• Journal of Electrochemical Science and Technology
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• 제4권1호
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• pp.1-18
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• 2013

Gallium is an important element in the production of a variety of compound semiconductors for optoelectronic devices. Gallium has a low melting point and is easily oxidized to give oxides of different compositions that depend on the conditions of solutions containing Ga. Gallium electrode reaction is highly irreversible in acidic media at the dropping mercury electrode. The passive film on a gallium surface is formed during anodic oxidation of gallium metal in alkaline media. Besides, some results in published reports have not been consistent and reproducible. An increase in the demand of intermetallic compounds and semiconductors containing gallium gives rise to studies on electrosynthesis of them and an increase of gallium concentration in the environment with various application of gallium causes the development of electroanalysis tools of Ga. It is required to understand the electrochemistry of Ga and to predict the electrochemical behavior of Ga to meet these needs. Any review papers related to the electrochemistry of gallium have not been published since 1978, when the review on the subject was published by Popova et al. In this study, the redox behavior, anodic oxidation, and electrodeposition of gallium, and trace determination of gallium by stripping voltammetries will be reviewed.

• 한국자기학회지
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• 제23권1호
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• pp.12-17
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• 2013

금속 분말 니켈(Ni)을 HCl용액에 용해시킨 후 $H_3BO_3$, KOH을 첨가하여 Chloride 도금용액을 제조 후 Ni plate 기판에 도금하였다. 도금두께는 $3{\mu}m$로 일정하게 유지하였다. 전류밀도를 $1{\sim}30mA/cm^2$ 변화를 준 결과 전류밀도를 증가시킬수록 Ni 후막표면이 거칠어졌다. $25mA/cm^2$와 $30mA/cm^2$에서는 균열된 표면형상을 관찰하였다. 또한 XRD patterns 변화를 관찰한 결과 전류밀도가 증가할수록 FCC(111)과 FCC(220) 및 FCC(311)상의 강도는 증가한 반면 FCC(200)상의 강도는 감소하는 것을 관찰하였다. 전기도금된 Ni의 수평 및 수직 자화 값을 측정하였는데 기판에 의한 수평자화 값이 크게 나왔고, 코팅층 두께가 증가할수록 수직자화 값이 커지는 것을 확인하였다.

• 한국표면공학회지
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• 제48권3호
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• pp.73-81
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• 2015

Chloride plating solution was fabricated by dissolving metal Ni powders in solution with HCl and deionized water. Effects of deposition conditions on the properties of Ni films electrodeposited from chloride baths were studied. Current efficiency of Ni films electrodeposited from the baths containing saccharin was decreased with increasing the current density. Residual stress of Ni thin films ware measured to be about 230 ~ 435 MPa in the range of current density of $10{\sim}25mA/cm^2$. Cathode current efficiency in baths without saccharin was initially increased with increasing pH, while it was decreased with increasing pH further. Cathode current efficiency in baths with saccharin (except at pH 2) exhibited less 10 ~ 20% than that in baths without saccharin. Residual stress of Ni films electrodeposited from baths without saccharin was measured to be 388 ~ 473 MPa in the range of pH 2 ~ pH 5 and then was increased to 551 MPa at pH 6. On the other hand, residual stress of Ni films electrodeposited from baths with saccharin was increased with increasing pH. Surface morphology was strongly affected by the change of current density, but slightly by solution pH and addition of saccharin.

• 대한치과보철학회지
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• 제29권3호
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• pp.111-119
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• 1991

This study was performed to investigate the effect of gold electrodepositoin on porcelain color of palladium-silver alloy. The specimens were made by firing porcelain on the metal plates cast respectively in Au-Pt alloy, and Pd-Ag alloy. In the case of Pd-Ag alloy specimens, porcelain were fired under three different conditions of the metal plate: 1) without gold coating, 2) firing opaque beforehand on one side, gold coating on the other side, 3) gold coating on both sides of the metal plate. Color change was measured with fiber-optic colorimeter(Model TC-6FX, Tokyo Denshoku Co., Japan). The obtained results were as follows: 1. In the group of firing opaque beforehand on one side and gold coating on the other side, there was no significant differences in their color in comparison to the color of the control group of the Au-Pt alloys. 2. In the group of gold coating on both sides on metal plate, there were no significant differences except their value to the group of firing poaque beforehand on one side and gold coating on the other side.

• 공업화학
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• 제3권3호
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• pp.482-490
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• 1992

세종류의 금속산화물 전극을 양극으로 사용하여 methanol 용액중에서 furfuryl alcohol을 양극산화 시켜 2,5-dimethoxy-2,5-dihydrofurfuryl alcohol을 전해합성 하였다. 각 전극들은 티타늄 재질상에 산화주석($SnO_2$)과 삼산화이안티몬($Sb_2O_3$)의 반도체 혼합물층을 전기로 내에어 만들고, 그 위에 양극산화방법으로 ${\alpha}-PbO_2$, ${\beta}-PbO_2$, $MnO_2$등의 금속산화물을 전착(electrodeposition)하여 3종의 전극을 제작하였다. 이산화납 전극이 이산화망간 전극에 비하여 양극 내식성이 우수하였으며 생성물의 수율(92%)도 백금전극을 사용했던 결과와 대등하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.29.1-29.1
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• 2011

ReRAM은 metal-oxide-metal구조로 차세대 비활성 메모리를 대체하기 위하여 연구되어왔다. ReRAM은 낮은 전력 소모와 다른 두 저항상태 사이의 높은 scalability를 갖는 장점이 있지만 높은 reset전류와 일정하지 않은 저항 값을 갖고 있어 실용화에 어려움을 겪고 있다. 저항변화현상의 메커니즘은 일반적으로 일정 전압이 가해 졌을 때, MIM 구조의 산화물 내에서 필라멘트가 형성되었다 파괴되는 것으로 알려져 있다. 저항스위칭 메모리의 작동능력을 증진시키기 위해서는, oxide층의 두께조절, 산화층과 electrode 사이의 계면 특성 연구가 필요하다. 본 연구에서는, 전기화학증착법을 이용하여 Au-NiO-Au segmented 나노와이어 구조를 만들었다. 전기화학증착 방법을 이용하면 에칭 손상없이 간단하게 나노 구조체를 형성 할 수 있고, 나노 사이즈로 제작된 산화층이 전도성 필라멘트가 형성되는 영역을 제한하여 reset전류를 줄일 수 있는 장점이 있다. 또한 열처리 과정에서 Au가 NiO부분에 diffusion되는 현상을 이용하여 doping에 따른 switching 변화 특성도 관찰하였다.

• 한국자기학회지
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• 제27권4호
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• pp.135-139
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• 2017

직경 $190{\mu}m$ Cu 와이어에 $Ni_{80}Fe_{20}$ 연자성 물질을 전기도금법으로 증착하여 금속 코어/연자성 쉘 구조의 복합 와이어를 제작하고 이 와이어에서 자기임피던스 효과(MI 효과)를 연구하였다. 원통 좌표계에서 복합 와이어의 임피던스 텐서의 두 대각 성분 $Z_{{\theta}{\theta}}$와 $Z_{zz}$는 z 방향으로 가한 자기장에 대해 큰 MI 효과를 나타낸 반면, 비대각 임피던스 $Z_{{\theta}z}$의 MI 효과는 매우 약하게 나타났다. 비대각 자기임피던스 효과가 큰 복합 와이어를 만들기 위해 비틀림 스트레인 하에서 전기도금하는 방법을 시도하였다. Cu 와이어의 한쪽 끝을 약 $270^{\circ}$ 이상 회전한 상태에서 전기도금 된 복합 와이어는 뚜렷하게 증대된 비대각 MI 효과를 보였으며 $360^{\circ}$ 회전한 상태에서 도금 된 와이어에서 최대의 비대각 MI 효과를 얻을 수 있었다. 본 연구를 통해 비대각 MI 효과가 큰 복합와이어를 제작하는 방법을 개발한 것은 금속 코어/자성 쉘 복합 와이어의 자기센서 소재로써의 응용가능성을 높일 것으로 기대된다.

• Journal of Electrochemical Science and Technology
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• 제11권2호
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• pp.172-179
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• 2020

The impact of effective parameters on the electrodeposition rate optimization of Au-Cu alloy at high thicknesses on the silver substrate was investigated in the present study. After ensuring the formation of gold alloy deposits with the desired and standard percentage of gold with the cartage of 18K and other standard karats that should be observed in the manufacturing of the gold and jewelry artifacts, comparing the rate of gold-copper deposition by direct and pulsed current was done. The rate of deposition with pulse current was significantly higher than direct current. In this process, the duty cycle parameter was effectively optimized by the "one factor at a time" method to achieve maximum deposition rate. Particular parameters in this work were direct and pulse current densities, bath temperature, concentration of gold and cyanide ions in electrolyte, pH, agitation and wetting agent additive. Scanning electron microscopy (SEM) and surface chemical analysis system (EDS) were used to study the effect of deposition on the cross-sections of the formed layers. The results revealed that the Au-Cu alloy layer formed with concentrations of 6gr·L^-1 Au, 55gr·L^-1 Cu, 24 gr·L^-1 KCN and 1 ml·L^-1 Lauryl dimethyl amine oxide (LDAO) in the 0.6 mA·cm^-2 average current density and 30% duty cycle, had 0.841 ㎛·min^-1 Which was the highest deposition rate. The use of electrodeposition of pure and alloy gold thick layers as a production method can reduce the use of gold metal in the production of hallow gold artifacts, create sophisticated and unique models, and diversify production by maintaining standard karats, hardness, thickness and mechanical strength. This will not only make the process economical, it will also provide significant added value to the gold artifacts. By pulsating of currents and increasing the duty cycle means reducing the pulse off-time, and if the pulse off-time becomes too short, the electric double layer would not have sufficient growth time, and its thickness decreases. These results show the effect of pulsed current on increasing the electrodeposition rate of Au-Cu alloy confirming the previous studies on the effect of pulsed current on increasing the deposition rate of Au-Cu alloy.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.123.1-123.1
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• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• 한국수소및신에너지학회논문집
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• 제22권5호
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• pp.656-662
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• 2011

The purpose of this study was to correlate between photoelectrochemcial hydrogen production rate and electron transfer with various types of metal doped $TiO_2$ nanotubes as photoanodes. In order to fabricate light sensitized photoanode, CdS, $WO_3$, and Pt were doped by electrodeposition method. As the results of experiments, the electron transfer was favorable from higher position to lower position of conduction band (CB). In consequence, the higher hydrogen production rate was as follows, CdS/$TiO_2$ (100 $umol/hr-cm^2$) > $WO_3/TiO_2$ (20 $umol/hr-cm^2$) > Pt/$TiO_2$ (10 $umol/hr-cm^2$). The surface characterizations exhibited that crystal structure, morphological and electrical properties of various metal depoed $TiO_2$ nanotubes by the results of SEM, TEM, XPS, and photocurrent measurements.