• 제목/요약/키워드: Micro Parts

검색결과 661건 처리시간 0.198초

Powder Blasting을 이용한 전자부품의 미세버 제거 (Micro-Deburring of Electro-Parts by Powder Blasting)

  • 김광현;최영현;최종순;박동삼;유우식
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 추계학술대회 논문집
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    • pp.314-318
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    • 2002
  • Several types of burrs form on the edges of all machined and stamped parts. These burrs must be removed to prevent interference fits or short circuits, to improve fatigue life or to prevent injury. Despite the full or partial automation of FMC or FMS, deburring operations to obtain workpiece with fine surface quality are difficult to be automated since the occurrence and condition of burr are not constant. This study focused on developing micro-deburring technique for small electro- parts produced by press process. The successful performance was demonstrated by deburring experiment using the powder blasting.

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미세 부품 조작을 위한 탄성힌지 기반 압전소자 구동형 초정밀 머니플레이션 시스템 (A Piezo-driven Fine Manipulation System Based on Flexure Hinges for Manipulating Micro Parts)

  • 최기봉;이재종;김기홍;고국원
    • 제어로봇시스템학회논문지
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    • 제15권9호
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    • pp.881-886
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    • 2009
  • This paper presents a manipulation system consisting of a coarse/fine XY positioning system and an out-of-plane manipulator. The object of the system is to conduct tine positioning and manipulation of micro parts. The fine stage and the out-of-plane manipulator have compliant mechanisms with flexure hinges, which are driven by stack-type piezoelectric elements. In the fine stage, the compliant mechanism plays the roles of motion guide and displacement amplification. The out-of-plane manipulator contains three piezo-driven compliant mechanisms for large working range and fine resolution. For large displacement, the compliant mechanism is implemented by a two-step displacement amplification mechanism. The compliant mechanisms are manufactured by wire electro-discharge machining for flexure hinges. Experiments demonstrate that the developed system is applicable to a fine positioning and fine manipulation of micro parts.

마이크로 가공에서 절삭깊이 보정을 위한 AE 센서의 적용 (Application of AE Sensor for Calibration of Depth of Cut in Micro-machining)

  • 강익수;김정석;김전하
    • 한국정밀공학회지
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    • 제26권9호
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    • pp.53-57
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    • 2009
  • There are technical requirements to manufacture large size functional parts with not only simple geometries like a flat or spherical surface but also sculptured geometries. In addition, the required machining accuracy for these parts is becoming more severe. In general, the form accuracy of machined parts is determined by the relative position between workpiece and tool during machining process. To improve machining accuracy the relative position errors should be maintained within the required accuracy. This study deals with the estimation and calibration of depth of cut using the AE signal in micro-machining. Also, this sensing technique can be applied to detect the initial contact between workpiece and tool.

A Study on Critical Depth of Cuts in Micro Grooving

  • Son, Seong-Min;Lim, Han-Seok;Paik, In-Hwan;Ahn, Jung-Hwan
    • Journal of Mechanical Science and Technology
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    • 제17권2호
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    • pp.239-245
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    • 2003
  • Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut, different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor which affects the qualities of machined parts. That is why diamond, especially monocrystal diamond which has the sharpest edge among all other materials, is widely used in micro-cutting. The majar issue is regarding the minimum (critical) depth of cut needed to obtain continuous chips during the cutting process. In this paper, the micro machinability near the critical depth of cut is investigated in micro grooving with a diamond tool. The experimental results show the characteristics of micro-cutting in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardening nea. the critical depth of cut.

초정밀 절삭에서의 가공깊이 최소화에 관한연구 (A Study on the minimizing of cutting depth in sub-micro machining)

  • 손성민;허성우;안중환
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2003년도 춘계학술대회 논문집
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    • pp.376-381
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    • 2003
  • Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut, different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor affecting the qualities of machined parts. That is why diamond especially mono-crystal diamond, which has the sharpest edge among all other materials is widely used in micro-cutting. The question arises, given a diamond tool, what is the minimum (critical) depth of cut to get continuous chips while in the cutting process\ulcorner In this paper, the micro machinability around the critical depth of cut is investigated in micro grooving with a diamond tool, and introduce the minimizing method of cutting depth using vibration cutting. The experimental results show the characteristics of micro cutting in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardeing around the critical depth of cut.

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마이크로 패턴 성형을 위한 인서트 코어 적용 µ-PIM 표준금형 개발에 관한 연구 (Development of µ-PIM standard mold with exchangable insert core in order to manufacture micro pattern)

  • 박치열;서찬열;김용대
    • Design & Manufacturing
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    • 제11권3호
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    • pp.29-34
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    • 2017
  • Increased demand for parts with micro-pattern structure made of metals, ceramics, and composites in various fields such as medical ultrasonic sensors, CT collimators, and ultra-small actuator parts. Micro powder injection molding (PIM) is a technology for manufacturing micro size, high volume, complex, precision, net-shape components from either metal or ceramic powder. In the present study, a standard mold with a variable insert core capable of producing various micro patterns was investigated. An injection molding test was performed on a standard mold using a line type micro-pattern core having an aspect ratio of 2, a slenderness ratio of 70, a pattern size of $200{\mu}m$, and a pattern spacing of $150{\mu}m$. During the filling process, the deformation of the mold with large aspect ratio and slenderness ratio was analyzed by the experiment and the numerical simulation according to the position of the gate. We proposed a mold structure that minimizes mold deformation by gate modification and enables uniform pattern filling behavior.

방전 미세구멍가공 특성의 고찰 (A Study on the Micro Hole Machining Characteristics in WEDG method)

  • 정태현;박규율
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 추계학술대회 논문집
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    • pp.953-956
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    • 1997
  • Micro drilling characteristics by EDM method was investigated. In detail, Micro tool electrode for EDM drilling was machined by use of WEDG method and micro hole was drilled using the machined tool electrode in SUS plate. The machining accuracy and time was compared in a different dielectric fluid. As a result, it was convinced that this method could be utilized as a fabrication technology of micro mold or micro 3 dimensional parts.

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휴대폰용 2인치 LCD-BLU의 광특성에 미치는 광학패턴 세장비의 영향 연구 : II. 금형 및 광특성 (A Study on the Effect of Optical Characteristics in 2 inch LCD-BLU by Aspect Ratio of Optical Pattern: II. Mold and Optical Characteristics)

  • 김종선;고영배;유재원;민인기;황철진;윤경환
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2006년도 춘계학술대회 논문집
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    • pp.95-98
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    • 2006
  • LCD-BLU (Back Light Unit) is one of kernel parts of LCD unit. The fabrication method of a 3-D micro mold patterned with micro-lenses for the LGP (Light Guiding Plate), one of the most important parts of LCD-BLU, was presented. Instead of dot pattern made by etching, 3-D optical pattern design with $50{\mu}m$ micro-lens was applied in the present study. The micro-lens pattern fabricated by modified LiGA with thermal reflow process was applied to the optical design of LGP. The positive micro-lens patterned injection mold with different aspect ratios (i.e. 0.3 and 0.4) was fabricated with modified LiGA with thermal reflow process. The brightness of LCD-BLU increased as aspect ratio of micro-lens increased.

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나노 다공 구조를 가진 알루미나 재료의 UV 레이저 미세가공에 관한 실험적 기초 연구 (Basic Experimental Investigations to UV Laser Micro-Machining of Nano-Porous Alumina Ceramic Material)

  • 신보성;이정한
    • 한국기계가공학회지
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    • 제11권1호
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    • pp.62-67
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    • 2012
  • Recently UV laser is widely used to process micro parts using various materials such as polymers, metals and ceramics because it has a very high intensity at the focused spot area. It is generally known that there are still some difficulties for alumina($Al_2O_3$) ceramics to directly make micro patterns like holes and lines on the surface of working material using 355nm UV laser because the alumina has a very low absorption coefficient at that wavelength. But nowadays new alumna with nano-porous holes is developed and applied to advanced micro functional parts of IT, BT and BT industries. In this paper, we are going to show the mechanism of photo-thermal ablation for nano-porous ceramics. Inside hole there is a lot of multiple reflections along the depth of hole. Experimentally we can find the micro hole drilling and micro grooving on the surface of nano-porous alumina.

밀리부품의 정밀도 향상을 위한 다단계 성형 및 금형 해석 (Multi-Stage Forming Analysis of a Milli-Component for Improvement of Forming Accuracy)

  • 윤종헌;허훈;김승수;나경환;박훈재;최태훈
    • 소성∙가공
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    • 제13권5호
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    • pp.429-434
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    • 2004
  • Manufacturing process for milli components has recently gained researcher's focus with the increasing tendency toward highly integrated and micro-scaled parts for electronic devices. The milli-components need more precise manufacturing process than the conventional manufacturing process since the parts require higher dimensional accuracy than the conventional ones. In order to enhance the forming accuracy and productivity, various forming procedures proposed and studied by many researchers. In this paper, forming analysis of milli-components has been studied with a new micro-former. In modeling of progressive dies, multi-stage forming sequence has been analyzed with finite element analysis by LS-DYNA3D. The analysis proposes the sequential die and part shapes with the corresponding punch force and dimensional accuracy. The analysis also considers the effect of elastic dies on the dimensional accuracy of the formed parts. The analysis result demonstrates that the elastic analysis in the milli-forming process is indispensable for accurate forming analysis. The analysis procedure in the paper will provide good information in design of a new micro-former and milli-component