• Journal of Institute of Control, Robotics and Systems
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• v.21 no.11
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• pp.1008-1016
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• 2015

This paper proposes a method for detecting the front side of vehicles. The method can find the car side with a license plate even with complicated and cluttered backgrounds. A convolutional neural network (CNN) is used to solve the detection problem as a unified framework combining feature detection, classification, searching, and localization estimation and improve the reliability of the system with simplicity of usage. The proposed CNN structure avoids sliding window search to find the locations of vehicles and reduces the computing time to achieve real-time processing. Multiple responses of the network for vehicle position are further processed by a weighted clustering and probabilistic threshold decision method. Experiments using real images in parking lots show the reliability of the method.

• Journal of the military operations research society of Korea
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• v.1 no.1
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• pp.131-135
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• 1975

One of the pending issues of the Ministry of Defense is the efficient management of space parts for the weapon systems. It has been known that more than 000 million dollars are needed for spare parts for the weapon systems annually. Though the problem demands a serious consideration, there has not been any systematic study on the problem as far as the author knows. One way to approach the problem is through an investigation of the system reliability under constraints. A measure of how well a system performs or meets its design objectives is provided by the concept of system reliability. If successful operation is desired for a specified period of time, reliability is defined as the probability that the system will perform satisfactorily for the required time period. This interpretation of reliability is normally applied to devices which are subject to random failures such as electrical or mechanical systems. It has been found necessary to express system reliability in terms of the reliability of the components or subsystems which comprise the system. The major subsystems of an aircraft, for example, include the electronics, powerplant, airframe and armament subsystems. Therefore, the optimal spare part kit can be found by maximizing the system reliability subject to cost or other constraints.

• Korean Journal of Materials Research
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• v.19 no.5
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• Steel and Composite Structures
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• v.28 no.2
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• pp.195-207
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• 2018

First-order reliability method (FORM) is enhanced based on the search direction using relaxed conjugate reliability (RCR) approach for the embedded nanocomposite beam under buckling failure mode. The RCR method is formulated using discrete conjugate map with a limited scalar factor. A dynamical relaxed factor is proposed to control instability of proposed RCR, which is adjusted using sufficient descent condition. The characteristic of equivalent materials for nanocomposite beam are obtained by micro-electro-mechanical model. The probabilistic model of nanocomposite beam is simulated using the sinusoidal shear deformation theory (SSDT). The beam is subjected to external applied voltage in thickness direction and the surrounding elastic medium is modeled by Pasternak foundation. The governing equations are derived in terms of energy method and Hamilton's principal. Using exact solution, the implicit buckling limit state function of nanocomposite beam is proposed, which is involved various random variables including thickness of beam, length of beam, spring constant of foundation, shear constant of foundation, applied voltage, and volume fraction of ZnO nanoparticles in polymer. The robustness, accuracy and efficiency of proposed RCR method are evaluated for this engineering structural reliability problem. The results demonstrate that proposed RCR method is more accurate and robust than the excising reliability methods-based FORM. The volume fraction of ZnO nanoparticles and the applied voltage are the sensitive variables on the reliable levels of the nanocomposite beams.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.93-99
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• 2016

In this paper, we investigated the mechanical and electrical reliability of silver nanowire (AgNW) films. In particular, the durability and reliability of AgNW films were studied when the AgNW film was subjected to the bending deformation under current flow. The electrical durability of AgNW was evaluated by observing changes in heat generation and current density occurring in AgNW through voltage and current tests. The AgNW film showed a constant resistance change up to a bending radius of 2 mm and 200,000 cycles in the bending fatigue tests. The over-coating layer has an effect of improving the durability of the AgNW film. In the case of AgNW with the over-coating layer, heat was uniformly dissipated on the surface of AgNW film, whereas in the case of AgNW film without the over-coating layer, heat was generated locally. In the bending test under the current flow, the current density of the AgNW film was continuously decreased up to 52.4%. During bending, the AgNW was deformed due to mechanical deformation such as tensile, bending and sliding of the AgNW, consequently contact resistance of the AgNW was increased, leading to a electrical breakdown of AgNW by Joule heating. It was found that the application of the over-coating layer can improve the electrical and mechanical reliability of the AgNW film.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.53-57
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• 2013

Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.27 no.6
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• pp.635-642
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• 2014

In this paper, an efficient technique is developed to predict failure probability of three failure modes(case rupture, fracture and bolt breakage) related to solid rocket motor case due to the inner pressure during the mission flight. The overall procedure consists of the steps: 1) design parameters affecting the case failure are identified and their uncertainties are modelled by probability distribution, 2) combustion analysis in the interior of the case is carried out to obtain maximum expected operating pressure(MEOP), 3) stress and other structural performances are evaluated by finite element analysis(FEA), and 4) failure probabilities are calculated for the above mentioned failure modes. Axi-symmetric assumption for FEA is employed for simplification while contact between bolted joint is accounted for. Efficient procedure is developed to evaluate failure probability which consists of finding first an Most Probable Failure Point(MPP) using First-Order Reliability Method(FORM), next making a response surface model around the MPP using Latin Hypercube Sampling(LHS), and finally calculating failure probability by employing Importance Sampling.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.17-22
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• 2018

In this paper, the effects of solder joint aging on the reliability of embedded package solder joints were investigated using numerical analysis by finite element method. Solder joints were SAC305 with aging time 0, 60, 180 days. For reliability analysis, warpage of package and equivalent creep strain (ECS) and total strain energy density (TSED) of solder joint were analyzed. The analysis results show that the package warpage is decreased in the case of the embedded package compared to the non embedded package, and the reliability life of the solder joint is predicted to be high. Also, it was interpreted that the longer the aging time, the less the warpage of the embedded package, but the reliability life of the solder joint would be shortened.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.46 no.2
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• pp.167-174
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• 2018

The heater is applied to the lunar lander for securing its survivability under severe lunar thermal environment during 14 days of night time. For this, the heater on/off set-points shall be determined to minimize the power consumption due to the limited power generation of lunar lander during night time. In addition, the temperature changes of the lander according to the heater set-point is also an important factor because it is related to thermo-mechanical reliability on solder joint of on-board electronics. In this study, we investigated thermo-mechanical reliability on solder joint according to the heater set-point by using commercial reliability and a life prediction tool of Sherlock based on the thermal analysis results of lunar lander that is a year of the mission lifetime.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.