• Journal of the Korean Society for Precision Engineering
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• v.32 no.1
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• pp.63-68
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• 2015

Micro/nano patterns for optical concentration and diffusion have been studied in the various fields such as displays, optics, and sensors. Conventional micro patterns were continuous and linear shapes due to using linear-type light sources, however, recently non-continuous patterns have been applied as point sources are used for dot-type light sources such as LEDs and OLEDs. In this study, a hybrid machining technology combining an indentation machining method and an AAO process was developed for manufacturing the non-continuous micro patterns having nano patterns. First, mirror-like surfaces ($R_a<20nm$) of pure Aluminum substrates were obtained by optimizing cutting conditions. Then, The letter of 'K' consisting of the arrays of the micro patterns was manufactured by the indentation machining method which has a similar principle to indentation hardness testing. Finally, nano patterns were machined by AAO process on the micro patterns. Conclusively, a specific letter having nano-micro hybrid patterns was manufactured in this study.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.227-228
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.167-168
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• 2010

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.05a
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• pp.51-55
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• 1999

Recently, manufacturing work has been transformed to advanced technology intensive form from mass production with a little items required in the past. It was demanded that superior workpiece surface integrity. However, the study of ductile mode machining was proceeded actively.In this paper, it is developed Ultra-Micro Indentation Device using the PZT actuator. Experimentally, by using theUltra-Micro Indentation device, the micro fracture behavior of the silicon wafer was invesgated. It was possible that ductile-brittle transition point in ultimate surface of brittle material can be detected by adding an acoustic emission sensor system to the Ultra-Micro Indentation apparatus.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.1
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• pp.75-84
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• 2003

In this paper, a new nano/micro-mechanical processing test machine was developed. This new test machine, which is based on the principle of the scanning force controlled probe microscope, can realize nano/micro-mechanical machining and in-process profile measurement. Experimental results of nano/micro indentation and scratching show that the controllable cutting depth of the test machine can be controlled by PZT actuator. Profile measurement of the machined surface has also been performed by using the test machine and a conventional AFM(Atomic Force Microscopy). A good agreement of the two measurement results have been achieved.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.1-6
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• 2018

Recently nano meter size pattern (sub-micro scale) can be machined mechanically using a diamond tool. Many studies have found a 'size effect' which referred to a specific cutting energy increase with the decrease in the uncut chip thickness at micro scale machining. A new analysis method was suggested in order to observe 'size effect' in nano scale machining and to verify the cause of the 'size effect' in this study. The diamond tool was indented to a vertical depth of 1,000nm depth in order to simplify the stress state and the normal force was measured continuously. The tip rounding was measured quantitatively by AFM. Based on the measurements and theoretical analysis, it was verified that the main cause of the 'size effect' in nano scale machining is geometrically necessary dislocations, one of the intrinsic material characteristics. st before tool failure.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.2
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• pp.198-202
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• 2015

We present a series of simple but novel nanopatterning methodologies inspired by traditional mechanical machining processes involving rolling, pullout, and forging. First, we introduce roll-to-roll nanopatterning, which adapts conventional rolling for continuous nanopatterning. Then, nano-inscribing and nano-channel lithography are demonstrated, whereby seamless nanogratings can be continuously pulled out, as in a pullout process. Finally, we discuss vibrational indentation micro- and nanopatterning. Similarly to the forging/indentation process, this technique employs high-frequency vertical vibration to indent periodic micro/nanogratings onto a horizontally fed substrate. We discuss the basic principles of each process, along with its advantages, disadvantages, and potential applications. Adopting mature and reliable traditional technologies for small-scale machining may allow continuous nanopatterning techniques to cope with scalable and low-cost nanomanufacturing in a more productive and trustworthy way.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.820-823
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• 2002

MEMS structures Generally have been fabricated using surface-machining, but the interface failure between silicon substrate and evaporated thin film frequently takes place due to difference of linear coefficient of thermal expansion. Therefore this paper studied the effect of the residual stress caused by variable external loads. This study did not analyzed accurate quantity of the residual stress but trend for the effect of residual stress. Several specimens were fabricated using other material(Al, Au and Cu) and thermal load was applied. The residual stress was measured by nano-indentation using AFM. The results showed the existence of the residual stress due to thermal load. The indentation area of the thermal loaded thin film reduced about 3.5% comparing with the virgin thin film caused by residual stress. The finite element analysis results are similar to indentation test.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.163-170
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• 2004

Atomic force microscope (AFM) techniques are increasingly used fur tribological studies of engineering surfaces at scales ranging from atomic and molecular to micro-scale. Recently, AFM with suitable tips is being used for nano fabrication/nano machining purposes. In this paper, machining characteristics of silicon were investigated by nano indentation and nano scratch. Nano-scale material removal mechanisms are studied and the Taguchi method was introduced to acquire optimum parameters for nano machining. Also, Acoustic Emission (AR) is used for the monitoring of nano machining.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.182-185
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• 2005

Indentation pattern and line pattern were machined on borosilicate(Pyrex 7740 glass) surface using the combination of mechanical machining by $Nanoi-indenter\circledR$ XP and HF wet etching, and a etch-mask effect of the affected layer of the nano-scratched and indented Pyrex 7740 glass surface was investigated. In this study, effects of indentation and scratch process with etching time on the morphologies of the indented and scratched surfaces after isotropic etching were investigated from an angle of deformation energies.