Laser Solutions (한국레이저가공학회지)

Korean Society of Laser Processing (한국레이저가공학회)
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Laser bonding using liquid glass

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  • Kim, Joo-Han (Seoul National University of Technology, Mechanical Engineering) ;
  • Lee, Jae-Hoon (Korea Institute of Machinery and Materials) ;
  • Kim, Hyang-Tae (Seoul National University of Technology, Mechanical Engineering)
  • Published : 2008.09.30
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Abstract

A selective laser micro bonding process using liquid glass (methylsilsesquioxane) was developed and the results are analysed. The liquid glass can be solidified with Nd:YAG laser irradiation and it can be applied for joining two glass substrates. A bonding thickness of a few micrometers can be achieved. The appropriate laser power density (or this process is around 40-60 $kW/cm^2$ and its bonding force is 1000-1200 $gf/mm^2$. This process can be applied for bonding micro devices such as micro bio-sensors or display products. Its advantages and limitations are presented and discussed.

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