• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1889-1892
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• 2003

The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1037-1040
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• 2002

In micro-stereolithography technology, fabrication conditions that include laser power, laser scan speed, laser scan pitch, and material property of photopolymer such as penetration depth and critical exposure are considered as major process variables. But the existing scan path generation methods based only on CAD model have not taken them into account, which has resulted in cross-section dimension of low accuracy. Thus, to enhance cross-section dimensional accuracy, the physical resin solidification n phenomena should be reflected in laser scan path generation and stage operating code. In this paper, multi-line experiments based on single line solidification model are performed. And the method for improving cross-section dimensional accuracy is presented, which is to apply the database based on experimental results to laser scan path generation.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.97-100
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• 2006

Picosecond (ps) laser micro-machining has emerged as an attractive method of fabricating high-precision microstructures, especially in metals. In this paper, a metallic mold for diffraction gratings is fabricated with a mode-locked 12 ps $Nd:YVO_4$ laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate line patterns. In order to minimize the line width, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.11
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• pp.1248-1253
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• 2008

The MCS(Micro-Coplanar Strip) line with ground has been analyzed. The conformal mapping method is used to calculate the quasi-static effective dielectric constant and characteristic impedance of this MCS line. The computed results of the present work are found to be in good agreement when compared with the results obtained using commercial S/W, IE3D. And in this paper, the stepped-impedance low pass filter is designed and fabricated with MCS lines for improving the frequency responses. The LPF proposed structure has been also designed and implemented to have the sharp attenuation characteristics in stop band. The agreement between simulation and measurement results verify the implemented LPF.

• Anatomy and Cell Biology
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• v.57 no.2
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• pp.204-212
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• 2024

In the present study, anatomical assessment of zygomaticofacial foramina (ZFFs) and zygomatic canals communicating with ZFFs were performed using cadaver micro-computed tomography images. It was suggested that all ZFFs were located above the jugale (Ju)-zygomaxillare (Zm) line, which is the reference line connecting the Ju and Zm, and most were located in the zygomatic body area (ZBA). The anteroposterior position of the ZFF in the ZBA was within a middle to posterior region and was most often located slightly posteriorly in males and closer to the middle of the region in females. The mean distance from the Ju-Zm line to the ZFF in the ZBA was 12.36 mm (standard deviation [SD] 1.52 mm) in males and 11.48 mm (SD 1.61 mm) in females. In zygomatic canals communicating with ZFFs, most zygomatic canals were type I canals, communicating from the zygomaticoorbital foramen and harboring the zygomaticofacial nerve, and the others were type II canals, communicating from the zygomaticotemporal foramen and located near the posterior margin of the frontal process. These results provide useful anatomical information for preventing nerve injury during surgical procedures for zygomatic implant treatment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.547-548
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• 2007

• International Journal of Internet, Broadcasting and Communication
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• v.8 no.3
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• pp.1-11
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• 2016

This study investigates whether different SNS with different characteristics have different impacts on participatory social capital in Korea. At least in Korea, SNS are categorized into five types (community, blog, micro-blog, profile-based service and instant message service), and participatory social capital is specified by three types (off-line political participation, on-line political participation, on-line civic engagement). Using Nielsen KoreanClick's web-based survey data, our regression analysis shows that SNS which are more open and focused on information sharing contribute more to participatory social capital.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2395-2397
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• 2005

A low voltage operated piezoelectric RF MEMS in-line switch has been realized by using silicon bulk micromachining technologies for advanced mobile/wireless applications. The developed RF MEMS in-line switches were comprised of four piezoelectric cantilever actuators with an Au contact metal electrode and a suspended Au signal transmission line above the silicon substrate. The measured operation dc bias voltages were ranged from 2.5 to 4 volts by varying the thickness and the length of the piezoelectric cantilever actuators, which are well agreed with the simulation results. The measured isolation and insertion loss of the switch with series configuration were -43dB and -0.21dB (including parasitic effects of the silicon substrate) at a frequency of 2GHz and an actuation voltage of 3 volts.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.1-6
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• 2022

This computational investigation of micro-sized particle dispersion concerns the fume particle contamination over target surface in high-precision laser line machining process of semiconductor and display device materials. Employing the random sampling based on probabilistic fume particle generation distributions, the effects of sphericity for nonspherical fume particles are analyzed for the fume particle dispersion and contamination near the laser machining line. The drag coefficient correlation for nonspherical particles in a low Reynolds number regime is selected and utilized for particle trajectory simulations after drag model validation. When compared to the corresponding results by the assumption of spherical fume particles, the sphericity of nonspherical fume particles show much less dispersion and contamination characteristics and it also significantly affects the particle removal rate in a suction air flow patterns.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.123-127
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• 2009

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).