• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.169-172
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• 2002

This study demonstrated the feasibility of using tape-casting followed by sintering as a low-cost alternative for coating glass-ceramic or glass film on a metal substrate. The process has been successfully used to fabricate a glass-on-stainless steel and a glass-ceramic-on-molybdenum electrostatic chuck(ESC) with the insulating layer thickness about $150{\mu}{\textrm}{m}$. Electrical resistivity data of the coaling were obtained between room temperature and 55$0^{\circ}C$; although the resistivity values dropped rapidly with increasing temperature in both coatings, the glass-ceramic still retained a high value of $10^{10}$ ohm-cm at $500^{\circ}C$. Clamping pressure measurements were done using a mechanical apparatus equipped with a load-cell at temperatures up to $350^{\circ}C$ and applied voltages up to 600V; the clamping behavior of all ESCs generally followed the voltage-squared curve as predicted by theory. Based on these results, we believe that we have a viable technology for manufacturing ESCs for use in reactive-ion etch systems.

• Progress in Superconductivity and Cryogenics
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• v.24 no.3
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• pp.30-34
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• 2022

Effects of electron beam (EB) irradiation on the mechanical strength of Cu (conducting sheath) and Nb (diffusion barrier) of Cu/Nb/MgB₂ superconducting was investigated. Wire- and tape-type Cu/Nb/MgB₂ samples were irradiated at E-beam energy of 2.5 MeV and 5 mA and a maximum E-beam dose was 5×10¹⁷ e/m². The hardness value of Cu and Nb region was measured by the Vickers micro-hardness method. In the case of the wire sample, the hardness of Cu and Nb increased proportionally as the dose was increased up to 5×10¹⁷ e/m², whereas in the case of the tape sample, the hardness increased up to a dose of 0.5×10¹⁷ e/m², and decreased slightly 5×10¹⁷ e/m². The hardness increase of Cu and Nb is believed to be due to the decrease of the deformability of Cu and Nb due to the defects formed inside the materials by E-beam irradiation.

• Progress in Superconductivity and Cryogenics
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• v.12 no.2
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• pp.9-12
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• 2010

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

• Progress in Superconductivity and Cryogenics
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• v.8 no.3
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• pp.37-40
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• 2006

Oxide buffer layers for YBCO coated conductors were fabricated using MOD processing and development of microstructure and texture were investigated. A $CeO_2$ buffer layers were formed on RABiTS tape. Acetate-based precursor solution was employed to synthesize the precursor solution. Subsequently, the precursor solution was stabilized and modified with triethanolamine. $CeO_2$ precursor gel film was coated and annealed in $Ar/H_2$ atmosphere at high temperature. An annealed $CeO_2$ film shows mixed orientation with high (001) texturing. It was shown that (111) texture of $CeO_2$ layers were enhanced by multiple coating. This degradation was attributed to development of microcracks in the multiply coated $CeO_2$ films. Also discussed are the synthesis and the characterization of $La_2Zr_2O_7$ (LZO) buffer layers on RABiTS tape. A biaxially textured LZO buffer layer was fabricated with MOD processing method using metal alkoxide based precursor solution. It was shown that the LZO film were epitaxially grown on RABiTS tape and crack-free & uniform surface was obtained after annealing in $Ar/H_2$ atmosphere.

• Progress in Superconductivity
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• v.5 no.1
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• pp.65-69
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• 2003

Many researches on fabrication process for BSCCO precursor powders have been developed for high J$_{c}$ BSCCO-2223 tape. Spray pyrolysis method for fabrication of precursor powder has many advantages, such as high purity, fine particle size and low carbon content of BSCCO precursor powder. Fine, spherical powders were prepared by ultrasonic spray pyrolysis from the aqueous solution of metal nitrates. BSCCO precursor powders were synthesized with various solutes concentration and heat treatment conditions. Average particle size for spray pyrolysis powders was $1.5∼3\mu\textrm{m}$. Bi-2223/Ag tape was prepared by PIT method and followed by various sintering conditions. BSCCO precursor powders were characterized by XRD, SEM, EDS, Carbon content and particle size analysis.s.

• Progress in Superconductivity
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• v.6 no.2
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• pp.124-128
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• 2005

Homogeneous and fine powders for Bi-2223 tape were prepared by ultrasonic spray pyrolysis (SP) method from an aqueous solution of metal nitrates. Bi-2223 precursor powders were synthesized with various solutes concentration and pyrolysis temperature. The synthesized precursor powders had a narrow particle size distribution and an average particle size was $\~{\cal}um$. The reactivity of precursor powder by SP method is very high, attributed to the fine and narrow particle size distribution. Bi-2223/Ag tape was prepared using PIT method and followed by various sintering conditions. The precursor powder by SP method promoted a very quick formation of the Bi-2223 phase for short sintering time while the secondary phase such as large AEC phase and $Ca_2PbO_4$ were minimized for SP tapes.

• Journal of the Korean institute of surface engineering
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• v.24 no.2
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• pp.67-72
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• 1991

The feasibility of preparing superconducting $Y_1Ba_2Cu_3O_y$ films on metallic substrate was exmined in an attempt to fabricate a tape conductor. Deposition methods employed were sputtering, laser ablation, and plasma flash evaporation. Although zero resistance temperature (Tc) is achieved above 90 K, critical current density values (Jc) obtained so far is still low as compared with those reported in the films grown on single crystal substrates. This may be caused by the misalignment of the crystal structure of the films on metal substrates. A further improvement if Jc for highly-oriented polycrystalling films is being investigated at the present time.

• Progress in Superconductivity and Cryogenics
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• v.9 no.4
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• pp.1-6
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• 2007

We describe methods for depositing high temperature superconducting films on textured metal tapes by reactive co-evaporation (RCE). We discuss how RCE can be used to deposit on moving tape in a continuous fashion in a Garching-style process. Results are presented on films deposited by RCE at Los Alamos on IBAD-MgO textured tapes. The performance achieved, attaining over 500A/cm-width in self-field at 75.5 K, is competitive with the best results obtained by other processes for coated conductors. Tape production throughput is critical for the economics of the process and high deposition rates achieved in RCE are attractive for this. We present a detailed cost analysis model for HTS deposition using an RCE Garching process. The results indicate that HTS deposition can cost $<$5/kA{\cdot}m$ in a scaled up manufacturing environment.

• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.423-429
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• 2005

In this paper, we proposed the fabrication process of the stable e-beam evaporation and the patterning of metals layer on the polydimethylsiloxane (PDMS) substrate. The metal layer was deposited under the various deposition rate, and its effect to the electrical and mechanical properties (e.g.: adhesion-strength of metal layer) was investigated. The influence of surface roughness to the adhesion-strength was also examined via the tape test. Here, we varied the roughness by changing the reactive ion etching (RIE) duration. The electrode patterning was performed through the conventional photolithography and chemical etching process after e-beam deposition of $200{\AA}$ Ti and $1000{\AA}$ Au. As a result, the adhesion strength of metal layer on the PDMS surface was greatly improved by the oxygen plasma treatment. The e-beam evaporation on the PDMS surface is known to create the wavy topography. Here, we found that such wavy patterns do not effect to the electrical and mechanical properties. In conclusion, the metal patterns with minimum $20{\mu}m$ line width was produced well via the our fabrication process, and its electrical conductance was almost similar to the that of metal patterns on the silicon or glass substrates.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.229-229
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• 2012

Adhesion of Copper film on the aluminum oxide layer formed by anodizing an aluminum plate was enhanced by applying ion beam mixing method. Forming an conductive metal layer on the insulating oxide surface without using adhesive epoxy bonds provide metal-PCB(Printed Circuit Board) better thermal conductivities, which are crucial for high power electric device working condition. IBM (Ion beam mixing) process consists of 3 steps; a preliminary deposition of an film, ion beam bombardment, and additional deposition of film with a proper thickness for the application. For the deposition of the films, e-beam evaporation method was used and 70 KeV N-ions were applied for the ion beam bombardment in this work. Adhesions of the interfaces measured by the adhesive tape test and the pull-off test showed an enhancement with the aid of IBM and the adhesion of the ion-beam-mixed films were commercially acceptable. The mixing feature of the atoms near the interface was studied by scanning electron microscopy, Auger electron spectroscopy, and X-ray photoelectron spectroscopy.