• 한국초전도학회:학술대회논문집
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• v.10
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• pp.201-206
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• 2000

Effects of the post-annealing temperature of CeO$_2$ buffer layers on the properties of YBCO films on CeO$_2$-buffered sapphire were investigated. 45 nm-thick CeO$_2$ buffer layer was prepared in-situ on r-cut sapphire using an on-axis rf magnetron sputtering method, which was later post-annealed at temperatures between 950$^{\circ}$C and 1100$^{\circ}$C in an oxygen-flowing environment. YBCO films were prepared on CeO$_2$-buffered sapphire (CbS), for which the surface morphology, crystal structures and electrical properties of the YBCO films were studied. YBCO films on post-annealed CbS appeared to have better properties than those on as-grown CbS with regard to the morphological, structural and electrical properties when the YBCO films were prepared on CeO$_2$ buffer layer post-annealed at temperatures of 1000 - 1050$^{\circ}$C. A TE$_{011}$ mode rutileloaded cylindrical cavity resonators was fabricated with the YBCO films placed as the endplates, for which the unloaded Q of the resonator was measured. It turned out that the resonator with the endplates prepared from the YBCO films on postannealed CbS at 1000 $^{\circ}$C showed the highest unloaded Q with the value more than 8 ${\times}$ 10$^5$ at 30 K and 8.6 CHz, revealing that the YBCO films on post-annealed CbS at 1000$^{\circ}$C the temperature could be the lowest among the YBCO films on post-annealed CbS.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.2 no.3
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• pp.10-16
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• 1991

The error networks due to the measuring systems and the test fixture must be previously calibrated in order to characterize the microwave devices. In this paper, it is presented a new method to characterize the error networks in which only two different microstrip lines are used for the calibration. Once each length of two calibrat- ing microstrip lines is accurately defined, the calibrated data can be easily obtained without acknowledgement for the propagation constant. The end effect is not considered when fabricated the microstrip lines used to calibration. The ATF13736 GaAs MESFET is characterized by means of the calibrating procedure with this method. The range of measuring frequency is 2 to 18 GHz, and the bias voltage and current are $V_{DS}$ =2.5V, $I_{DS}$ =20mA, respectively. Compared the calibrated data with data sheet, it is showed that the magnitude is nearly agreed with each other and the phase is deviated by 0.1 to 12 degrees in lower frequencies.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.5
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• pp.541-548
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• 2013

This paper presents a vector network analysis system for 2-port scattering parameters of microwave devices using some basic microwave instruments/devices such as signal generators, vector voltmeter, directional couplers and frequency mixers. The analytical model and implementation method for scattering parameter measurements - which can replace the vector network analyzers - are presented. The performance of the implemented system is evaluated through 1- and 2-port scattering parameter measurements, respectively. The vector volt signals which determine the scattering parameters are detected in two distinct methods depending on the frequency band of interests; a direct-detection method with a single signal generator and vector voltmeter for relatively low band and a heterodyne method to frequency down-mix associated with an additional signal source as well as frequency mixers for high band are used, respectively. Using these two methods, scattering parameters of UHF and X bands are evaluated and their performances are verified through a comercial vector network analyzer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.349-349
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• 2008

유비쿼터스 시대를 맞이하여 현재의 전자제품은 고주파 환경에서의 소형화된 마이크로파 소자를 요구하고 있다. 현재 구현되고 있는 마이크로파 소자의 형태는 여러 가지 전송선로 중에 하나로서 금속의 그라운드면 위에 유전체 막을 형성하고 그 위에 금속선을 정밀하게 패터닝하여 각 종 소자를 연결하는 microstrip line의 형태가 많이 사용된다. 이러한 microstrip line 형태의 소자를 설계할 시에 소자 자체의 구조나 유전체 막이 그 소자의 성능을 크게 좌우한다. 여기서 유전체 막은 신호선과 그라운드면 간의 전자파를 집중시켜주어 방사손실을 줄여주는 역할을 한다. 유전체 막의 두께는 소자의 전체적인 크기를 결정하는 요인이 된다. 이는 유전체 막의 두께가 감소할 경우 50 $\Omega$ 임피던스 매칭을 위해 막 위에 형성되는 소자들의 선폭도 동시에 줄여야 하므로 소자의 소형화도 가능 하여진다. 하지만 유전체 막의 두께가 감소할 경우 전자파가 유전체 막에 집중되지 못하여 방사손실이 커지게 되고 소자의 성능이 저하된다. 이런 점을 고려할 때 소자의 소형화를 만족시키면서 동시에 소자의 성능을 유지할 수 있는 유전체 막의 최적화 두께에 대한 연구가 필요하다. 볼 연구에서는 유전체 막의 최적화 두께를 제시하기 위해 대표적 마이크로파 소자인 Edge-Coupled Filter에 대하여 3-D Electromagnetic Simulator로 설계하고 유전체 막의 두께와 Filter 성능 간의 관계를 연구하였다. Filter의 성능은 유지하도록 하면서 유전체 막의 두께를 감소시켜 나간 결과, 약 30 ~ 40 ${\mu}m$ 의 최적화 두께를 얻을 수 있었다. 한편 30 ~ 40 ${\mu}m$ 두께의 후막 공정을 고려할 때 기존의 성막공정으로는 성막시간, 공정의 난이도, 공정온도 등의 면에서 난점이 존재하며 이러한 점들을 극복할 수 있는 Aerosol Deposition Method의 적용 가능성에 대해서 연구하였다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.8
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• pp.967-975
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• 2012

This paper presents a method to measure reflection coefficients of microwave devices or antennas based on time domain analysis with sampling oscilloscopes. The reflection coefficients were extracted by the Fourier transformation of echo pulses from devices with respect to the 20 GHz incident pulse signals. The three-error terms, which are commonly used for the correction of a microwave network, were determined using a 3.5 mm calibration kit. In addition, a modified error-correction model associated with a directional coupler for reflection coefficient measurements is introduced. The results were compared with those of measured with a commercial vector network analyzer.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.11 no.3
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• pp.153-163
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• 1986

GaAs, one of the III-V compounding semicondnctors, has been widely employed as base materials for the fabrication of the ultra-high-speed devices in the filelds of DBS, optical communications, MMIC'S and digital IC'S. There have been some reports on 4Kx4bit SRAM by D/E MESFET'S, 4K bit SRAM by HEMT'S, and receiver front ends for X-band by MMIC technologies, respectively. This paper reviews GaAs materials, wafer fabrication processes, device applications, and design aspects, and, finally, descusses the future of the ultra-high-spped-devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1021-1023
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• 2003

We studied field-emission characteristics of CNTs under various pre-treatment with $NH_{3}$ plasma on the substrate. The turn-on electric field is the lowest value and field enhancement factor (${\beta}$) is he highest value in CNTs pre-treated by $NH_3$ plasma (80 W and 5 min). The field-emission property of CNTs grown on the Ta substrate is slightly better than on the W substrate.

• ETRI Journal
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• v.25 no.1
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• pp.19-24
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• 2003

This paper describes the performance of a Ku-band 5-bit monolithic phase shifter with metal semiconductor field effect transistor (MESFET) switches and the implementation of a ceramic packaged phase shifter for phase array antennas. Using compensation resistors reduced the insertion loss variation of the phase shifter. Measurement of the 5-bit phase shifter with a monolithic microwave integrated circuit demonstrated a phase error of less than $7.5{\circ}$ root-mean-square (RMS) and an insertion loss variation of less than 0.9 dB RMS for 13 to 15 GHz. For all 32 states of the developed 5-bit phase shifter, the insertion losses were $8.2{\pm}1.4$dB, the input return losses were higher than 7.7 dB, and the output return losses were higher than 6.8 dB for 13 to 15 GHz. The chip size of the 5- bit monolithic phase shifter with a digital circuit for controlling all five bits was 2.35 mm ${\times}$1.65 mm. The packaged phase shifter demonstrated a phase error of less than $11.3{\circ}$ RMS, measured insertion losses of 12.2 ${\pm}$2.2 dB, and an insertion loss variation of 1.0 dB RMS for 13 to 15 GHz. For all 32 states, the input return losses were higher than 5.0 dB and the output return losses were higher than 6.2 dB for 13 to 15 GHz. The size of the packaged phase shifter was 7.20 mm${\times}$ 6.20 mm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.14-17
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• 1995

In this study, fur the use of portable communication multilayer devices. 0.15wt% V$_2$O$\_$5/ added BiNbO$_4$which is low-fire microwave dielectric ceramic as able to co-fire with high conductors was made into specimens with the additions of Cr$_2$O$_3$0.04, 0.2, 0.4, 0.8, 1.2wt%. These specimens were sintered at 930, 960. 990, 1030$^{\circ}C$ respectively to make the microwave dielectric resonators. These resonators were investigated by measuring the structure and dielectric properties. The density of the specimens was increased by the amounts of the Cr$_2$O$_3$and increased by increasing the temperature. 0.8wt% Cr$_2$O$_3$added and sintered at 960$^{\circ}C$ specimen skewed 49 dielectric constant. Q$.$f values were increased by the amounts of Cr$_2$O$_3$. And Q value was deteriorated by the additions of Cr$_2$O$_3$at sufficiently sintered temperatures. Negative resonant temperature coefficients were moved to positive by the amounts of Cr$_2$O$_3$and returned negative again at 1.2wt%. Temperature characteristics were deteriorated at 1030$^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.236-238
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• 1997

A cellular power amplifier using an APCVD(Atmospheric Pressure Chemical Vapor Deposition)-grown SiGe base HBT of ETRI has been designed with a linear simulation CAD. The Si/SiGe HBT with an emitter area of 2$\times$8${\mu}{\textrm}{m}$$^2$typically has a cutoff frequency(f$_{T}$) of 7.0 GHz and a maximum oscillation frequency(f$_{max}$) of 16.1 GHz with a pad de-embedding A packaged power Si/SiGe HBT with an emitter area of 2$\times$8$\times$80${\mu}{\textrm}{m}$$^2$typically shows a f$_{T}$ of 4.7 GHz and a f$_{max}$ of 7.1 GHz at a collector current (Ic) of 115 mA. The power amplifier exhibits a Forward transmission coefficient(S21) of 13.5 dB, an input and an output reflection coefficients of -42 dB and -45 dB respectively. Up to now the III-V compound semiconductor devices hale dominated microwave applications, however a rapid progress in Si-based technology make the advent of the Si/SiGe HBT which is promising in low to even higher microwave range because of lower cost and relatively higher reproducibility of a Si-based process.ess.ess.