• Journal of the Korean institute of surface engineering
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• v.48 no.4
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• pp.149-157
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• 2015

We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.

• Journal of the Korean institute of surface engineering
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• v.12 no.3
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• pp.161-166
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• 1979

Theoretical and practical aspects are investigated for electrochemical behavious, plating processes and the structures of electrodeposit of Pb-Sn binary alloy plating through numerous literatures in this report. The anodic and cathodic electrode reaction mechanisms of Pb and Sn could co-deposit and make Pb-Sn alloy deposit from the results of cathode current density-cathode potential curves of Pb, Sn and Pb-Sn alloys in fluoborate solutions. The compositions of the best alloy plating solutions are obtained for the purpose of bearing, anticorrosion and solder plating. In general, the casting anodes of Pb-Sn alloys are used, but separated anodes of Pb and Sn pure metal are used in order to obtain the fine compositions of Pb-Sn alloy deposits. The electrodeposits of Pb-Sn alloy are in nonequilibrium state and saturated solid solutions. Thus, ${\beta}$-phase (Sn-phase) is precipitated by heat treatment. The texture and structure of the electrodeposit are associated with the surface energies of deposit lattice planes and with the cathode polarization. The electrodeposit of Pb-Sn alloy is shown as lamellar structure.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.3
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• pp.445-451
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• 2016

General fuse elements of solution for fast acting operation characteristics made using silver or silver alloy, those are not able to dominate cost competition to the advanced global leaders that have not only high technology but competitive price. In this study, the method that compose the fuse elements manufactured solution of fast acting operation characteristics by using precision multi-layer thin film plating and helical cutting process from low-priced copper metal. Furthermore, in order to move rated current line of fuse due to the heat loses, the manufacture construction method of fixed resistor is introduced, and then Ni-P plating layer and Sn plating layer are introduced multiply for controling fine opening time characteristics. So this study can establish the high productive and low-priced production method.

• Journal of the Korean Graphic Arts Communication Society
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• v.18 no.2
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• pp.133-141
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• 2000

Enhanced the value of badge good with the gold plating of emblem, sports pictogram, mascot in 2002 Asian Game and World Cup, applying the plating and coating technique to screen printing. In addition, tourist and characteristic goods were of great value and image of visual communication displayed outside. After the screen printing in the surface of stainless steel, it obtained the plate coloring of beautiful a black glossy with a black Ru plating. At the identical surface, it did that the electrodeposition coating process in order to making a conductor state of image areas and a nonconductor state of nonimage areas. After the electrodeposition process, it removed the printing ink of image areas with solvent. A manufacturing process, it removed the printing ink of image areas with solvent. A manufacturing process completed with copper, nickel and gold plating at bared metal surface.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.214-219
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• 2009

In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.7
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• pp.575-579
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• 2010

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance caused by a better contact conductivity of Ni with Si and the subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading was combined with the lower resistance of a metal silicide contact and an improved conductivity of the plated deposit. This improves the FF (fill factor) as the series resistance is reduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopeds regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this paper the formation of a selective emitter, and the nickel silicide seed layer at the front side metallization of silicon cells is considered. After generating the nickel seed layer the contacts were thickened by Cu LIP (light induced plating) and by the formation of a plated Ni/Cu two step metallization on front contacts. In fabricating a Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.49-55
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• 2006

The effect of coating temperature with regard to surface properties of TiN-coated layer on hard metal(WC-Co) are experimentally investigated. Hardness, surface roughness, TiN coating thickness and adsorption force were measured in order to evaluate the effect of coating temperature. The two-way ANOVA method is used in order to evaluate the experimental data. In AIP processing, It is concluded that the furnace temperature in the range of $400^{\circ}C\~500^{\circ}C$ affected to a little increasing the number of production with the coating temperature.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.12
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• pp.601-607
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• 2002

IPMC(Ionic Polymer Metal Composite)actuators were optimized for producing improved forces by changing multiple parameters including repetition of number of plating, surface electroding and additive(PVP)-treatment on reduction. The platinum electrode is deposited on the surface of the material where platinum particle stay in a dense form that appears to introduce a significant level of surface electrode resistance. Actuation tests were performed for such IPMC actuators under a low voltage. The test results show that the lower surface-electrode resistance generates higher actuation capability in the IPMC actuators. In order to investigate relaxation behavior of bending and repeatability in dry condition, the IPMC was coated by$rubber(KRATON^{TM})$to minimize the effect of water evaporation from IPMC. This actuator can be used in air with surface coating to avoid membrane drying.

• Journal of Powder Materials
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• v.29 no.6
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• pp.511-516
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• 2022

Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn-Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.

• Journal of Advanced Navigation Technology
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• v.28 no.4
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• pp.544-551
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• 2024

In this study, the electrochemical polarization data required for the simulation of the plating process, simulation of plating conditions, and characterization of the plating layer were discussed. The electrochemical polarization data obtained by potentiodynamic polarization tests and potentiostat analysis of Ni and Cu were used to observe changes in the overvoltage distribution with the flow conditions of the plating solution. In the simulation of plating conditions, the current density distribution and plating thickness distribution were evaluated under different variables to analyze the influence of the location and number of contacts on the rack pins on the plating quality. Simulation results under variables such as anode geometry, interpole distance, auxiliary anode placement, and variation of substrate spacing were used to explore ways to improve plating thickness deviation. Additionally, plating layer characterization analyzed the thickness, adhesion, and delamination of the plating layer with and without buffer layer formation. The simulation results can be utilized as important basic data for improving the efficiency and quality of the plating process.