high hardness and low friction coefficient, which could be applied to automobile engine parts for reducing energy consumption as well as solving wear problems. Composite thin films of MoN-Cu have been deposited by various processes using multiple targets such as Mo and Cu. However, those deposition with multiple targets revealed demerits such as difficulties in exact control of composition and homogeneous deposition. This study is aiming for suggesting an appropriate process to solve those problems. A single alloying target of Mo-Cu (10 at%) was prepared by powder metallurgy methods of mechanical alloying (MA) and spar plasma sintering (SPS). Thin film of MoN-Cu was then deposited by magnetron sputtering using the single alloying target of Mo-Cu (10 at%). Properties of the resulting MoN-Cu thin film were examined and compared to those of MoN-Cu thin films prepared with double targets of Mo and Cu.

• Journal of Powder Materials
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• v.25 no.4
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• pp.322-326
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• 2018

The hydrogen reduction behavior of $MoO_3-CuO$ powder mixture for the synthesis of homogeneous Mo-20 wt% Cu composite powder is investigated. The reduction behavior of ball-milled powder mixture is analyzed by XRD and temperature programmed reduction method at various heating rates in Ar-10% $H_2$ atmosphere. The XRD analysis of the heat-treated powder at $300^{\circ}C$ shows Cu, $MoO_3$, and $Cu_2MoO_5$ phases. In contrast, the powder mixture heated at $400^{\circ}C$ is composed of Cu and $MoO_2$ phases. The hydrogen reduction kinetic is evaluated by the amount of peak shift with heating rates. The activation energies for the reduction, estimated by the slope of the Kissinger plot, are measured as 112.2 kJ/mol and 65.2 kJ/mol, depending on the reduction steps from CuO to Cu and from $MoO_3$ to $MoO_2$, respectively. The measured activation energy for the reduction of $MoO_3$ is explained by the effect of pre-reduced Cu particles. The powder mixture, hydrogen-reduced at $700^{\circ}C$, shows the dispersion of nano-sized Cu agglomerates on the surface of Mo powders.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.73-74
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• 2015

본 연구에서는 상호간의 고용도가 없는 Mo, Cu 재료의 합금화가 용이하도록 기계적 합금화법(Mechanical Alloying)을 이용하여 Mo-Cu 합금분말을 제조하였고, 준안정상태의 구조의 유지가 가능한 방전 플라즈마 소결법(Spark Plasma Sintering)을 이용하여 합금타겟을 제작하였다. Mo-Cu 박막을 제작하기 위해서 합금타겟을 이용하였고 스퍼터링 공정을 진행하여 박막을 제작하였다. 그 결과 Mo-10wt%Cu 단일타겟을 이용하여 제작한 박막의 경우 Ar : N 분위기에서 27.7GPa 로 가장 높은 경도값을 가지는 것을 확인하였다. 또한 Mo-5wt%Cu 단일타겟을 이용하여 Ar : N 분위기에서 제작한 박막은 건식조건에서의 마찰계수값이 0.69 로 가장 낮은 것을 확인할 수 있었으며 윤활조건(GF4)에서는 Mo-10wt%Cu 단일타겟을 이용하여 Ar : N 분위기에서 제작한 박막이 0.56 으로 가장 낮았다.

• Journal of the Korean institute of surface engineering
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• v.52 no.4
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• pp.227-232
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• 2019

Mo-N based coatings have been studied for enhancing mechanical characteristics of thin films. In the case of Mo-X-N coatings, the microstructure and mechanical properties can be affected by the addition of the third element. In this work, Mo-Cu-N coatings were successfully fabricated with varying the Cu content from 4.5 at% to 31 at% by the co-sputtering method. Thus, properties of the coatings were analyzed by EDS, SEM, XRD, AFM, nano indentation and scratch test techniques. From observed results, MoxN bonds were made in a nitrogen atmosphere and Cu elements were present at grain boundaries. In addition, coatings with the Cu content above 14 at% had a Cu3N peak in the XRD results. Thus, it is suggested that the formation of Cu3N phase affected the microstructure and mechanical properties of Mo-Cu-N coatings. Mechanical properties of Mo-Cu-N coatings were found to be relatively better at Cu content of about 12 at%.

• Journal of the Korean institute of surface engineering
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• v.43 no.6
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• pp.266-271
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• 2010

Ternary Mo-Cu-N films were deposited on Si wafer substrates with various copper contents by magnetron sputtering method using Mo target and Cu target in $Ar/N_2$ gaseous atmosphere. As increasing $N_2$ pressure, the microstructure of Mo-N films changed from ${\gamma}-Mo_2N$ of (111) having face-centered-cubic (FCC) structure to $\delta$-MoN of (200) having hexagonal structure. Detailed the microstructures of the Mo-Cu-N coatings were studied by X-ray diffraction, scanning electron microscopy and field emission transmission electron microscope. The results indicated that the incorporation of copper into the growing Mo-N coating led to the $Mo_2N$ and MoN crystallites were more well-distributed and refined and the copper existed in grain boundary. Ternary Mo-Cu-N films had a composite microstructure of the nanosized crystal crystalline ${\gamma}-Mo_2N$ and $\delta$-MoN surrounded by amorphous $Cu_3N$ phase.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.227-227
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• 2010

동력 전달을 위한 구동 부품에 대한 내마모성 개선을 통한 에너지 효율 및 부품의 수명 향상에 대한 사회적 관심이 급증하고 있다. 특히, 최근에는 자동차용 구동부품에 저마찰 내마모 특성이 우수한 Mo-N-Cu 나노복합체 박막에 대한 연구가 활발하게 진행되고 있다. 본 연구에서는 Mo-N-Cu 나노복합체 박막을 마그네트론 스퍼터링 증착법을 활용하였고, 이때 Mo 및 Cu 타겟을 적용하여 동시에 증착하였다. 진공 챔버의 진공도는 $5{\times}10^{-6}\;Torr$ 이하의 초기 진공도를 확보한 이후, 알곤 및 질소 가스를 주입하여 공정 압력이 5 mTorr 수준이 되도록 하였다. 이때 N2/(Ar+N2) = 0.5를 유지하였다. Mo-N-Cu 박막내에 Cu 함량 변화를 위해 Mo 캐소드는 D.C. 1 kW로 고정하고 Cu 캐소드에 R.F. 파워를 0, 40, 60, 80 W로 변화하였다. 박막의 두께는 증착시간을 변화하면서 $1\;{\mu}m$ 이상이 되도록 하였다. Cu 캐소드에 인가된 파워의 변화에 따라 Mo-N-Cu 박막내 Cu 함유량은 10 at.%까지 변화되는 것을 EDX 분석을 통해 확인하였다. 또한 증착된 Mo-N-Cu 박막의 표면 및 단면에 대한 FE-SEM 분석을 통하여 전형적인 주상구조를 지닌 MoN 박막에서 Cu 함량이 증가할수록 Mo-N-Cu 박막의 결정성을 방해하는 것을 확인하였다. 또한 XRD 분석을 통하여 박막의 결정 구조 분석을 하였고, Nano Indentor를 통하여 30 GPa 수준의 고경도를 지닌 박막이 형성됨을 확인하였다. 박막의 내마모 특성 평가를 위해 ball-on-disk 트라이보미터를 활용하여 마찰계수 평가를 수행하였고, Cu 함유량의 변화에 따라 마찰계수가 MoN 박막의 경우 0.8에서 Cu 함량이 5 at.%에서 0.15로 급격하게 낮아짐을 확인하였다.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.484-488
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• 2007

Mo(Ti) alloy and pure Cu thin films were subsequently deposited on $SiO_2-coated$ Si wafers, resulting in $Cu/Mo(Ti)/SiO_2$ structures. The multi-structures have been annealed in vacuum at $100-600^{\circ}C$ for 30 min to investigate the outdiffusion of Ti to Cu surface. Annealing at high temperature allowed the outdiffusion of Ti from the Mo(Ti) alloy underlayer to the Cu surface and then forming $TiO_2$ on the surface, which protected the Cu surface against $SiH_4＋NH_3$ plasma during the deposition of $Si_3N_4$ on Cu. The formation of $TiO_2$ layer on the Cu surface was a strong function of annealing temperature and Ti concentration in Mo(Ti) underlayer. Significant outdiffusion of Ti started to occur at $400^{\circ}C$ when the Ti concentration in Mo(Ti) alloy was higher than 60 at.%. This resulted in the formation of $TiO_2/Cu/Mo(Ti)\;alloy/SiO_2$ structures. We have employed the as-deposited Cu/Mo(Ti) alloy and the $500^{\circ}C-annealed$ Cu/Mo(Ti) alloy as gate electrodes to fabricate TFT devices, and then measured the electrical characteristics. The $500^{\circ}C$ annealed Cu/Mo($Ti{\geq}60at.%$) gate electrode TFT showed the excellent electrical characteristics ($mobility\;=\;0.488\;-\;0.505\;cm^2/Vs$, on/off $ratio\;=\;2{\times}10^5-1.85{\times}10^6$, subthreshold = 0.733.1.13 V/decade), indicating that the use of Ti-rich($Ti{\geq}60at.%$) alloy underlayer effectively passivated the Cu surface as a result of the formation of $TiO_2$ on the Cu grain boundaries.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.11
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• pp.1600-1604
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• 2017

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.

• Journal of the Korean institute of surface engineering
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• v.53 no.6
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• pp.343-350
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• 2020

The degradation of mechanical properties of nitride coatings to steel substrates is one of the main challenges for industrial applications. In this study, plasma nitriding treatment was used in order to increase the mechanical properties of Mo-Cu-N coating to the H13 tool steel. The nanostructured Mo-Cu-N coating was deposited using pulsed DC magnetron sputtering method with a single alloy Mo-Cu target. Mechanical properties of MoN-Cu coated samples after nitriding were found to be relatively better than non-nitrided MoN-Cu coating.

• Journal of the Korean Magnetics Society
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• v.21 no.4
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• pp.132-135
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• 2011

The exchange bias field ($H_{EX}$) and the coercivity ($H_C$) variation and change depending on the thickness of intermediately super-soft magnetic NiFeCuMo layer with different thickness of the bottom NiFe layer were investigated. The $H_{EX}$ of triple pinned NiFe(4 nm)/NiFeCuMo($t_{NiFeCuMo}$= 1 nm)/NiFe(4 nm)/FeMn multilayer has the maximum value more less than one of single pinned NiFe(8 nm)/FeMn layer. If NiFeCuMo layer is inserted each into between the pinned and free NiFe layers, we can be used as GMR-SV device for a bio-sensor that has improved magnetic sensitivity.