• 한국재료학회지
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• 제13권1호
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• pp.6-10
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• 2003

Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.

• 한국정밀공학회지
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• 제20권9호
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• pp.109-117
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• 2003

With development of high advanced technologies and skills, micro machining techniques also are being more functional and smaller. Some of the recently developed micro machining technologies are micro drilling, micro EDM, WEDG, LBM, micro milling, micro UVM etc. In these micro machining techniques, Micro -EDM is generally used for machining micro holes, pockets, and micro structures in difficult-cut-materials. For machining micro structures, first of all, tool electrode should be fabricated by WEDG process. In micro-EDM, parameters such as peak current, pulse width, duration time are very important to fabricate the tool electrode and micro structures. Developed experimental equipments are composed of RLC circuit with PWM. In this paper, using developed micro EDM machine, the characteristics of micro electro discharge machining are investigated at micro holes, slot, and pocket machining etc. Also the trends of tool wear are investigated in case of hole and slot machining.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.999-1002
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• 2002

In this research, the mechanism of micro-ECM was investigated with potentiodynamic method and the optimal condition for micro-ECM was selected by voltage-current-time curve with potentiostatic method. From the experimental result. it was confirmed that anodic voltage curve could be used very effectively for determining the optimal condition of micro-ECM, and the micro part which has extremely fine surface could be fabricated by use of micro-ECM with point electrode method.

• Asian Journal of Business Environment
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• 제3권1호
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• pp.5-16
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• 2013

Purpose - Micro-finance institutions (MFIs) are critical to Vietnam's quest for poverty alleviation among the poor in the rural and agrarian communities. The current study attempts to investigate the impact of microfinance outreach programs undertaken by formal and semi-formal MFIs in Vietnam targeting the poor rural and agrarian communities. Research design, data, methodology - An enquiry was made as to whether the poor and rural communities accessed the micro credit offered by Government supported MFIs and NGOs through their microfinance outreach programs. Furthermore, the current study attempted to explore if the current mode of operations adopted by MFIs in Vietnam is sustainable. Results -The findings indicate that significant progress has been made in Vietnam to alleviate poverty among the poor rural communities through micro finance outreach programs. Conclusions - There are also pointers of MFIs sustainability in Vietnam. However, it still remains to be seen if the current sustainability pointers are long lasting without government subsidies or some international organizations financial support to microfinance outreach programs.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.24-26
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• 2003

In this study EB(Electron Beam) welder was modified to apply EB welder to micro-joining with solder ball and Pt wire. The power and beam current of EB welder is 6kW, 100mA and the minimum current was 1mA. The minimum current of EB welder was modified to decrease the amount of beam current to 0.0lmA and the monitoring system to observe materials was made up. The control system and CAD/CAM software for e-beam direct writing was developed and the deflection beam was controlled without moving workpieces. the possibility of applying EB welder to micro-joining with solder ball and Pt wire was studied through this experiments.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권9호
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• pp.662-664
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• 1999

We fabricated AC-TFEL device having cone-shaped Si micro-tip reflector array based on the process which have been conventionally employed for the Si-tip field emitter array in FED system. As a result, the AC-TFEL device having a new geometrical structure could generate well concentrated visible white-light from 3600 reflectors/pixel under bipolar pulse excitation mode only by edge-emission mechanism.

• 한국정밀공학회지
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• 제12권1호
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• pp.22-28
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• 1995

Micro Drills have found ever wider application. However micro drilling is a machining to integrate the difficult machinablities such as tool stiffness, position control and revolution accuracy, and is known to cost and time consuming. So, this study aimed to practice ultraminiature drilling(0.05 .phi. ) wiht simple component, if possible. System is developed as the three modules : feed drives, spindle and monitoring part. The dynamics of measured current signals from the spindle of Micro Hole Drilling machine are investigated to establish the criteria of stepfeed mechanism. Cutting experiments identify the relationship of spindle rpm, feed rate and tool life. The smaller drill diameter is, the more suitable cutting condition have to be selected because of chip packing.

• Transactions on Electrical and Electronic Materials
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• 제1권1호
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• pp.40-44
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• 2000

Metal-ferroelectric-insulator-semoiconductor field effect transistor (MFISFETs) were fabricated using CMOS processes. The Pt/SBT/NO combined layers were etched for forming a conformal gate by using Ti/Cr metal masks and a two step etching method, By the method, we were able to fabricate a small-sized gate with the dimension of $16/4{\mu}textrm{m}$ in the width/length of gate. It has been chosen the non-self aligned source and drain implantation process, We have deposited inter-layer dielectrics(ILD) by low pressure chemical vapor deposition(LPCVD) at $380^{circ}C$ after etching the gate structure and the threshold voltage of p-channel MFISFETs were about 1.0 and -2.1V, respectively. It was also observed that the current difference between the $I_{ON}$(on current) and $I_{OFF}$(off current) that is very important in sensing margin, is more that 100 times in $I_{D}-V_{G}$ hysteresis curve.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.383-383
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• 2011

Generally, field emitters can be categorized into two types according to the emitter shape, one is a planar field emitter and the other is a point emitter. The planar field emitter is used for displays, flat lamps and signage boards. On the other hands, the point field emitter is expected to play a significant role in x-ray sources and electron beam sources. Such applications of the point field emitters, especially, need large emission current and high emission stability with a small electron beam size. A few reports announced point emitters made by carbon nanotubes (CNTs). However, they still have suffered from poor reproducibility and low emission current. Here, we demonstrated high performance CNT point emitters by attaching CNTs onto graphite rod. Graphite rod exhibited good electrical conductivity and chemical stability. In this method, the shape of the point emitter could be easily controlled by changing the length and diameter of the graphite rod. The CNT point emitter showed emission current over 1 mA at an applied electric field of 1.4 V/${\mu}m$. We consider that the stable emission performance is attributed to the stable contact between CNTs and graphite rod.

• Journal of Electrical Engineering and Technology
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• 제13권4호
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• pp.1425-1437
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• 2018

In this paper, a methodology was proposed to reduce the electrical level and spatial size of the smart grid with distributed generations (DGs) to a scale in which the electrical phenomena and control strategies for disturbances on the smart grid could be safely and freely experimented and observed. Based on the design methodology, a micro smart grid simulator with a substation transformer capacity of 190VA, voltage level of 19V, maximum breaking current of 20A and size of $2{\times}2m^2$ was designed by reducing the substation transformer capacity of 45MVA, voltage level of 23kV and area of $2{\times}2km^2$ of the smart grid to over one thousandth, and also reducing the maximum breaking current of 12kA of the smart grid to 1/600. It was verified that the proposed design methodology and designed micro smart grid simulator were very effective by identifying how all of the fault currents are limited to within the maximum breaking current of 20A, and by confirming that the maximum error between the fault currents obtained from the fault analysis method and the simulation method is within 1.8% through the EMTP-RV simulation results to the micro smart grid simulator model.