• Proceedings of the KOSOMBE Conference
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• v.1989 no.05
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• pp.9-12
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• 1989

A preliminary study has been conducted to demonstrate the effect of laser heat treatment on Ni Ti alloy dental arch wires ($0.016"\;{\times}\;0.022"$ and $0.018"\;{\times}\;0.026"$, rectangular shape). Changes in mechanical and thermal properties and surface morphologies are investigated by using optical and scanning electron microscope (SEM), energy dispersive x-ray microprobe analysis(EDX), differential scanning calorimeter (DSC), and micro hardness tester. The results indicate that the laser can affect the thermal equilibrium state of the localized surface. Titanium rich surface film is formed by the laser treatment. The surface film and rapidly resolidified underlying structures show better chemical resistance than the matrix material. Phase transition temperatures which are related to shape recovery temperatures are changed after laser treatment. Hardness of resolidified area and heat affected zone are lower than before treatment.

• Bulletin of the Korean Chemical Society
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• v.27 no.2
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• pp.208-210
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• 2006

The enthalpies of transfer, $\Delta H_t^\theta$, of urea from water to aqueous ethanol, EtOH, propan-1-ol, PrOH, and acetonitrile, MeCN, are reported and analysed in terms of the new solvation theory. The analyses show that the solvation of urea is random in the considered solvent mixtures. It is also found that urea interact more strongly with EtOH or PrOH than water.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.74-74
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• 2010

모바일 정보통신기기를 중심으로 전자패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있는 추세이다. 플립칩 패키징 접합소재로는 솔더, ICA(Isotropic Conductive Adhesive), ACA(Anisotropic Conductive Adhesive), NCA(Non Conductive Adhesive) 등과 같은 다양한 접합소재가 사용되고 있다. 최근에는 언더필을 사용하는 플립칩 공법보다 미세피치 대응성을 위해 NCP를 이용한 플립칩 공법에 대한 요구가 증가되고 있는데, NCP의 상용화를 위해서는 공정성과 함께 신뢰성 확보가 필요하다. 본 연구에서는 LDI(LCD drive IC) 모듈을 위한 COF(Chip-on-Film) 플립칩 패키징용 NCP 포뮬레이션을 개발하고 이를 적용한 COF 패키지의 신뢰성을 조사하였다. 테스트베드는 면적 $1.2{\times}0.9mm$, 두께 $470{\mu}m$, 접속피치 $25{\mu}m$의 Au범프가 형성된 플리칩 실리콘다이와 접속패드가 Sn으로 finish된 폴리이미드 재질의 flexible 기판을 사용하였다. NCP는 에폭시 레진과 산무수물계 경화제, 이미다졸계 촉매제를 사용하여 다양하게 포뮬레이션을 하였다. DSC(Differential Scanning Calorimeter), TGA(Thermogravimetric Analysis), DEA(Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화거동을 확인하였으며, 본딩 후에는 보이드를 평가하고 Peel 강도를 측정하였다. 최적의 공정으로 제작된 COF 패키지에 대한 HTS (High Temperature Stress), TC (Thermal Cycling), PCT (Pressure Cooker Test)등의 신뢰성 시험을 수행한 결과 양산 적용 가능 수준의 신뢰성을 갖는 것을 확인할 수 있었다.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.78-78
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• 2010

모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

• Journal of Radiation Protection and Research
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• v.38 no.3
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• pp.132-137
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• 2013

Cryogenic particle detectors have recently been adopted in radiation detection and measurement because of their high energy resolution. Many of these detectors have demonstrated energy resolutions better than the theoretical limit of semiconductor detectors. We report the development of alpha spectrometer using a micro-fabricated magnetic calorimeter coupled to a large-area particle absorber. A piece of gold foil of $2{\times}2{\times}0.05mm^3$ was glued to the paramagnetic temperature sensor made of sputtered Au:Er film to serve as an absorber for incident alpha particles. We performed experiments with 241Am source at cryogen free adiabatic demagnetization refrigerator (CF-ADR). A high energy resolution of 6.8 keV in FWHM was obtained for 5.5 MeV alpha particles.

• Journal of the Korean Ceramic Society
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• v.19 no.2
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• pp.133-138
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• 1982

Two kinds of clinker liquid melts, one containing 2.0% of $K_2O$ and the other without $K_2O$, were prepared with the similar composition as those developed during the firing of portland cement clinker. One portion of melt was quenched and found to consist of glass together with traces of proto-$C_3A$, and the other portion was allowed to cool spontaneously to crystallize $C_3A$ and calciumferrite well. The product obtained by crystallization of the melt without $K_2O$showed cubic $C_3A$, while orthorhombic $C_3A$ was formed from the crystallized product containing $K_2O$. Studies on the hydration behavior of the samples made from the melts with 30% of gypsum were carried out for 24 hours by observation at regular intervals ettringite, monosulphate hydrates and gypsum which were formed or consumed during hydration. The samples without $K_2O$ in the melts were hydrated wth addition of proper amount of $K_2SO_4$ in the water for hydration. Hydration behavior of glassified $C_3A$ showed that it has low reactivity relative to crystallized $C_3A$, and also hydration reactivity of orthorhombic $C_3A$ was much lower than that of cubic $C_3A$ in 60 minutes. Potassium sulphate in the solution reduced the hydration reactivity of $C_3A$ . Evolution peaks of hydration heat examined by twin-type conduction micro-calorimeter showed that glassified $C_3A$ without $K_2O$ had secondary peak after 9 hours and $C_3A$ containing $K_2O$ after 12 hours. When crystallized $C_3A$ was hydrated, initial peaks of hydration heat were considerably high and there was no secondary peak for cubic $C_3A$ but the secondary peak of orthorhombic $C_3A$ appeared after 4 hours.

• Applied Chemistry for Engineering
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• v.20 no.6
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• pp.632-637
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• 2009

Poly(${\varepsilon}-caprolacton$)/ethyl cellulose (PCL/EC) microcapsules containing pluronic F127 were prepared by a spray drying method. The aqueous phase, 20% of pluronic F127 was dissolved in distilled water, and the organic phase, 5% of PCL and EC were dissolved in dichloromethane. The microcapsules were obtained by spray drying the water-in-oil (W/O) emulsion. According to the data of scanning electron microscopy and particle analyzer, tens of micro size microcapsules were observed. On a differential scanning calorimeter, the phase transition temperatures of microcapsules were observed and they were found around those of pluronic F127 and poly(${\varepsilon}-caprolacton$), which were the main components of the microcapsules. At the range of $30{\sim}45^{\circ}C$, temperature-dependent release properties were investigated using fluorescein isothicyanate-dextran (FITC-dextran) and blue dextran as a model drug. When the temperature was increased, the degree of release of microcapsule was also increased. FITC-dextran, the relative low molecular weight, was more released than blue-dextran.

• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.

• Restorative Dentistry and Endodontics
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• v.25 no.1
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• pp.123-132
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• 2000

To overcome problems of conventional glass ionomers, resin components have been added to glass ionomers. On a continuum between glass ionomers and composites are a variety of blends, employing different proportions of acid-base and free radical reactions to bring about cure. Popular groups defined between the ends are resin-modified glass-ionomers(RMGIs), polyacid-modified composite resins(Compomers) and ionomer modified resins. These groups show different clinical properties, and in selecting these materials for a restoration, one should sufficiently understand these different setting properties. In this study, some difference in the setting characteristics of different groups of hybrid ionomers were examined. Two RMGIs (Fuji2 LC,GC / Vitremer, 3M), three Compomers (Dyract AP, Dentsply / F2000, 3M / Elan, Kerr) were involved in this study. The identification of the setting characteristics of different groups was achieved by a two-stage study. First, thermal analysis was performed by a differential scanning calorimeter, and then the hardness of each group at different depth and time were measured by a micro-hardness tester. Thermal analysis was performed to identify the inorganic filler content and to record the heat change during setting process. The setting process was progressed for each material by chemical set mode and light-cured mode. In the hardness test, samples of materials were prepared with a 6mm-diameter metal ring, and the hardness was measured at the top, and 1mm, 2.5mm, 4mm below at just after a 40 second-cure, and after 10 minutes, 24 hours, and 7 days. Statistical analysis was performed by Mann-Whitney rank sum test to assess significant differences between set modes and types of materials, and by ANOVA and T-test to evaluate the statistical meanings of data at different times and depths of each materials. Followings are findings and conclusions derived from this study. Thermal analysis; 1. Compomers show no evidence of chemical setting while RMGIs exhibit heat output during the process of chemical setting. 2. Heat of cure of RMGIs exceed Compomers. 3. The net heat output of RMGIs through light-cured mode is higher than through chemically set mode. Hardness test; 1. Initial hardness of RMGIs immediately after light cure is relatively low, but the hardness increases as time goes by. On the contrary, Comomers do not show evident increase of the hardness following time. 2. Compomers show a marked decrease of setting degree as the depth of the material increases. In RMGIs, the setting degree at different depths does not significantly differ.

• Korean Chemical Engineering Research
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• v.50 no.4
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• pp.666-671
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• 2012

Gas hydrates are inclusion compounds formed when small-sized guest molecules are incorporated into the well defined cages made up of hydrogen bonded water molecules. Since large masses of natural gas hydrates exist in permafrost regions or beneath deep oceans, these naturally occurring gas hydrates in the earth containing mostly $CH_4$ are regarded as future energy resources. The heat of dissociation is one of the most important thermal properties in exploiting natural gas hydrates. The accurate and direct method to measure the dissociation enthalpies of gas hydrates is to use a calorimeter. In this study, the high pressure micro DSC (Differential Scanning Calorimeter) was used to measure the dissociation enthalpies of methane, ethane, and propane hydrates. The accuracy and repeatability of the data obtained from the DSC was confirmed by measuring the dissociation enthalpy of ice. The dissociation enthalpies of methane, ethane, and propane hydrates were found to be 54.2, 73.8, and 127.7 kJ/mol-gas, respectively. For each gas hydrate, at given pressures the dissociation temperatures which were obtained in the process of enthalpy measurement were compared with three-phase (hydrate (H) - liquid water (Lw) - vapor (V)) equilibrium data in the literature and found to be in good agreement with literature values.