• 소성∙가공
• /
• 제7권1호
• /
• pp.66-71
• /
• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• 한국산업융합학회 논문집
• /
• 제10권4호
• /
• pp.213-219
• /
• 2007

Glass-to-metal contact should be prevented in the design of any structural glass component. Because glass is extremely brittle and will fracture readily if even a small point load is applied. If the assembly includes a glass component supported by metallic structure, designers should provide a pliable interface of some kind between the two parts. But there happens high demand of glass-to metal contact in semiconductor industries due to adoption of dry cleaning process as one of the good solution to reduce running cost - carry out equipments cleaning with high corrosive and etching gas such as CF4 with keeping process temperature as the same as high service temperature. Therefore the quartz glass have to be received compression by direct contact with metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process during the process. In this paper investigation will be carried out on fracture behavior of quartz glass contacted with metal directly under local load and fatigue given by process vibration with apparatus which can give $lox{\backslash}cal$ load and vibration through PZT ceramics to give guideline to prevent unintended fracture of quartz glass.

• 접착 및 계면
• /
• 제23권4호
• /
• pp.122-129
• /
• 2022

본 연구에서는 산소 플라즈마 처리시간을 실험 변수로 하여 금속섬유를 처리한 후 섬유표면에 산소함유 기능성 관능기를 도입하여 금속섬유의 친수성을 향상시키기 위한 연구로 플라즈마 처리 전, 후의 표면 특성 변화를 scanning electron microscope (SEM)과 x-ray photoelectron spectroscopy (XPS)를 사용하여 관찰하였다. 또한 플라즈마 처리시간이 금속섬유의 표면에 미치는 영향을 관찰하기 위해 극성 용매와 비극성 용매에 대한 금속섬유의 접촉각 변화를 측정하였다. 측정된 접촉각을 이용해 표면 자유에너지 변화를 계산한 후 산소 플라즈마 처리 전, 후의 금속섬유에 대한 접촉각과 표면 자유에너지를 비교하였으며 접착일과의 상관관계도 고찰하였다. 이런 금속섬유의 표면 변화가 다른 소재와의 복합 시 계면에서의 전단강도 향상에 미치는 영향을 알아보기 위해 microdroplet 시편을 제조하여 계면 전단강도를 측정하였으며 접착일과의 상관관계도 함께 파악하였다. 따라서, 금속섬유의 산소플라즈마 처리는 섬유표면에 물리적인 표면적 증가로 인한 수지와의 접촉면의 증가와 표면의 산소함유 기능성 관능기의 도입에 따른 접촉각, 표면 에너지의 변화에 따른 표면 친수화로 고분자 수지와의 계면 전단강도를 향상시켜주는 결과를 얻었다.

• 한국전기전자재료학회논문지
• /
• 제21권8호
• /
• pp.776-781
• /
• 2008

In this study, ubiquitous health care system attaching in chair to monitor ECG for health care was developed at the unconsciousness state. The system conveniently and simple measured ECG at non-consciousness. We measured the contact impedance to skin-electrode of metal mesh electrodes of the system. Contact impedance enable the electrode to use for ECG measurement. The results are that the impedance of the metal mesh electrodes according to sizes is low when the size is 4$cm^2$. As the result, when the size of the metal mesh electrode is 4$cm^2$, the electrode is fit for ECG measurement. We can acquired by positing the arm on the metal mesh electrode. The ECG signal was detected using a high-input-impedance bio-amplifier, and then passed filter circuitry. The measured signal transmitted to a PC through the bluetooth wireless communication and monitored. Data of the non-constrained ECG system attaching in chair is noise-data when comparing metal mesh electrode with the Ag/Agcl electrode but the data is significant to monitor ECG for check the body state.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2010년도 하계학술대회 논문집
• /
• pp.349-349
• /
• 2010

Great performance of many semiconductor devices requirs the use of low-resistance ohmic contact. Typically, transmission line method (TLM) patterns are used to measure the specific contact resistance between silicon and metal. In this works, we investigate contact resistance for metal dependent (Cr/Ag, Ni) using TLM pattern based on silicon-on-insulator (SOI) wafer. The electrode with Ni linearly increases contact resistance as the pattern distance increase from $15{\mu}m$ to $75{\mu}m$ in accumulation part, but non-linearly increase in inversion part. In additional, the electrode with Cr/Ag linearly increases contact resistance as the pattern distance increase from $15{\mu}m$ to $75{\mu}m$ in inversion part, but non-linearly increase in accumulation part.

• 한국태양에너지학회:학술대회논문집
• /
• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
• /
• pp.225-229
• /
• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• 대한기계학회논문집A
• /
• 제35권6호
• /
• pp.643-649
• /
• 2011

LNG 선박에 사용되는 초저온용 버터플라이 밸브의 개발에 있어, 누설검증은 가장 중요한 설계공정 중 하나이다. 초저온에서 누설방지가 가능한 실로서 인코넬 스프링과 같은 탄성지지체가 포함된 O-링 형태의 메탈실이 널리 사용되고 있으나, 제작비가 고가인 단점을 갖고 있다. 이에 대한 대안으로 부가적인 탄성지지체 없이도 누설조건을 만족시키며, 제작비가 저렴한 탄성 메탈실의 개발이 요구되고 있다. 본 연구에서는 탄성 메탈실의 누설방지를 위한 설계조건을 정립하여, 초저온 및 고압환경에서 누설방지가 가능한 탄성 메탈실의 형상을 수치해석을 통해 고찰하였다. 아울러 이를 기반으로 시제품을 개발하고, 상온 및 초저온 상태에서 BS6755 및 BS6364 에 준하는 누설시험을 실시하여 누설여부를 확인하였다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
• /
• pp.290-293
• /
• 2003

Ohmic contact characteristics of Al ion implanted n-type SiC wafer were investigated. Al ions implanted with high dose to obtain the final concentration of $5{\times}10^{19}/cm^3$, then annealed at high temperature. Firstly, B ion ion implanted p-well region were formed which is needed for fabrication of SiC devices such as DIMOSFET and un diode. Secondly, Al implanted high dose region for ohmic contact were formed. After ion implantation, the samples were annealed at high temperature up to $1600^{\circ}C\;and\;1700^{\circ}C$ for 30 min in order to activate the implanted ions electrically. Both the inear TLM and circular TLM method were used for characterization. Ni/Ti metal layer was used for contact metal which is widely used in fabrication of ohmic contacts for n-type SiC. The metal layer was deposited by using RF sputtering and rapid thermal annealed at $950^{\circ}C$ for 90sec. Good ohmic contact characteristics could be obtained regardless of measuring methods. The measured specific contact resistivity for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$ were $1.8{\times}10^{-3}{\Omega}cm^2$, $5.6{\times}10^{-5}{\Omega}cm^2$, respectively. Using the same metal and same process of the ohmic contacts in n-type SiC, it is found possible to make a good ohmic contacts to p-type SiC. It is very helpful for fabricating a integrated SiC devices. In addition, we obtained that the ratio of the electrically activated ions to the implanted Al ions were 10% and 60% for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$, respectively.

• 설비공학논문집
• /
• 제26권1호
• /
• pp.32-37
• /
• 2014

The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2003년도 춘계학술대회 논문집
• /
• pp.1569-1572
• /
• 2003

Meshfree approximations exhibit significant potential to solve partial differential equations. Meshfree methods have been successfully applied to various problems which the traditional finite element methods have difficulties to handle, including the quasi-static and dynamic fracture. large deformation problems, contact problems, and strain localization problems. A meshfree method based on the reproducing kernel particle approximation(RKPM) is applied to sheet metal forming analysis in this research. Metal forming examples, such as stretch forming and flanging operation, are analyzed to demonstrate the performance of the proposed meshfree method for largely deformed elasto-plastic material.