• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.09a
• /
• pp.55-85
• /
• 2000

MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2006.10a
• /
• pp.67-73
• /
• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.

• Smart Structures and Systems
• /
• v.12 no.6
• /
• pp.679-694
• /
• 2013

In this paper the application of the Interpolation Damage Detection Method to the numerical model of a suspension bridge instrumented with a network of Micro-Electro-Mechanical System sensors is presented. The method, which, in its present formulation, belongs to Level II damage identification method, can identify the presence and the location of damage from responses recorded on the structure before and after a seismic damaging event. The application of the method does not require knowledge of the modal properties of the structure nor a numerical model of it. Emphasis is placed herein on the influence of recorded signals noise on the reliability of the results given by the Interpolation Damage Detection Method. The response of a suspension bridge to seismic excitation is computed from a numerical model and artificially corrupted with random noise characteristic of two families of Micro-Electro-Mechanical System accelerometers. The reliability of the results is checked for different damage scenarios.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.1718-1723
• /
• 2007

The Probe Card is a test component which is to classify the good semiconductor chips before the packaging. The yield of semiconductor product can be better from analysis of probe test information. Recently the technology of the probe card needs narrow width and large amount of probe tip. In this research, the probe tip based on the MEMS(micro electro mechanical system) technology was designed and fabricated to improve the reliability of the test and to meet 2-dimensional Array of tip. The mechanical and electrical properties of proposed tip were evaluated and it has over 100,000 of repetition times in the condition of 5gf, $20{\mu}m$ Over Drive.

• 전기의세계
• /
• v.42 no.11
• /
• pp.23-29
• /
• 1993

최근에 마이크로 머신의 여러 연구분야중에서 Micro-Electro-Magnetic-Mechanical-System(MEMS)분야가 연구의 최대 관심사로 떠오르며, 완전집적 전자력 구동 액츄에이터와 센서의 개발, 실용 및 응용에 여러 세계적인 굴지의 연구소 및 회사가 속속 참여하고 있다는 것은 시사해주는 바가 크다.

• The Magazine for Energy Service Companies
• /
• s.13
• /
• pp.50-55
• /
• 2001

최근의 계속된 칩(Chip)기술의 발전으로 전자부품의 고성능화가 가능해 졌지만, 그에 따라서 부수적으로 전자제품으로부터 발생되는 열로 인한 많은 열적인 문제도 야기되었다. 칩자체의 초소형화와 고성능화는 전자, 통신, 항공 우주, 각종 에너지 시스템들의 소형화가 더욱 가능해졌고, 또한 이러한 시스템들의 열적인 문제를 해결할 장치들도 초소형화하는 제품들이 필요하게 되었다. 따라서 본 기술에서는 초소형 전자기기시스템(Micro-Electro Mechanical System) 기술의 발전에 따라 가공이 가능하게 된 초소형 열교환기(Micro Heat Exhanger)에 관한 기술을 초소형 채널 열교환기(Micro Channel Heat Exchanger), 그리고 초소형 히트파이프 열교환기(Micro Heat Pipe Heat Exchanger)와 같이 세 가지로 분류하여 그 기술의 현재와 앞으로의 전망을 소개하고자 한다.

• Electrical & Electronic Materials
• /
• v.17 no.8
• /
• pp.25-32
• /
• 2004

센서는 인간의 오감에 해당하는 감지기로서 온도, 소리, 빛 등의 물리, 화학적 신호를 전기적 신호로 변환시켜주는 일련의 장치를 말한다. 물론 센서에 대한 정의 및 분류 방법은 다양하게 표현될 수 있으나 본 논문에서는 MEMS(Micro Electro-Mechanical System) 기술을 적용하여 Smart화 혹은 Wireless화에 필요한 Micro 센서로 그 범위를 한정하고자 한다. 만일 센서를 아주 작게(Micro Sensor) 만들 수 있고 그것들끼리 무선으로 연결될 수(Wireless Network) 있다면 우리의 삶의 형태는 지금과는 매우 다른 모습으로 전개 될 것이다. 그림 1은 2004년에 정보통신부가 발표한 Ubiquitous Sensor Network의 개념도이다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1995.10a
• /
• pp.75-78
• /
• 1995

This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.25 no.6
• /
• pp.421-425
• /
• 2016

Micro-EDM is one of the recent fine-machining technologies. Micro-EDM is widely used in precision processes because products manufactured via EDM are free from workpiece hardness. However, the debris produced during the process cause many problems such as reduced precision of the process. The first solution of this problem involves using the milling hole process. Micro-EDM hole process involves an electrode moving rapidly in the vertical direction via a servo system to disperse debris. However, this process can cause reduced work efficiency owing to contact between the electrode and workpiece. In this study, ultrasonic vibration is added to micro-EDM channel machining. Ultrasonic vibration removes the debris during machining and enables precision machining. Consequently, a clean work environment for the subsequent processes is maintained.

• 유체기계공업학회:학술대회논문집
• /
• 2006.08a
• /
• pp.305-308
• /
• 2006

For controlling micro-flows inside a LOC (lab-on-a-chip) a syringe pump or an electronic device for EOF(electro-osmotic flow) have been used in general. However, these devices are so large and heavy that they are burdensome in the development of a portable micro-TAS (total analysis system). In this study, a new flow control system employing pressure chambers, digital switches and speed controllers was developed. This system could effectively control the micro-scale flows inside a LOC without any mechanical actuators or electronic devices We also checked the feasibility of this new control system by applying it to a LOC of micro-mixer type. Performance tests show that the developed control system has very good performance. Because the flow rate in LOC is controlled easily by throttling the speed controller, the flows in complicate microchannels network can be also controlled precisely.