• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2003년도 유체기계 연구개발 발표회 논문집
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• pp.662-667
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• 2003

This paper presents a performance analysis of the 1st generation bump foil journal bearings for the micro gas turbine TG75. Static performances such as load capacity and attitude angle are estimated by using soft elasto-hydrodynamic analysis technique, and dynamic performances such as stiffness and damping coefficients are estimated by perturbation method. Rotordynamic analysis for TG75 is performed by using the bearing analysis results. TG75 rotor has 2 horizontal and vertical directional natural modes due to the bearing stiffness characteristics. TG75 rotor will be stably operated between the 1st bending mode at 33000cpm and the 2nd bending mode at 85500cpm. Unbalance response analysis results satisfy the API vibration criteria.

• 한국재료학회지
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• 제12권9호
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• 전자공학회지
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• 제36권9호
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• pp.61-69
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• 2009

본 기고에서는 반도체 3D IC에서 저전력, 고속 신호 전송을 가능하게 하는 다양한 인터페이스 기술에 대하여 알아보았다. Micro-bump나 TSV와 같이 유선으로 신호를 전송하는 방법과, capacitance나 inductance coupling을 이용하여 무선으로 전송하는 기술을 살펴보았다. 최근 TSV 공정 기술이 많이 발전하여, 앞으로 TSV 인터페이스에 기반한 3D IC가 많이 나올 것으로 기대된다. 무선 인터페이스를 사용할 경우, 특히 inductance coupling을 이용한 경우, 낮은 vdd로도 신호전송이 가능하고, pulse width를 줄일 수 있으며, ESD 보호회로가 필요없어, 저전력으로 신호를 전송할 수 있다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• 동력기계공학회지
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• 제20권5호
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• pp.5-13
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• 2016

This study is on wear damage of the material for a molding machine that be used at finally cutting of metal beam made in roll forming process of vehicle bump beam process line. SKD11 steel was used with the material for cutting mold jig. In the cutting mold jig, Ti diffusion heat treatment after vacuum heat treatment was carried out for upgrade of surface hardness and anti-wear. Also, the heat treatments by various methods were performed to compare the wear damage degree against above the existing heat treatment. Wear loss and friction coefficient were obtained from wear test. And, micro Vickers hardness values were compared with damaged parts or not of cutting mold jig. Micro Vickers hardness value appeared higher at the undamaged part by Ti diffusion heat treatment. The micro Vickers hardness well followed a two-parameter Weibull probability distribution.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.661-662
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• 2006

This research is on a laser soldering using the micro solder-balls used in flip chip packaging process. A laser source used in laser soldering is Nd:YAG laser(250W and 60W). Solder-balls of 100, 300, $500{\mu}m$ size are used in experiments. The laser head to deliver a laser beam and the nozzle to transfer solder-balls are manufactured to bump solder-balls. After soldering solder-balls the shear test is carried out to determine the wetting at the interface between the surface and a solder-balls With the results of solder bumping tests a laminated molding is accomplished for manufacturing the three dimensional molding.

• 대한전자공학회논문지SD
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• 제39권11호
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• pp.7-13
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• 2002

적외선 열 영상 system에서 가장 핵심이 되는 BSCT 320X240 IRFPA를 구현하였다. 검출기 module은 두 개의 부분, 즉 적외선 감지 pixel의 array와 감지된 신호를 읽어내는 ROIC로 구성된다. 50-${\mu}m$의 pitch와 95-%의 fill-factor를 만족하도록, laser scriber공정과 10-${\mu}m$ 크기의 ball을 갖는 micro bump공정을 적용하였다. ROIC는 선택된 신호를 읽어서 순차적으로 출력하게 설계되었으며, 단일 transistor amplifier, HPF, tunable LPF 그리고 clamp circuit를 삽입하여 SNR이 개선되도록 설계하였다. Detector와 ROIC의 결합으로 제작된 hybrid chip은 좀더 안정한 동작을 하도록 TEC가 내장된 ceramic package에 탑재하였다. 제작된 IRFPA sample은 원하는 특성을 만족하였으며, 특히 fill-factor, 탐지도, 반응도면에서 설계의 목표에 잘 근사함을 알 수 있었다.

• 마이크로전자및패키징학회지
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• 제17권1호
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• pp.81-88
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• 2010

Sn-3.0Ag-0.5Cu 솔더범프의 금속간화합물 성장거동에 미치는 PCB 표면처리의 영향을 알아보기 위해서 PCB 패드 표면에 각각 OSP, immersion Sn, 그리고 ENIG를 처리하였고, 열처리는 $150^{\circ}C$ 조건에서 실험을 실시하였다. 또한, 전류인가시 Sn-3.0Ag-0.5Cu 솔더범프의 접합부 계면반응에 미치는 표면처리의 영향을 알아보기 위해서 $150^{\circ}C$, $4{\times}10^3\;A/cm^2$ 조건에서 electromigration특성을 비교 평가하였다. 열처리시 OSP와 immersion Sn의 금속간화합물 성장거동은 서로 비슷한 경향을 보인 반면, ENIG는 다른 표면처리에 비해 훨씬 느린 성장거동을 보였다. electromigration특성 평가결과 열처리에 비해 금속간화합물의 성장이 가속화되나 표면처리별 경향은 유사하였고, 전자 이동 방향에 따른 음극-양극에서 금속간화합물 형성의 차이를 보이는 극성효과(polarity effect)가 나타나는 것을 알 수 있었다.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2001년도 유체기계 연구개발 발표회 논문집
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• pp.475-481
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• 2001

Foil bearings have been successfully used for small high speed rotors, such as ACM(Air Cycle Machine), turbo charger, turbo compressor, high speed motor, etc. Recently advanced researches are concentrated on the high load capacity and the extreme temperature foil bearings to extend the application boundary. Some bearings are already adopted into cryogenic machines and micro gas turbines. In this paper, a foil journal bearing designed for high load capacity, which is under development, is introduced. The bearing is for the turbo refrigerator which has a rotor of 18${\~}$25 kgf rotating at 23,000${\~}$38,000 rpm. This application is well beyond conventional spectrum of foil bearings because the rotor is relatively heavy and the rotational speed is low. Therefore, the development is challenging. The foil bearing is a bump type, the size is 60mm in diameter and 50mm in length, the operating fluid is air and rotational speed is 26,000 rpm. In-house software was developed and used for bearing design. Tested maximum load capacity is 80kgf, 0.62 in terms of load capacity coefficient, and testing is being continued.

• 한국방송∙미디어공학회:학술대회논문집
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• 한국방송∙미디어공학회 2017년도 추계학술대회
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• pp.144-145
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• 2017

최근 전자 기기의 크기가 줄어들고 PCB의 사이즈와 반도체 패키지의 크기가 소형화되어 플립 칩 본딩(Flip chip bonding) 기술을 적용한 반도체 패키지 방식이 점점 늘어나고 있다. 이에 따라 PCB와 반도체 칩 사이를 연결하기 위해 응용되던 BGA(Ball Grid Array)에 핀 배열 대신 사용되는 범프(Bump)를 50um 이내의 초미세 범프로 만들어 일정한 배열을 유지하는 것이 중요하다. 또한 초미세 범프의 모양과 품질이 패키지 수율과 밀접하게 연관되기 때문에 이를 검사할 수 있는 기술이 필수적이다. 이에 본 논문은 초미세 범프측정을 할 수 있는 시스템 개발을 위한 측정 대상의 특징과 사용할 수 있는 광학계를 분석하였고, 획득된 영상을 가지고 딥러닝을 적용하여 정확하게 불량여부를 판별할 수 있는 초미세 범프 측정 시스템을 고안하였다.