• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.235.1-235.1
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• 2014

Precise measurement of plasma parameters including density and temperature is the most essential part for understanding plasma characteristics. To persue more accurate measurement, it is very important to understand the intrinsic error of the measurement method. In this paper, we performed the plasma measurement with different method; langmuire probe and cutoff probe. Both measurement technology are known to be exactly correlate with etch other. We conducted the four set of same experiments process by diffrent persons to observe the intrinsic error based on measurement tools. As a result, the cutoff probe is relatively reliable then the Langmuir probe. This difference is analyzed to be intrinsic since it cames from the inevitable error such as manufacturing of probe tip. From this study, we sure that it is good decision to choose cutoff probe as repeatable measurement independent with intrinsic human factor.

• Journal of the Korean Institute of Telematics and Electronics
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• 제25권3호
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• pp.302-307
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• 1988

A noble interconnection line capacitance measurement method to be able to remove the measurement errors from the probe pad to substrate stray capacitance has been proposed and verified. The measurement errors in the capacitance measurement, which usually be involved from the probe pad to substrate stray capacitance, can easily be removed by isolating the metal probe pad from the substrate with a grounded shield plate between the probe pad the substrate. The measurement results by using this improved capacitance measurement method were compared with the calculations by two-dimensional computer simulations.

• Journal of Periodontal and Implant Science
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• 제26권1호
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• pp.244-254
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• 1996

The periodontal probe is a commonly used instrument to assess periodontal conditions. And so, there has been many studies to develop the accuracy and reproducibility of the periodontal probe. The purpose of this study was to compare two different periodontal probes for measurement reliability and time required to use in subjects with moderate periodontitis. It was done after evaluating reproducibility of probing depth by stent guiding for a Manual probe and a Florida probe in subjects with healthy periodontal condition. The results were as follows 1. In experiment to evaluate the reproducibility of probing depth by stent guiding for a Manual probe and Florida probe in subjects with healthy periodontal condition, there was no major significant difference between intraprobe and interprobe relationships. 2. There were reduced probing measuremint error by using the Florida probe for posterior teeth and by using the Manual probe for anterior teeth of subjects with moderate periodontitis. 3. At proximal area, there was higher measurement error by using the Manual probe than the Florida probe. 4. The mean of pocket depth measurement using Manual probe was signifi cantly higher than that using Florida probe(p<0.05). With increasing pocket depth, interprobe difference increased and reproducibility reduced. 5. There was no significant difference in time required to use between Manual probe and Florida probe(p<0.05). 6. There was slight probing measurement difference between Manual probe and Florida probe at different site, but both probes have similar degrees of reproducibility and similar time required to probe.

• The Transactions of The Korean Institute of Electrical Engineers
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• 제60권7호
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• pp.1434-1437
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• 2011

Precision measurement of silicon wafer resistivity has been using single-configuration Four-Point Probe(FPP) method. This FPP method have to applying sample size, shape and thickness correction factor for a probe pin spacing to precision measurement of silicon wafer. The deference for resistivity measurement values applied correction factor and not applied correction factor was about 1.0 % deviation. The sample size, shape and thickness correction factor for a probe pin spacing have an effects on precision measurement for resistivity of silicon wafer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2010년도 춘계학술대회 논문집
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• pp.12-12
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• 2010

The hall probe measurement system was used to measure the critical current distribution of superconducting coated conductor. The system consists of reel to reel moving apparatus, 7 array hall probe, a rotary encoder and permanent magnet. The magnetic field profile across the width of superconducting coated conductor using Bean's critical state model was calculated. The effect of various parameters of the formulas on the magnetic field distribution and the effect of shape and size of artificial defects, which were formed on the surface of SmBa2Cu3O7-d(SmBCO) coated conductor using laser marking system, on the hall probe magnetic field signal of the hall probe measurement system was investigated.

• Journal of the Korean Society for Precision Engineering
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• 제25권5호
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• pp.140-147
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• 2008

In this study, a carbon nanotube probe (CNT probe) is proposed as a mechanical force transducer for the measurement of pico-Newton (pN) order force in biological applications. In order to measure nantube's displacement in the air or liquid environment, the fabrication of a CNT probe with tip-specific loading of fluorescent dyes is performed using tip- specific functionalization of the nanotube and chemical bonding between dyes and nanotube. Also, we experimentally investigated the mechanical properties of the CNT probe using electrostatic actuation and fluorescence microscope measurement. Using fluorescence measurement of the tip deflection according to the applied voltage, we optimized the bending stiffness of the CNT probe, therefore determined the spring constant of the CNT probe. The results show that the spring constant of CNT probes is as small as 1 pN/nm and CNT probes can be used to measure pN order force.

• Journal of the Korean Society for Precision Engineering
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• 제16권10호
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• pp.172-181
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• 1999

The objective of this research is to develop a measurement error model for sculptured surfaces in On-Machine Measurement (OMM) process based on a closed-loop configuration. The geometric error model of each axis of a vertical CNC Machining center is derived using a 4${\times}$4 homogeneous transformation matrix. The ideal locations of a touch-type probe for the scupltured surface measurement are calculated from the parametric surface representation and X-, Y- directional geometric errors of the machine. Also, the actual coordinates of the probe are calculated by considering the pre-travel variation of a probe and Z-directional geometric errors. Then, the step-by-step measurement error analysis method is suggested based on a closed-loop configuration of the machining center including workpiece and probe errors. The simulation study shows the simplicity and effectiveness of the proposed error modeling strategy.

• Journal of the Korean Society for Precision Engineering
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• 제17권1호
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• pp.129-137
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• 2000

In this paper, a new method of noncontact measurement has been developed for a 3 dimensional topography in semiconductor wafer, implementing a new optical probe based on the precision defocus measurement. The developed technique consists of the new optical probe, precision stages, and the measurement/control system. The basic principle of the technique is to use the reflected slit beam from the specimen surface, and to measure the deviation of the specimen surface. The defocusing distance can be measured by the reflected slit beam, where the defocused image is measured by the proposed optical probe, giving very high resolution. The distance measuring formula has been proposed for the developed probe, using the laws of geometric optics. The precision calibration technique has been applied, giving about 10 nanometer resolution and 72 nanometer of four sigma uncertainty. In order to quantitize the micro pattern in the specimen surface, some efficient analysis algorithms have been developed to analyse the 3D topography pattern and some parameters of the surface. The developed system has been successfully applied to measure the wafer surface, demonstrating the line scanning feature and excellent 3 dimensional measurement capability.

• International Journal of Precision Engineering and Manufacturing
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• 제2권2호
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• pp.73-80
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• 2001

The objective of this research is to develop a measurement error model for sculptured surface in On-Machine Measurement(OMM) process based on a closed-loop configuration. The geometric error model of each axis of a vertical CNC machining center is derived using a 4$\times$4 homogeneous transformation matrix. The ideal locations of a touch-type probe for the sculptured surface measurement are calculated from the parametric surface representation and X-, Y- directional geometric errors of the machine. Also the actual coordinates of the probe are calculated by considering the pre-travel variation of a probe and Z-directional geometric errors. Then, the step-by-sep measurement error analysis method is suggested based on a closed-loop configuration of the machining center including workpiece and probe errors. The simulation study shows the simplicity and effectiveness of the proposed error modeling strategy.

• Journal of the Korean Society for Precision Engineering
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• 제13권10호
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• pp.71-77
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• 1996

This paper describes the development of on the machine measuring(OMM) system which can directlry measure the three dimensional machined dimensilnal accuracy using scanning probe in milling machine. Two algolithms, continuous path(CP) measurement using UC program and CAD data assisted point to point(PTP) measurement, were developed regarding specification of scanning probe. The OMM system was contructed to verify the developed system suing the proposed algorithm, and actually measured three kinds of machined TV shadow mask molds. The developed system was evaluated it's repeatability and compared with the current measurement system of CMM(Coording Measuring Machine) in terms of relative accuracy and time reduction and productivity increase.