• Title/Summary/Keyword: Metal-to-metal contact

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Finite Element Modeling of Rubber Pad Forming Process (고무 패드 성형 공정의 유한요소 모델링)

  • 신수정;이태수;오수익
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.9
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    • pp.117-126
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    • 1998
  • For investigating rubber pad sheet metal forming process, the rubber pad deformation characteristics as well as the contact problem of rubber pad-sheet metal has been analyzed. In this paper, the behavior of the rubber deformation is represented by hyper-elastic constitutive relations based on a generalized Mooney-Rivlin model. Finite element procedures for the two-dimensional responses, employing total Lagrangian formulations are implemented in an implicit form. The volumetric incompressibility condition of the rubber deformation is included in the formulation by using penalty method. The sheet metal is characterized by elasto-plastic material with strain hardening effect and analyzed by a commercial code. The contact procedure and interface program between rubber pad and sheet metal are implemented. Inflation experiment of circular rubber pad identifies the behaviour of the rubber pad deformation during the process. The various form dies and scaled down apparatus of the rubber-pad forming process are fabricated for simulating realistic forming process. The obtaining experimental data and FEM solutions were compared. The numerical solutions illustrate fair agreement with experimental results. The forming pressure distribution according to the dimensions of sheet metal and rubber pads, various rubber models and rubber material are also compared and discussed.

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A Study to Improve PEMFC Performance by Using Electro Polishing and CrN Coating on Metal Bipolar Plate (금속분리판의 Electro Polishing 및 CrN 코팅을 통한 PEMFC 성능 향상을 위한 연구)

  • Hwang, Sung Tack;Cheon, Seung Ho;Song, Jun Seok;Yun, Young-Hoon;Kim, Byeong Heon;Zhang, Xia;Kim, Dae-Ung;Hyun, Deoksu;Oh, Byeong Soo
    • Transactions of the Korean Society of Automotive Engineers
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    • v.22 no.4
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    • pp.65-71
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    • 2014
  • As an important component of a fuel cell, the bipolar plate comprises a large proportion in the fuel cell's volume, weight and price. The bipolar plate is the most widely used; however, graphite bipolar plate is large in volume, brittle and therefore easily broken during assembling. In addition, due to its poor machinability, production costs a lot, unless mass production. Compared with the graphite bipolar plate, the metal bipolar plate has good machinability, high electric conductivity and strong mechanical strength; however, it corrodes easily and has a high contact resistance, so in order to prevent corrosion and reduce the contact resistance, the basic metal needs to be processed by use of electro polishing and coating. The water which is produced by electrochemical reactions in the fuel cell must be discharged smoothly. In this study, in order to prevent corrosion the processes of electro polishing and CrN coating were used. According to the presence or absence of these processes, the contact angles can be measured and different metal bipolar plates can be made, these plates can be used for comparing and analyzing the performance of the fuel cell.

Metal-Semiconductor-Metal Photodetector Fabricated on Thin Polysilicon Film (다결정 실리콘 박막으로 구성된 Metal-Semiconductor-Metal 광검출기의 제조)

  • Lee, Jae-Sung;Choi, Kyeong-Keun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.5
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    • pp.276-283
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    • 2017
  • A polysilicon-based metal-semiconductor-metal (MSM) photodetector was fabricated by means of our new methods. Its photoresponse characteristics were analyzed to see if it could be applied to a sensor system. The processes on which this study focused were an alloy-annealing process to form metal-polysilicon contacts, a post-annealing process for better light absorption of as-deposited polysilicon, and a passivation process for lowering defect density in polysilicon. When the alloy annealing was achieved at about $400^{\circ}C$, metal-polysilicon Schottky contacts sustained a stable potential barrier, decreasing the dark current. For better surface morphology of polysilicon, rapid thermal annealing (RTA) or furnace annealing at around $900^{\circ}C$ was suitable as a post-annealing process, because it supplied polysilicon layers with a smoother surface and a proper grain size for photon absorption. For the passivation of defects in polysilicon, hydrogen-ion implantation was chosen, because it is easy to implant hydrogen into the polysilicon. MSM photodetectors based on the suggested processes showed a higher sensitivity for photocurrent detection and a stable Schottky contact barrier to lower the dark current and are therefore applicable to sensor systems.

A Proposal of Wheel/Rail Contact Model for Friction Control

  • Matsumoto Kosuke;Suda Yoshihiro;Komine Hisanao;Nakai Takuji;Tomeoka Masao;Shimizu Kunihito;Tanimoto Masuhisa;Kishimoto Yasushi;Fujii Takashi
    • Journal of Mechanical Science and Technology
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    • v.19 no.spc1
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    • pp.437-443
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    • 2005
  • Controlling the friction between wheel and rail is direct and very effective measures to improve the curving performances of railway trucks, because the curving performances depend much on friction characteristics. Authors have proposed a method, 'friction control', which utilizes friction modifier ($KELTRACK^{TM}$ HPF) with onboard spraying system. With the method, not only friction coefficient, but also friction characteristics can be controlled as expected. In this study, MBD simulation is very valuable tool to foresee the effect of the control in advance of experiment with real car. And the creep characteristics of wheel/rail contact with the friction modifier takes very important role in the simulation. In this paper, authors propose a theoretical model of wheel/rail contact condition considering the creep characteristics of friction modifier, which is derived the application of principle tribological theories.

The Prediction of Interfacial Heat Transfer Coefficient According to Contact Time and Pressure in Forging and Casting Die Materials for the Hot Press Forming (핫프레스포밍용 주조, 단조 금형에 대한 시간과 압력에 따른 대류열전달계수의 예측)

  • Kim, N.H.;Kang, C.G.
    • Transactions of Materials Processing
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    • v.19 no.6
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    • pp.378-386
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    • 2010
  • Nowadays there has been great interest in using heat treated cast material for press dies due to several advantages like reduction in die production costs. However, in hot press forming processes H13 forged tool steel is mostly used. Cooling performance of dies in hot press forming processes is considered as an important factor of study and also the IHTC parameter between cast material die and sheet metal should be considered as an essential. In the present study, the IHTC was calculated for the sheet metal in the hot press forming process with cast and forged material dies. The temperature measurements were performed for the sheet metal, casting and forged material dies by applying various contact pressure in hot press forming. IHTC was calculated and studied by adopting the inverse heat convection method in DEFORM-2D. Each IHTC was considered as a function of contact time and contact pressure. The experimental data were compared with calculated data obtained from the proposed equation and references.

A Computational Study for Designing Electrical Contacts to MoS2 Monolayers

  • Kim, Hwi-Su;Ha, Hyeon-U
    • Proceeding of EDISON Challenge
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    • 2014.03a
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    • pp.478-482
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    • 2014
  • Graphene have renewed considerable interest in inorganic, two-dimensional materials for future electronics. However, graphene does not have a bandgap, it is limited to apply directly to transistors and logic devices. Hence, other layered materials such as molybdenum disulphide ($MoS_2$) have been investigated to address this challenge. Here, we find that the nature of contacts plays a more important role than the semiconductor itself. In order to understand the nature of $MoS_2$/metal contacts, we perform density functional theory electronic structure calculations based on linear combination of atomic for the geometry, bonding, binding energy, PDOS, LDOS and electronic structure. We choose Au as a contact metal because it is the most common contact metal. In this paper, we demonstrate $MoS_2$/Au contacts have a more promising potential in flexible nanoelectronics than $MoS_2$ itself.

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Estimation on Serrated Core Machining Load for Metal Gasket using Elasto-plastic Analysis (탄소성해석을 이용한 금속 개스킷용 톱니형 코어 가공 하중 평가)

  • Kim, Tae-Hyung;Lee, Seong-Wook
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.6
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    • pp.145-151
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    • 2012
  • In this study, finite element analysis is carried out to estimate horizontal forces needed for the required power calculation and vertical forces applied on the structural analysis model for the development of automatic serrated surface at metal gasket core machining system. By considering of elasto-plastic material characteristics, nonlinear contact analysis was conducted to compute these loads according to the change of roll reduction, frictional coefficient and core thickness. As the result, horizontal and vertical reaction force variations are found according to parameters and maximum reaction force is also confirmed to be most affected by roll reduction.

Ohmic Contact of P-type GaAs Implanted the Liquid Metal Ion (액체금속이온이 주입된 p형 GaAs의 오옴성 접촉)

  • 김송강;강태원;홍치유;임재영;엄기석;이재환;위영호;이정주
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.26 no.9
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    • pp.1381-1387
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    • 1989
  • For the fabrication of ohmic contact to p-type GaAs, In Liquid Metal Ions were implanted into p-type GaAs (Zn:1.5x10**19/cm**3). After the samples were processed by Infrared rapid thermal annealing (IRTA0 or Furance Annealing (FA), I-V and specific contact contact resistivity were measured. Specific contact resistivity was found to be 1.7x10**-5 \ulcorner-cm\ulcornerin IRTA 750\ulcorner, 10 sec annealed sample. The surface characteristics of the samples were investigated with SEM, RHEED, AES. From these results we can know that implanted In ions were formed mixing layer of InAs at the surface.

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The Ohmic Contact of n-GaAs Using by Liquid Metal Ion Source (액체금속이온원을 이용한 n형 GaAs의 오옴성 접촉)

  • 강태원;이정주;김송강;홍치유;임재영;강승언
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.26 no.12
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    • pp.1995-2000
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    • 1989
  • The ion beam system of 20keV C-W (Cockroft Walton) type composed of the AuGe alloy LMIS(Liquid Metal Ion Source) has been designed and constructed. For the fabrication of the ohmic contact to the n-GaAs, the ion beam extracted from the AuGe alloy source was implanted into the n-GaAs, and it was measured by contact resistivity. The stable AuGe ion beam(2.5\ulcorner/cm\ulcorner was obtained at the extraction voltage of 14.5kV. The measurements of the contact resistivity were done by the TLM (Transmission Line Model) method and the specific contact resistivity was found to be 2.4x10**-5 \ulcornercm\ulcornerfor the implanted sample by the 1.9x10**20/cm**3 and the annealed sample at 30\ulcorner for 2 min.

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A Study on the Reduction the Thermal Contact Resistances at the Interface Between a Porous Metal Wick and Solid Heating Plate for a Circular Plate LHP (원판형 LHP 증발부의 소결 금속 윅에서의 접촉 저항에 관한 연구)

  • Jo, Jung-Rae;Choi, Jee-Hoon;Sung, Byung-Ho;Ki, Jae-Hyung;Ryoo, Seong-Ryoul;Kim, Chul-Ju
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2357-2362
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    • 2008
  • LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

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