• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.2
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• pp.104-111
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• 2004

Ultrasonic machining is a non-thermal, non-chemical, md non-electorial material removal process, and thus results in minimum modifications in mechanical properties of the brittle material during the process. Also, ultrasonic machining is a non-contact process that utilize ultrasonic vibration to impact a brittle material. In this research characteristics of micro-hole machining for brittle materials by ultrasonic machining(USM) process have been investigated. And the effect of ultrasonic vibration on the machining conditions is analyzed when machining fir non-conductive brittle materials using tungsten carbide tools with a view to improve form and machining accuracy.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.149-156
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• 2017

Graphene nanoplatelet (GNP)-reinforced alumina ($Al_2O_3$) is a promising material for micro-partapplications, particularly micro-nozzle shapes, because of its excellent wearresistance. In this study, a $Al_2O_3$/GNPcomposite with 15 vol% graphene nanoplatelets (GNP) was highly densified and fabricated via spark plasma sintering for micro-electrical discharge drilling (Micro-ED drilling) and the wear resistance property of the composite is evaluated via the ball-on-disk method. In addition, the diameter and shape of the micro-electrodes machined by wire electrical discharge grinding (WEDG), block electrical discharge grinding (BEDG), and new linear block moving electrical discharge grinding (LBMEDG) methods are systematically compared and analyzed to observe the micro-hole machining in the micro-ED drilling of the $Al_2O_3$/15vol% GNP composite.

• Laser Solutions
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• v.9 no.1
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• pp.17-23
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• 2006

The technologies of laser micromachining are changed toward more complex-micropatterning, from the micro circle-shaped hole drilling to the micro arbitrary-shaped hole drilling. In this paper, the fundamental experiments by using DPSS 3rd harmonic $Nd:YVO_4\;laser({\lambda}=355nm)$ were carried out in order to obtain the feasibility of flexible micropatterning by various fixed masks. Fixed masks and Galvano scanners were investigatde to make micro patterns. from these experimental results, micropatterns on PEN film were rapidly manufactured in large area.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.1
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• pp.22-28
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• 1995

Micro Drills have found ever wider application. However micro drilling is a machining to integrate the difficult machinablities such as tool stiffness, position control and revolution accuracy, and is known to cost and time consuming. So, this study aimed to practice ultraminiature drilling(0.05 .phi. ) wiht simple component, if possible. System is developed as the three modules : feed drives, spindle and monitoring part. The dynamics of measured current signals from the spindle of Micro Hole Drilling machine are investigated to establish the criteria of stepfeed mechanism. Cutting experiments identify the relationship of spindle rpm, feed rate and tool life. The smaller drill diameter is, the more suitable cutting condition have to be selected because of chip packing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.285-286
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• 2007

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.2
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• pp.75-80
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• 2013

Cathode is an essential component used in plasma etching process which is to make micro pattern on the silicon wafer. The currently used cathodes produce particles at the high temperature plasma etching process. To overcome this problem, a 'Silicon Only Cathode' was developed. This 'Silicon Only Cathode' requires manufacturing process changes due to the change of shapes, material features, and machining characteristics of work materials. This research investigates the small hole drilling process. The conclusion is that PCD drills with twist angles of $20^{\circ}$ and $25^{\circ}$ were tested for small hole drilling and the experimental results indicate that the drill with $25^{\circ}$ twist angle drill causes less thrust force.

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.42-45
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• 2004

Electrochemical discharge machining (ECDM) has been found to be suitable for the micro-hole machining of nonconductive materials such as ceramics or glass compared with existing conventional and also non-conventional machining methods. However this machining process has some problems such as low geometric accuracy and low machining efficiency due to the random spark generation at the end of the electrode. This paper proposes the methods to improve the geometric accuracy of micro-hole using powder mixed ECDM process. The experimental results show the effects of powder producing improved geometric accuracy of machined hole and decreased concentration of spark energy.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.6
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• pp.119-126
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• 2014

Micro-holes of conductive ceramic are required in micro structures. Micro-electrical discharge machining (Micro-EDM) is an effective machining method since EDM is as process for shaping hard metals and complex-shaped holes by spark erosion in all kinds of electro-conductive materials. However, as the depth of micro hole increases, the machining condition becomes more unstable due to inefficient removal of debris between the electrode and the workpiece. In this paper, micro-EDM was performed to evaluate machining characteristic such as electrode wear, machining time, taper angle, radial clearance with varying voltage and ultrasonic vibration on 10 vol.% Carbon-nanotube reinforced conductive $Al_2O_3$ composite fabricated by spark plasma sintering in previous research.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.873-877
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• 2005

The burr of micro drilling and micro cutting on thin metal film is a major obstacle to mass production for micro PCB boards in micro technologies of personal computing and telecom explosion. As the burr affects on the assembling process, it is necessary to study continuously on control or elimination of the burr. In order to get higher valued products, it is also needed to competitive techniques with the high resolution. In this paper, we studied experimentally the burr generation that when it is processed on the copper foil by laser in micro-hole machining. Unlike mechanical machining the burr produced on substrate is a resultants of melt and re-solidification of a melten metal which was heated and treated by laser. And higher laser energy increases the size of burr. Therefor in micro-drilling with laser, it is difficult to reduce the effects of burr for very thin metal sheets. We investigated the stale of the burr and analyzed the laser ablation Cu micro machining with respect to laser intensity and processing time.