• Journal of Powder Materials
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• v.9 no.4
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• pp.267-272
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• 2002

The production of micro components is one of the leading technologies in the fields of information and communiation, medical and biotechnology, and micro sensor and micro actuator system. Microfabrication (micromachining) techniques such as X-ray lithography, electroforming, micromolding and excimer laser ablation are used for the production of micro components out of silicon, polymer and a limited number of pure metals or binary alloys. However, since the first development of microfabrication technologies there have been demands for the cost-effective replication in large scale series as well as the extended range of available material. One such promising process is micro powder injection molding (PIM), which inherits the advantages of the conventional PIM technology, such as low production cost, shape complexity, applicability to many materials, applicability to many materials, and good tolerance. This paper reports on a fundamental investigation of the application of W-Cu powder to micro metal injection molding (MIM), especially in view of achieving a good filling and a safe removal of a micro mold conducted in the experiment. It is absolutely legitimate and meaningful, at the present state of the technique, to continue developing the micro MIM towards production processes for micro components.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.11
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• pp.211-220
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• 2002

Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. A coupled simulation of gas flow and structural displacement of the micro mirror using the Finite-Element-Method is applied to this. The mirror was fabricated by using MEMS technology. Especially, the process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the Process reliability. The mirror size was 2.5mm${\times}$3mm and it needed about 35V for displacement of 3.2 ${\mu}$.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10b
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• pp.964-968
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• 1988

In mechanical systems in which the dynamics of armatures is dominated by electrostatic forces, motions will generally be unstable. This paper deals with the control problems of this kind of micro electrostatic device systems. In these systems, the mass of micro mechanical parts is so small that the inertia term in the equation of motion is negligible. However, nonlinear terms, such as friction and driving force, become dominant. The purpose of this paper is to realize the stable motion without delay and, overshoot etc. A micro-mechanical system used in this paper consists of a plane wafer with striped electrodes converted with an insulation layer and thin cylindrical roller is placed over on it. The performance of motions is confirmed by some simulations.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.539-542
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• 1997

We present a micro-positioning stage that has minimized geometrical error and can drive in the 4-axis. This stage divided into two parts: $Z\theta_x$ $\theta_y$, motion stage and$\theta_z$ motion stage. These stages are constructed in flexure hinges, piezoelectric actuators and displacement scnsors. The dynamic model for each stage is obtained and their FE (finite element) models are made. Using the Lagrange's equation, the motion of equation is found. Through the parametric analysis and FE analysis, sensitiv~ty of the design parameters is executed. Finally, fundamental frequencies, maximum stress, and displacement sensitivity for each stage are obtained. We expect that this micro-positioning stage be a useful micro-alignment device for various applications.

• Journal of Biomedical Engineering Research
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• v.14 no.2
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• pp.147-153
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• 1993

In this paper, we studied about the micro pressure transmission system using fluid. For the investigation of feasibility of microhydraulic system, the hydraulic characteristics were examined by using the capillary tube system and the micro cylinder system that consists of a rod and a micro capillary tube. A new hydraulic micro actuator using magnetic fluid and an external magnetic field was also investigated. The results showed that our microhydraulic system has the possibility of power transmission in arbitrary directions.

• Design & Manufacturing
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• v.14 no.3
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.222-225
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• 2001

Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. The mirror was fabricated by using MEMS technology and it's characteristics investigated. Also, electrode structure for reducing squeeze effect was discussed.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.871-875
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• 2001

Laser photolithography technique is useful for fabricating micro-patterns of silicon wafers. In this work, the laser photolithography micromachining technique is optimized based on Taguchi method. Sensitivity analysis was performed using laser scanning speed and laser power level as the parameters. The results show that for the photoresist used in this work, a laser scan speed of $70{\mu}m/s$ at 50mW laser power gives the best result.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.873-876
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• 2001

Micro-robots using microprocessor are mainly classified as line-tracer, micro-mouse, and war-robot. This paper presents the development of the war-robot mechanism with vehicle-style using RC-servo motors and actuators using 4-bar linkage and infrared sensors. Especially the algorithm of conquering other war-robots is proposed based on the skill of belly-throw of Korean wrestling.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.656-659
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• 2003

Although Hereafter a mass production will claim for patterning nano sized thickness or line in micro-nano industry. existent lithography fabrication has many usable fields, it has complex fabrication steps, expensive values and row work rates. Development of Dip-pen type nano plotter using polymer actuator can construct row cost mass production system because it will change existent lithography fabrication more simple and easy.