• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.8 s.251
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• pp.985-992
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• 2006

Many methods for reliability analysis have been studied and one of them, a moment method, has the advantage that it doesn't require sensitivities of performance functions. The moment method for reliability analysis requires the first four moments of a performance function and then Pearson system is used for the probability of failure where the accuracy of the probability of failure greatly depends on that of the first four moments. But it is generally impossible to assess them analytically for multidimensional functions, and numerical integration is mainly used to estimate the moment. However, numerical integration requires many function evaluations and in case of involving finite element analyses, the calculation of the first fo 따 moments is very time-consuming. To solve the problem, this research proposes a new method of approximating the first four moments based on kriging metamodel. The proposed method substitutes the kriging metamodel for the performance function and can also evaluate the accuracy of the calculated moments adjusting the approximation range. Numerical examples show the proposed method can approximate the moments accurately with the less function evaluations and evaluate the accuracy of the calculated moments.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.12
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• pp.1464-1470
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• 2009

RBDO approach based on a sampling method with the Kriging metamodel and Constraint Boundary Sampling (CBS), which is sequential sampling method to generate metamodels is proposed. The major advantage of the proposed RBDO approach is that it does not require Most Probable failure Point (MPP) which is essential for First-Order Reliability Method (FORM)-based RBDO approach. The Monte Carlo Sampling (MCS), most well-known method of the sampling methods for the reliability analysis is used to assess the reliability of constraints. In addition, a Cumulative Distribution Function (CDF) of the constraints is approximated using Moving Least Square (MLS) method from empirical distribution function. It is possible to acquire a probability of failure and its analytic sensitivities by using an approximate function of the CDF for the constraints. Moreover, a concept of inactive design is adapted to improve a numerical efficiency of the proposed approach. Computational accuracy and efficiency of the proposed RBDO approach are demonstrated by numerical and engineering problems.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.8
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• pp.1388-1397
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• 2003

Since the reliability of adhesively bonded joints for composite structures is dependent on many parameters such as the shape and dimensions of joints, type of applied load, and environment, so an accurate estimation of the fatigue life of adhesively bonded joints is seldom possible, which necessitates an in-situ reliability monitoring of the joints during the operation of structures. In this study, a self-sensor method for adhesively bonded joints was devised, in which the adhesive used works as a piezoelectric material to send changing signals depending on the integrity of the joint. From the investigation, it was found that the electric charge increased gradually as cracks initiated and propagated in the adhesive layer, and had its maximum value when the adhesively bonded joint failed. So it is feasible to monitor the integrity of the joint during its lifetime. Finally, a relationship between the piezoelectric property of the adhesive and crack propagation was obtained from the experimental results.

• Proceedings of the Korean Reliability Society Conference
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• 2004.07a
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• pp.147-151
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• 2004

In this study, an optical fiber assembly directly coupled with a laser diode or a photo diode is designed to confirm high reliable optical coupling efficiency of optical transmitter(Tx) and receiver(Rx). The optical fiber assembly is fabricated by soldering an optical fiber and a Kovar ferrule using a glass solder after inserting an optical fiber through a Kovar ferrule. The Kovar which has good welding characteristics is applied to introduce laser welding technique. The glass solder has excellent thermal characteristics such as thermal shift delamination compared with PbSn, AuSn solder previously used usually. Furthermore, the glass solder doesn't need fiber metalization and this enables low cost fabrication. However, the glass soldering is high temperature process over 35$0^{\circ}C$ and the convex shape after solidification due to surface tension causes the stress concentration on optical fiber. The stress concentration on the optical fiber increases the optical insertion loss and possibility of crack formation. The shape of glass solder was designed referring to 2-D Axi-symmetric FEM simulation. To test the mechanical reliability, mechanical vibration test and shock test were done according to Telcorida GR-468-Core protocol. After each test, the optical loss of the stress distributed fiber assembly didn't exceed 0.5 dB, which passes the test.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.30-41
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• 2023

With the aggressive down-scaling of advanced integrated circuits (ICs), electronic packages have become the bottleneck of both reliability and performance of whole electronic systems. In order to resolve the reliability issues, Institute of Electrical and Electronics Engineers (IEEE) laid down a roadmap on fault detection and diagnosis (FDD), thrusting the digital twin: a combination of reliability physics and artificial intelligence (AI). In this paper, we especially review research works regarding the signal-based FDD approaches on the electronic packages. We also discuss the research trend of FDD utilizing AI techniques.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.67-72
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• 2010

In this paper, a design optimization of ball grid array packaging geometry is studied based on the Taguchi method, which allowed robust design by considering the variance of the input parameters during the optimization process. Molding compound and substrate were modeled as viscoelastic, and finite element analyses were performed to calculate the strain energy densities of the eutectic solder balls. Six quality factors of the dimensions of the packaging geometry were chosen as control factors. After performing noise experiments to determine the dominant factors, main experiments were conducted to find the optimum packaging geometry. Then the strain energy densities between the original and optimized geometries were compared. It was found that the effects of the packaging geometry on the solder ball reliability were significant, and more than 40% of the strain energy density was reduced by the geometry optimization.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.1-7
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• 2016

The cutting processes used for monitoring engineering includes analysis and feedback about strange conditions, tools collision and tools wear in real time, for improving the working ratio of equipment and productivity. In this study, we proposed monitoring using profibus to increase the reliability as the most important factor for cutting monitoring. The profibus can increase the reliability of cutting monitoring for cutting torque of a main spindle motor and a feed motors through PLC-based interface.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.489-493
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• 2012

Automatic tool changers(ATCs) store tools used in a machining center to its magazine and changes the tools automatically. Tools of machine centers are changed and then precisely equipped to spindle system by the ATC. Therefore, the stability and reliability of the ATC is very important. But, there is lack of development and evaluation on basic performance and vibration of the ATCs. So, in this study, a BT40 ATC test bench was developed to verify stability and reliability of BT40 ATCs.

• Tribology and Lubricants
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• v.25 no.2
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• pp.114-119
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• 2009

Fretting occurs wherever short amplitude reciprocating sliding between contacting surfaces is sustained for a large number of cycles. The fundamental characteristic of fretting is the very small amplitude of sliding and combination of different wear mechanism. Predicting wear is important to enhance reliability of the parts. The objective of this paper is to predict fretting wear by using a contact analysis considering wear process. This construction will give us important information to know a property of fretting wear.

• Journal of Applied Reliability
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• v.7 no.2
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• pp.45-55
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• 2007

In this study, two types of fatigue tests were conducted. Firs, cyclic bending tests were performed using the micro-bending tester. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. Creep deformation was dominant in thermal fatigue and plastic deformation was main parameter for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.