• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.239-242
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• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• 한국정밀공학회지
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• 제16권11호
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• pp.74-80
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• 1999

In this study, a stereolithography apparatus (SLA) prototype is used as a master model to be transformed into the silicone pattern by vacuum tool forming. The tool for the first prototype is fabricated by using this silicone pattern. Following this procedure, a temporary tool with metal powder and epoxy for wax injection is prepared for the die set of quick change type which consists of upper and lower base die나 and an insert die. The die set of quick change type appears to be very effective in casting operation by changing tools rapidly. The original wax pattern is formed through the die set, and is made of lost-was. Finally the lost-wax pattern is applied to investment casting. The final casting product is checked regarding its dimensional accuracy.

• 대한기계학회논문집A
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• 제28권5호
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• pp.624-631
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• 2004

In this paper, new replication techniques fur a metal microcomponent having a real 3D shape were introduced. Helical gear was selected as one of a real 3D microcomponents for this study. The helical gear, which was made of photo-curable resin, was fabricated as a master pattern by microstereolithography technology. Then, a silicone rubber mold was fabricated from the master pattern. Lastly, a final bismuth alloy pattern was transferred from the silicone rubber mold by the microcasting process. In this paper, the replication technique is described in detail from the master pattern to the final pattern with some investigation on factors related to the technique.

• 한국주조공학회지
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• 제24권5호
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• pp.265-272
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• 2004

• 한국재료학회:학술대회논문집
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• 한국재료학회 2006년도 추계학술발표대회 및 제11회 신소재 심포지엄
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• pp.27.2-27.2
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• 2006

• 한국재료학회:학술대회논문집
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• 한국재료학회 2002년도 추계학술발표강연 및 논문개요집
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• pp.110-110
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• 2002

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.254-258
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• 2009

In this paper, the low frequency vibration forming system is developed for micro-patterns formation on the metal substrate. many researchers have studied about micro-forming technologies such as micro deep drawing, press forming, forging, extrusion etc. for the formation of precise micro-patterns on the surface of metal substrates, multi-step forming process must be used to improve qualifies of the deformed patterns. Since the low frequency vibration forming system could easily deform the surface of metal substrates, several steps of multi-step forming process should be removed by using the low frequency vibration forming system. In order to find optimal process conditions, we have carried out low frequency vibration forming process with varying the vibration frequency from 110Hz to 500Hz.

• 한국감성과학회:학술대회논문집
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• 한국감성과학회 2009년도 추계학술대회
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• pp.20-24
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• 2009

Mobile의 기술발달과 보편화에 따라 소비자들은 Mobil이 자기 개성 표현인 액세서리화되고, 더욱 감성적이고 차별화된 디자인을 요구함에 따라, 기업들은 이런 소비자들의 개성화 감성화의 니즈를 표면처리 디자인 기술로 효율적으로 적용해 소비자의 감성만족을 시키려 하고 있다. 국내외 Mobile 시장에서 Metal Case 외장의 2차원적인 디자인패턴은 다양한 표면처리 가공 접근이 용이하지 못하고, 패턴디자인의 한계에 이르렇다. E/F(INLET)의 도금 가공 기술의 Concept은 "원활한 모재의 제품 박리성" 에 있으나, 역발상으로 "Metal 모재와의 밀착성"으로 제품디자인을 구현하여, 제품의 도금 두께층 및 신뢰성 기술 확보함으로, 표면층에 사진, 그림, 인물 풍경, 자연물이미지 등의 다양한 감성디자인패턴의 구현이 가능해졌다. 산업기술자원부의 디자인혁신센터로 중소기업디자인개발 지원을 위해 설립된 중앙대학교 디자인경영센터와 SR I-TECH의 기술력으로 3차원 감성디자인패턴을 개발하게 되었다.

• Transactions on Electrical and Electronic Materials
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• 제16권6호
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• pp.312-316
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• 2015

Through silicon via (TSV) technology holds the promise of chip-to-chip or chip-to-package interconnections for higher performance with reduced signal delay and power consumption. It includes high aspect ratio silicon etching, insulation liner deposition, and seamless metal filling. The desired etch profile should be straightforward, but high aspect ratio silicon etching is still a challenge. In this paper, we investigate the use of etch hard mask for finer TSVs etching to have clear definition of etched via pattern. Conventionally employed photoresist methods were initially evaluated as reference processes, and oxide and metal hard mask were investigated. We admit that pure metal mask is rarely employed in industry, but the etch result of metal mask support why hard mask are more realistic for finer TSV etching than conventional photoresist and oxide mask.

• 전기학회논문지
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• 제59권12호
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• pp.2235-2239
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• 2010

In this study, The cation exchange membrane and the anion exchange membrane affect in electrical conduction of metal fuel cell was investigated. Magnesium material as anode electrode and the NaCl solution dissolved with 5~15wt% as electrolyte were used for the metal fuel cell. It was found that magnesium slag where flows toward the air electrode was suppressed by using ion exchange membrane. The open circuit voltage variation during discharge has very flat pattern by using ion exchange membrane, but the case which is not the exchange membrane, the open circuit voltage increased according to time. When using the anion exchange membrane, the electric current was higher case of the cation exchange membrane, as a result of higher equivalent conductivity in anion Cl-. The cation exchange membrane was observed with the fact that the output power is excellent in compared with anion exchange membrane.