• Laser Solutions
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• v.11 no.3
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• pp.1-4
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• 2008

A selective laser micro bonding process using liquid glass (methylsilsesquioxane) was developed and the results are analysed. The liquid glass can be solidified with Nd:YAG laser irradiation and it can be applied for joining two glass substrates. A bonding thickness of a few micrometers can be achieved. The appropriate laser power density (or this process is around 40-60 $kW/cm^2$ and its bonding force is 1000-1200 $gf/mm^2$. This process can be applied for bonding micro devices such as micro bio-sensors or display products. Its advantages and limitations are presented and discussed.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1103-1106
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• 2008

For the current display process, the innovative micro pattern fabrication process using semiconductor process should be developed, which requires the expensive equipment, the limited process environment and the expensive optic-sensitive material. The effort of process innovation during past several years ends up the limit of cost reduction. The existing ink jet technologies such as a thermal bubble ink jet printing and a piezo ink jet printing are required to shorten the nozzle diameter in order to apply to the micro pattern fabrication. In this paper, as one way to cope these problems the micro pattern equipment based on the electrostatic ink jet has been developed and carried out some experiments.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.2
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• pp.1-6
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• 2012

Recent ultra-precision machining systems have nano-scale resolution, and can machine various shapes of complex structures using five-axis driven modules. These systems are also multi-functional, which can perform various processes such as planing, milling, turning et al. in one system. Micro machining technology using these systems is being developed for machining fine patterns, hybrid patterns and high aspect-ratio patterns on large-area molds with high productivity. These technology is and will be applied continuously to the fields of optics, display, energy, bio, communications and et al. Domestic and foreign trends of micro machining technologies for flat molds were investigated in this study. Especially, we focused on the types and the characteristics of ultra-precision machining systems and application fields of micro patterns machined by the machining system.

• Design & Manufacturing
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• v.12 no.1
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• pp.47-51
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• 2018

As the IT industry rapidly progresses, the functions of electronic devices and display devices are integrated with high density, and the model is changed in a short period of time. To implement the integration technology, a uniform micro-pattern implementation technique to drive and control the product is required. The most important technology for the micro pattern generation is the exposure processing technology. Failure to implement the basic pattern in this process cannot satisfy the demands in the manufacturing field. In addition, the conventional exposure method of the mask method cannot cope with the small-scale production of various types of products, and it is not possible to implement a micro-pattern, so an alternative technology must be secured. In this study, the technology to implement the required micro-pattern in semiconductor processing is presented through the photolithography process and plasma etching.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1486-1489
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• 2009

Micro wall is fabricated using iterative screen printing that it is able to fabricate the pattern as low cost, simple process, formation of pattern at large area on the various substrates. In the process of micro wall fabrication using screen printing, the printing result with pressure change in process and improvement of surface roughness using hydrophillic plasma treatment are included. Height of micro wall increase linearly and precision of iteration is very high. Error rate of printed pattern width is very high, but change rate of width is under 10 %. Fabricated micro pattern have minimum width $48.75{\mu}m$ and maximum height $75.45{\mu}m$ with aspect ratio 1.55.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.229-233
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• 2004

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper was carried out some experiments of the micro plasma electrode fabrications using FIB. The sputtering of FIB has one major problem that is redeposited by sputtered material including $Ga^+$ ion source. Therefore we have verified the effect of the reposition by EDX. And the optimal condition is suggested to machine the micro plasma electrode.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.64.2-64
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• 2001

In this paper, fabricated is a motion capture and attitude detection system for Head Mounted Display HMD composed of three low-price and low-grade micro gyroscopes and a micro-controller, To calculate attitude of a body, modified INS algorithm is used. Because the micro gyroscope has much bias drift error, scale factor error, and run-to-run bias error, the motion of a body can not be measured exactly if the general INS algorithm and micro gyroscopes are used. To reduce the errors, three accelerometers can be used. In this case, however, the size and power consumption become too large to use in HMD system. The modified INS algorithm use the grid map and the characteristics of the human motions.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.05a
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• pp.656-659
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• 2006

MD (DLP, LCoS) Projection TV is appropriate for large screen display with high definition at a relatively low price and thus, has been popular in the digital TV market. In order to realize high resolutions in the DLP projection TV, we successfully developed the Pixel Enhancement Actuator. Furthermore, it is also required that the contrast ratio of projected video signals onto a large screen should be improved. Therefore, we propose a contrast enhancer which adjusts the amount of projected lights by a dynamic aperture and a attached position sensor.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.41-45
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• 2006

Micro vibration isolation, typically originated from ground, is always a prime concern for the nano-measurement instruments such as Atomic Force Microscopes. A four mount active vibration isolation system is proposed in this paper. Modeling and control of such a four mount system was analyzed. Combined active-passive isolation principle is used for vibration isolation by mounting the instrument on a passively damped isolation system made of Elastomer along with the active stage in parallel that consists of very soft actuation system, the Voice Coil Motor. The active stage works in combination with the passive stage for working as a very low frequency vibration attenuator.

• Journal of the Semiconductor & Display Technology
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• v.13 no.3
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• pp.51-55
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• 2014

Ni-CNT(Carbon Nanotubes) composite coating is often used for the surface treatment of mechanical/electronic devices to improve the properties of the Ni coating. For the Ni-CNT coating, the dispersion of CNT fibers is a critical process. In this study, ultrasonic treatment instead of the conventional ball milling was attempted as a dispersion method for the electroless Ni-CNT coating. SEM-EDX analysis was performed and contact angle, sheet resistance, and micro-hardness were measured. Results showed that the ultrasonic treatment was comparable to the ball milling, as a dispersion method, but the difference was negligible. However, combined ball milling and ultrasonic treatment(double treatment) showed much improved micro-hardness value, above 350Hv(close to the value obtained by the Ni-CNT electroplating). In addition, electroless Ni-CNT(double-treated) coatings formed on the thin Ni film deposited by the electroless plating(double coating) showed better mechanical properties. Thus, double treatment and double coating are suggested as an improved electroless Ni-CNT coating method.