Blind Via Hole Drilling Using DPSS UV laser

DPSS UV 레이저를 이용한 블라인드 비아 홀 가공

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.