• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.39-40
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.85-85
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• 2003

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.12
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• pp.1027-1033
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• 2007

In this research, the polishing pad for W CMP has been analyzed to understand stabilization of polishing performance. For stabilization of process, the polishing pad condition is one of important factors. The polishing pad plays a key role in polishing process, because it contact with reacted surface of wafer[1]. The physical property of pad surface is ruled by conditioning tool which makes roughness and profile of pad surface. Pad surface affects on polishing performance such as RR(Removal Rate) and uniformity in CMP. The stabilized pad surface has stable roughness. And its surface has high level of wettability which can increase the probability of abrasive adhesion on pad. The result of this research is that the reduction of break-in and dummy polishing process were achieved by artificial machining to make stable pad surface. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied. Because, this type of pad is the most conventional type.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.481-482
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• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1265-1268
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• 2005

Due to the increase of the need for reliable high density information storage devices, the demand for precise machining of the slider in HDD is rapidly growing. The present fabrication process of slider bears some serious problems such as low yield ratio in mass production, which is mainly caused by inefficient machining processes in shaping camber and crown on the slider. In order to increase slider yield ratio in HDD, a new systematic machining process is proposed and developed in this work. This new machining process includes the use of magnetorheological (MR) fluid, a smart polishing material generally used for ultra-fine surface finishing of micro structures. It is shown that the process proposed in this work enables to make camber and crown pattern in the scale of few tens of nanometers. Experiment results shows that the MR polishing can be also used for shaping process of micro structures.

• Tribology and Lubricants
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• v.33 no.6
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• pp.282-287
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• 2017

SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.2
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• pp.100-106
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• 2013

Stainless steel has some excellent properties as the material for the mechanical component. Purpose of this study is carried out to obtain mirror surface on the surperfinishing of stainless steel with high efficiency. To achieve this, we have conducted a series of polishing experiment for stainless steel using abrasive film from the perspective of oscillation speed, the rotational speed of workpiece, contact roller hardness, contact pressure and feed rate. Abrasive film used this study is a micro-finishing film and a lapping film. Furthermore, the polishing characteristics and efficiency of stainless steel is discussed through measuring optimal polishing time and surface roughness. From the obtained results, it was confirmed that efficient superfinishing conditions and polishing characteristic of Stainless steel can be determined.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1889-1892
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• 2003

The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.298-303
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• 2013

Magnetic abrasive polishing is one of the most promising finishing methods applicable to complex surfaces. Nevertheless this process has a low efficiency when applied to very hardened materials. For this reason, EP-MAP hybrid process was developed. EP-MAP process is expected to machine complex and hardened materials. In this research, deburring process using EP-MAP hybrid process was proposed. EP-MAP deburring process is applied to micro channel, thereby it can obtain both deburring process and polishing process. EP-MAP deburring process on the micro channel was performed. Through design of experiment method, error of height in this process according to process parameter is analyzed. When the level 1 parameter A(magnetic flux density) and level 2 parameter B(electric potential), C(working gap) and level 3 parameter D(feed rate) are applied in the deburring process using EP-MAP hybrid process, it provides optimum result of EP-MAP hybrid deburring process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.191-192
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• 2013