• Membrane and Water Treatment
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• 제13권1호
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• pp.21-28
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• 2022

The use of plastics in our everyday lives have been drastically increased during the last few decades. However with the usage of commercial plastic products there is a possibility of microplastic consumption, due to the fragmentation of the products. Additionally, the potential for microplastic ingestion may also be increased by using damaged products. Hence, the current study was conducted to understand the potential release of micro/nano plastics and organic matter from damaged teabags. To check the leakage tendency, the amount of damage to the tea bags from 1-10 cm were tested along with temperatures of 25-70℃, and exposure times from 5 min to 1 hr was tested. Release of fibrous micro/nanoplastics, and organic leachate from the damaged teabags were observed to understand the outflow conditions. Results showed that with the increased degree of damage, temperature, and exposure time increased the release of fiberous matter, where the increase of temperature, and exposure time increased organic leachate. Additional analysis confirmed the leachate of nylon polymers into the heated water.

• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• Corrosion Science and Technology
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• 제19권4호
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• pp.224-230
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• 2020

Stainless steel has excellent corrosion resistance. The drawback is that pitting occurs easily due to the concentration of chloride. In addition, corrosion of socket weld, which is structurally and chemically weaker than the other components of the pipe, occurs rapidly. Since these two phenomena overlap, pinhole leakage occurs frequently in the seawater pipe socket welds made of stainless steel at the power plants. To analyze this specific corrosion, a metallurgical analysis of the stainless steel socket welds, where the actual corrosion occurred during the power plant operation, was performed. The micro-structure and chemical composition of each socket weld were analyzed. In addition, selective corrosion of the specific micro-structure in a mixed dendrite structure comprising γ-austenite (gamma-phase iron) and δ-ferrite (iron at high temperature) was investigated based on the characteristic micro-morphology and chemical composition of the corroded area. Finally, the different corrosion stages and characteristics of socket weld corrosion are summarized.

• Current Photovoltaic Research
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• 제2권1호
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• pp.8-13
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• 2014

ZnSe/$Zn_3P_2$ heterojunctions with a substrate configuration were fabricated using a series of cost-effective processes. Thin films of ZnTe and $Zn_3P_2$ were successively grown by close-spaced sublimation onto Mo-coated glass substrates. ZnSe layers thinner than 100nm were formed by annealing the $Zn_3P_2$ films in selenium vapor. Surface selenization generated a high density of micro-cracks which, along with voids, provided shunt paths and severely deteriorated the diode characteristics. Annealing the $Zn_3P_2$ film at $300^{\circ}C$ in a $ZnCl_2$ atmosphere before surface selenization produced a dense microstructure and prevented micro-crack generation. The mechanism of micro-crack generation by the selenization was described and the suppression effect of $ZnCl_2$ treatment on the micro-crack generation was explained. ZnSe/$Zn_3P_2$ heterojunctions with low leakage current ($J_0$ < $1{\mu}A/cm^2$) were obtained using an optimized surface selenization process with $ZnCl_2$ treatment. However, the series resistance was very high due to the presence of an electrical barrier between the ZnTe and $Zn_3P_2$ layers.

• 비파괴검사학회지
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• 제21권2호
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• pp.197-203
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• 2001

항공기나 대형 플랜트 등의 경년구조물에 있어서 제조 및 설계 혹은 작업환경 등에 의해 발생하는 미소결함은 응력부식파괴로 이어지는 결정적인 원인으로 알려져 있다. 따라서 제조단계에서의 결함의 검출뿐만 아니라 운전개지 후에 있어서도 비파괴검사에 기초를 둔 정기적인 건전성평가가 요구된다. 특히 구조물내의 미소균열 평가는 구조건전성 평가에 있어서 중요한 과제라 할 수 있다. 자기광학소자를 이용한 비파괴탐상법은 균열부근의 누설자속에 의한 자구 및 자벽의 변화를 이용하여 균열정보를 화상형태로 얻는다. 그러므로 빠른 탐상속도와 결과데이터 해석의 용이 그리고 실시간적으로 탐상결과를 획득할 수 있다는 장점을 지니고 있다. 본 논문은 자기광학소자를 이용한 새로운 비파괴적 탐상법을 제안하고, 본 탐상법을 이용하여 구조물에 존재하는 표면결함의 검출가능성 및 균열깊이의 평가를 실증하였다. 표면결함을 갖는 시험편과 파이프의 내면에 존재하는 피로균열을 대상으로 실험을 실시한 결과, 표면결함의 위치 및 2차원적 형상을 화상형식으로 얻을 수 있음을 증명하였다. 또한 피로시험중의 시험편을 대상으로 균열발생 및 균열진전과정을 평가를 통하여 원격탐상의 가능성을 제시하였다.

• 대한전자공학회논문지TC
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• 제39권11호
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• pp.40-46
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• 2002

본 논문에서는 CPW MMIC 실장시 발생되는 기생 공진 현상을 제거하기 위한 새로운 구조의 실리콘 MEMS 패키지를 제안하였다. 또한 세 가지 형태의 실리콘 칩 캐리어(gold-plated high resistivity, lightly doped, high resistivity) 상에 GaAs CPW 패턴을 제작하고 해석/측정함으로써, 제안된 패키지의 성능을 확인하였다. 해석 및 측정 결과 제안된 MEMS 패키지는 비저항이(resistivity) 15 ${\Omega}{\cdot}$㎝인 실리콘 캐리어(carrier)를 사용함으로써 기생 공진 현상을 효과적으로 억제시킬 수 있었다.

• International Journal of Fluid Machinery and Systems
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• 제4권1호
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• pp.67-75
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• 2011

Recent results are presented concerning the development of magnetofluidic leakage-free rotating seals for vacuum and high pressure gases, evidencing significant advantages compared to mechanical seals. The micro-pilot scale production of various types of magnetizable sealing fluids is shortly reviewed, in particular the main steps of the chemical synthesis of magnetic nanofluids and magnetic composite fluids with light hydrocarbon, mineral oil and synthetic oil carrier liquids. Design concepts and some constructive details of the magnetofluidic seals are discussed in order to obtain high sealing capacity. Different types of magnetofluidic sealing systems and applications are reviewed. Testing procedures and equipment are presented, as well as the sealing capabilities of different types of magnetizable fluids.

• 한국재료학회지
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• 제20권7호
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• pp.374-378
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• 2010

$MgTiO_3$ thin films were prepared by r.f. magnetron sputtering in order to prepare miniaturized NPO type MLCCs. $MgTiO_3$ films showed a polycrystalline structure of ilmenite characterized by the appearance of (110) and (202) peaks. The intensity of the peaks decreased with an increase in the chamber pressure due to the decrease of crystallinity which resulted from the decrease of kinetic energy of the sputtered atoms. The films annealed at $600^{\circ}C$ for 60min. showed a fine grained microstructure without micro-cracks. The grain size and roughness of the $MgTiO_3$ films decreased with the increase of chamber pressure. The average surface roughness was 1.425~0.313 nm for $MgTiO_3$ films prepared at 10~70 mTorr. $MgTiO_3$ films showed a dielectric constant of 17~19.7 and a dissipation factor of 2.1~4.9% at 1MHz. The dielectric constant of the films is similar to that of bulk ceramics. The dielectric constant and the dissipation factor decreased with the increase of the chamber pressure due to the decrease of grain size and crystallinity. The leakage current density was $10^{-5}\sim10^{-7}A/cm^2$ at 200kV/cm and this value decreased with the increase of the chamber pressure. The small grain size and smooth surface microstructure of the films deposited at high chamber pressure resulted in a low leakage current density. $MgTiO_3$ films showed a near zero temperature coefficient and satisfied the specifications for NPO type materials. The dielectric properties of the $MgTiO_3$ thin films prepared by sputtering suggest the feasibility of their application for MLCCs.

• Restorative Dentistry and Endodontics
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• 제22권1호
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• pp.447-463
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• 1997

The purpose of this study was to evaluate the effectiveness of copal varnish and five bonding agents(Scotchbond Multi-Purpose Plus Dental Adhesive System, Panavia 21, All Bond 2, Superbond D-Liner II plus, Fuji Duet) in reducing microleakage under amalgam restorations. Class V cavity were prepared on both buccal and lingual surface of sixty extracted human molars with cementum margin and were filled with different kinds of liners and amalgam. All teeth were stored at $37^{\circ}C$ in physiologic saline solution. After 1 week they were thermally stressed for 500 cycles between 5 and $55^{\circ}C$ in baths containing 0.5 % basic fuchsin dye. The dye penetrations were observed with a stereomicroscope. Scanning electron micrographs were taken of representative tooth sections from each group to assess the nature of the tooth/liner/amalgam interface. The statistical test were applied to the results using a one way analysis variance (ANOVA) and Duncan's multiple range test. The results were as follows ; 1. In all groups, the enamel margin showed significantly lower leakage value than the cementum margin (p<0.05). 2. At the dentin and enamel margins, the leakage value of Copalite-lined group showed significantly higher than that of no liner group (p<0.05), but showed significantly lower than that of bonding agent lined-groups (p<0.05). 3. There was no significant difference between the bonding agent lined-groups (p>0.05). 4. On the backscattered scanning electron microscopy observation, discontinuous gaps were observed between amalgam and dentin in the bonding agent-lined amalgam restorations and the bonding agents appeared to fill the gap space and were mixed with amalgam particles. At the amalgam/tooth interface, unsealed dentin and continuous gaps were found in both unlined and Copalite-lined restorations.

• 한국산업정보학회논문지
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• 제22권4호
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• pp.11-18
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• 2017

본 논문은 소비자에게 공급되는 수돗물의 공급시설(Water Supply Network)에 IoT 기술을 활용하여 소비자의 물 사용량을 원격으로 검침하고, 공급시설의 누수를 줄여서 원가를 절감하는 스마트 물관리(Smart Water Management) 기술의 적용효과를 검증하였다. SWM 실증모형은 수돗물 공급시설에 원격 누수감지센서, 스마트 미터링(Smart Metering), 초소형 멀티센서를 설치하고, 원격에서 운영현황을 실시간으로 감시하고 소비자에게 수돗물 사용량과 수질을 스마트폰 앱으로 제공하였다. 이때, 소비자가 수돗물 사용량 정보를 이용하여 수돗물을 아껴 쓰는지, 수돗물 수질정보를 이용하여 직접 음용하는지를 조사하였다. 특히, 본 연구에서는 SWM을 실증 적용함으로써 공급시설의 유수율 향상, 수돗물 음용률 향상, 소비자 민원 감소, 운영비용 절감, 수돗물 사용량 절감이 달성되는지를 검증하는데 목적이 있다. 또한 수돗물 공급시설의 IoT 센서, 운영자 모니터링 시스템, 이상발생시 탐사복구 솔루션이 융합된 하나의 SWM 모델을 수립하였으며, 관련 기술 개발을 통해 국내 물산업을 육성하고, SWM을 선진수준으로 확산하였다는데 의의가 있다고 하겠다.