• Journal of Powder Materials
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• v.1 no.1
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• pp.35-41
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• 1994

Mechanical alloying process of Al-8wt.% Ni powder was investigated for the various milling time in order to get the steady state powder. High temperature deformation behaviors of the sintered specimens were investigated by activation energy calculated after high temperature compression tests at the strain rates of 2.5$\times$10-3 s-1, 2.5$\times$10-2 s-1 and 2.5$\times$10-1 s-1 at the temperature range between $350^{\circ}C$ and $450^{\circ}C$. The steady state was obtained after 1000 minutes of milling with the PCA of 1.5 wt.% stearic acid under the condition of grinding media to powder weight ratio of 50 : 1 and impeller rotating speed of 300 rpm. True activation energy of Al-8wt.% Fe alloy was estimated to be 181 kJ/mole at the temperature range of 350~ $400^{\circ}C$ and 265 kJ/mole at the range of 400~$450^{\circ}C$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1998.06b
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• pp.43-53
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• 1998

Heat - affected zones degenerated in cold forging die have been investigated to improve the tool life. There are many cases of heat-affected zone which are degenerated in manufacturing die and using the cold forging process. In order to define amounts of grinding inmanufacturing the toolfor cold forging, we have investigated the hardness and microstructure of surface layer after EDM. Considering the results of T.R.S. and compression test, it is likely that mechanical properties of tool have been decreased sharply if the heat-affected zones degenerated by EDM were not machined properly. also analyzed the tool surfac which is fractured during the cold forging. According to the microstructures and hardness distribution, surface of many tools have been degenerated in cold forging and fractured due to the heat-affected zone.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.3
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• pp.165-171
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• 1997

Laser hardening for the piston ring groove of ductile cast iron was tried. Mechanical and microstructural investigation for the hardened area indicated that the laser heating technique could replace conventional induction hardening process completely and further showed that post grinding process would be eliminated by minimizing bulging of heat treated area. In laser hardening, the volume increase caused by martensitic phase transformation proved to be less than $10{\mu}m$, which insures no post machining on the hardened surface. As expected, the depth of hardening was inversely proportional to the beam scanning velocity and the highest surface hardness was obtained at the beam velocity of 0.75m/min. Heat treatment using phosphate coating demonstrated quite comparable result to the case of graphite suscepter.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.103-107
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• 2006

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.5
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• pp.431-436
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• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method and this process was found to be a very accurate method for SOI thickness control. During electrochemical etch-stop leakage current versus voltage curves were measured for analysis of the open current potential(OCP) point the passivation potential(PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.362-365
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• 1999

This paper describes on thinning SDB SOI substrates by SDB technology and electrochemical etch-stop. The surface of the fabricated SDB SOI substrates is more uniform than that grinding or polishing by mechanical method, and this process is possible to accurate SOI thickness control. During Electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential (OCP) point and the passivation potential (PP) poin and determinated to anodic substrates were analyzed by using AFM and SEM, respectivelv.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.18-22
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by grinding, lapping and polishing. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. This mechanical stress and strain can be cured by thermal anneal ing process. The sapphire crystalline wafers were annealed at $1100~1400^{\circ}C$ and then characterized by double crystal X-ray diffraction. The sample showed good quality of crystalline wafer surface wi th full width at hal f maximum of 16 arcsec for the 4-hour heat-treatment at $1300^{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.5
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• pp.48-52
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• 2019

A coolant pump is the device that cools processed articles and tools when using cutting, boring, and grinding machine tools and provides cutting oil for distributing or cleansing the cut chip to the worktable, processing position, etc. In particular, it consumes a large proportion of energy in machine tools, so it plays an important role in terms of energy efficiency. The purpose of this research is to optimize the shape of impeller, which directly affects performance improvements, to determine the capacity of the coolant pump. To do so, we carried out a parametric analysis with the geometric shape of the impeller as the input variable.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.06a
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• pp.27-28
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• 2020

In this study, as a measure to recycle red mud, which is a byproduct of the Bayer Process, red mud was manufactured as liquid and recycled without drying and grinding. Previous studies have shown that mechanical performance decreases when liquid red mud is applied to cement concrete. Therefore, in this study, liquid red mud was neutralized with nitric acid and applied to cement paste to examine the properties of cement paste according to the addition of red mud. As a result, the compressive strength of 10% liquid red mud decreased by 37.7% compared to Plain, and 10% liquid red mud indicates similar strength to Plain and restores the strength.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.1
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• pp.70-76
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• 1993

Burnishing, as a micro plastic working, is a finishing process used in conjuction with or in replacement of reaming, honing, lapping, and/or grinding. The tool which is a smooth, round steel ball slightly larger than the bore is pushed through pre-machined hole, leaving a closely controlled finish. The major application of the processes is to improve the geometric and mechanical properties of surface such as (1) dimensional accuracy, (2) surface roughness, (3) bearing ratio, (4) surface hardness, (5) wear resistance, (6) fatigue and corrosion resistance, etc. Therefore, this study carried out some experiments to illustrate the theoretical formula and to investigate surface accuracy (e.g. variation of diameter, surface roughness, bearing ratio) in accordance with the applied burnishing load.