• 한국세라믹학회지
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• 제39권9호
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• pp.863-870
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• 2002

$Pb(Fe_{1/2}Ta_{1/2})O_3$의 $Ta^{5+}$을 $Ta^{5+}$과 이온반경이 같고 원자량이 약 1/2배인 $Nb^{5+}$으로 치환한 $Pb{{Fe_{1/2}(Ta_(1-x)Nb_x)_{1/2}}O_3$ (x=0.0∼1.0) 고용체를 단일상으로 합성하여 그 유전특성 및 B자리 양이온 질서배열구조를 조사하였다. $Pb(Fe_{1/2}Ta_{1/2})O_3$는 유전완화현상 및 완만한 상전이가 뚜렷하게 관찰되는 전형적인 완화형 강유전특성을 보였지만, $Ta^{5+}$이 $Nb^{5+}$으로 치환됨에 따라 유전완화현상은 감소하고 상전이는 급격해져 결국 $Pb(Fe_{1/2}Nb_{1/2})O_3$는 유전완화현상이 전혀 관찰되지 않는 정상 강유전특성을 보였다. Raman 분광법에 의해 $Pb(Fe_{1/2}Ta_{1/2})O_3$의 $Fe^{3+}$과 $Ta^{5+}$은 XRD는 물론 TEM의 제한시야회절패턴으로도 검출하기 어려울 정도의 단거리영역에서 화학양론적으로 1:1 질서배열하고 있으며, $Ta^{5+}$이 $Nb^{5+}$으로 치환됨에 따라 $Fe^{3+}$과 ($Ta^{5+}-Nb^{5+}$) 간의 질서배열은 약화되어 결국 $Pb(Fe_{1/2}Nb_{1/2})O_3$의 $Fe^{3+}$과 $Nb^{5+}$은 완전 무질서배열하고 있음이 밝혀졌다. $Pb(Fe_{1/2}Ta_{1/2})O_3$의 완화형 강유전특성은 B자리 양이온들이 XRD는 물론 TEM의 제한시야회절패턴으로도 검출하기 어려울 정도의 단거리영역에서 화학양론적 1:1 질서배열을 하고 있는 것과, 또 $Pb(Fe_{1/2}Ta_{1/2})O_3$의 $Ta^{5+}$이 $Nb^{5+}$으로 치환됨에 따라 완화형 강유전특성이 감소되는 것은 이 질서배열이 약화되는 것과 그리고 $Pb(Fe_{1/2}Nb_{1/2})O_3$의 정상 강유전특성은 B자리 양이온들이 완전 무질서배열을 하고 있는 것과 연관지을 수 있었다.

• 전자공학회논문지D
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• 제36D권9호
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• pp.37-45
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• 1999

박막형 다중접합 열전변환기의 시간에 따른 출력 전압 변화를 감소시키기 위해 벌크의 저항온도계수가 매우 적은 EVANOHM-S 합금을 박막 히터재료로 사용하였고, 또한 Seebeck 계수차이가 비교적 작은 크로멜-알루멜 열전쌍을 박막 열전퇴(thermopile)의 열전요소로 하였다. EVANOHM-S 박막 히터의 저항온도계수는 약 $1.4 {\times} 10^4/^{\circ}C$ 였고, 크로멜-알루멜 박막 열전쌍의 Seebeck 계수차이는 약 $38 {\mu}V/K$였다. 열전변환기의 출력 전압 변화는 공기중에서 처음 120초 동안 약 0.06%였고, 약 5분간이상 히터의 예열후 출력전압 변화는 현저히 감소하였다. 10 Hz ~ 10 kHz의 주파수 범위에서 열전변환기의 교류-직류 전압 및 전류 변환 오차범위는 각각 ${\pm}$1.6 ppm 및 ${\pm}$0.7 ppm이었고, 10Hz 이하 또는 10 kHz 이상의 주파수에서는 교류-직류 변환오차가 크게 증가하였다.

• Journal of Radiation Protection and Research
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• 제47권1호
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• pp.1-7
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• 2022

Background: In Japan, new regulations that revise the dose limit for the lens of the eye (hereafter the lens), operational quantities, and measurement positions for the lens dose were enforced in April 2021. Based on the international safety standards, national guidelines, the results of the Radiation Safety Research Promotion Fund of the Nuclear Regulation Authority, and other studies, the Working Group of Radiation Protection Standardization Committee, the Japan Health Physics Society (JHPS) developed a guideline for radiation dose monitoring for the lens. Materials and Methods: The Working Group of the JHPS discussed the criteria of non-uniform exposure and the management criteria set not to exceed the dose limit for the lens. Results and Discussion: In July 2020, the JHPS guideline was published. The guideline consists of three parts: main text, explanations, and 26 examples. In the questions, the corresponding answers were prepared, and specific examples were provided to enable similar cases to be addressed. Conclusion: With the development of the guideline on radiation dose monitoring of the lens, radiation managers and workers will be able to smoothly comply with revised regulations and optimize radiation protection.

• 한국자기학회지
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• 제23권6호
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• pp.205-208
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• 2013

${\delta}$E 효과는 재료의 영율(Young's modulus)이 자화 상태에 따라 변화하는 효과를 말한다. 본 연구에서는 두께 $25{\mu}m$, 길이 30 mm의 비정질 리본 2605SC를 폭 3 mm, 5 mm, 8.5 mm로 각각 에칭하여 외부 자기장 세기와 시편의 폭 변화에 따른 영율의 변화를 임피던스 공명 측정을 이용하여 측정하였다. 인가 자기장이 증가함에 따라 영율이 증가하는 것과, 시편의 폭이 넓을수록 시편에 인가되는 유효 자기장이 감소하여 영율이 감소하는 결과를 볼 수 있었고, 단원자 모델로 계산한 결과와 비교적 잘 일치하는 것을 확인하였으며, 외부 자기장 세기에 따라 변화하는 영율(${\delta}$E)의 선형적 변화 영역을 이용한 선형 자기센서 제작 가능성을 확인하였다.

• 분석과학
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• 제16권1호
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• pp.1-11
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• 2003

본 연구는 화학공장의 실내작업장에서 화학적/생물학적 모니터링 방법을 동시에 이용하여 유해물질의 존재를 평가하고자 하였다. 실내작업장의 VOCs 분석을 위하여 Tenax TA 400 mg이 충전된 흡착관을 이용하여 시료 채취하였다. 채취한 시료는 가스크로마토그래피/질량분석법 (GC/MS)으로 분석하였다. 동시에 유해성 평가를 위해 Tradescantia BNL 4430 클론을 실내 작업장에 노출시켰다. GC/MS 분석결과 trichloroethylen, toluene, ethylbenzene, xylenes, styrene, trimethylbenzene과 같은 다양한 VOC가 검출되는 것으로 나타났다. 자주달개비 미세핵 (Trad-MCN) 분석결과 실내 작업장의 다양한 유해물질에 의한 생성률 증가가 뚜렷하게 나타났다. 실외에서는 자연적 발생범위에 해당하는 미세핵 생성률을 보였다. 결론적으로, Tradescantia 미세핵 생성률의 결과로 보아 화학공장 실내 작업장의 휘발성물질은 근로자들에게 만성적으로 건강에 위해를 끼칠 것으로 판단된다. 화학적 모니터링과 생물학적 유해성 평가방법을 병행함으로서 실내 작업장에서 유해물질을 평가하는데 매우 효과적인 것으로 나타났다.

• 한국안전학회지
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• 제30권1호
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• pp.21-27
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• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.

• International Journal of Concrete Structures and Materials
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• 제9권2호
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• pp.241-254
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• 2015

A lot of reinforced concrete (RC) structures in Syria went out of service after a few years of construction. This was mainly due to reinforcement corrosion or chemical attack on concrete. The use of blended cements is growing rapidly in the construction industry due to economical, ecological and technical benefits. Syria is relatively rich in scoria. In the study, mortar/concrete specimens were produced with seven types of cement: one plain Portland cement (control) and six blended cements with replacement levels ranging from 10 to 35 %. Rapid chloride penetration test was carried in accordance with ASTM C 1202 after two curing times of 28 and 90 days. The effect on the resistance of concrete against damage caused by corrosion of the embedded steel has been investigated using an accelerated corrosion test by impressing a constant anodic potential. The variation of current with time and time to failure of RC specimens were determined at 28 and 90 days curing. In addition, effects of aggressive acidic environments on mortars were investigated through 100 days of exposure to 5 % $H_2SO_4$, 10 % HCl, 5 % $HNO_3$ and 10 % $CH_3COOH$ solutions. Evaluation of sulfate resistance of mortars was also performed by immersing in 5 % $Na_2SO_4$ solution for 52 weeks. Test results reveal that the resistance to chloride penetration of concrete improves substantially with the increase of replacement level, and the concretes containing scoria based-blended cements, especially CEM II/B-P, exhibited corrosion initiation periods several times longer than the control mix. Further, an increase in scoria addition improves the acid resistance of mortar, especially in the early days of exposure, whereas after a long period of continuous exposure all specimens show the same behavior against the acid attack. According to results of sulfate resistance, CEM II/B-P can be used instead of SRPC in sulfate-bearing environments.

• Bulletin of the Korean Chemical Society
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• 제23권2호
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• pp.337-345
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• 2002

The equilibrium structures for the ground and transition states of $C_7H_7^+$ isomers have been investigated using sophisticated ab initio quantum mechanical techniques with various basis sets. The structures of tropyrium and benzyl cations have been fully optimized at the DZP CCSD(T) levels of theory. And the structures of o-, m-and p-tolyl cations are optimized fully up to the DZ CCSD(T) levels of theory. The geometries for the transition states between three isomers of tolyl cations have been optimized up to DZP CISD level of theory. The SCF harmonic vibrational frequencies for tropylium, benzyl, and three isomers of tolyl cations are all real numbers, which confirm the potential minima and each unique imaginary vibrational frequencies for TS1 and TS2 confirm the true transition states. The relative energy of the benzyl cation with respect to the tropyrium cation is predicted to be 28.5 kJ/mol and is in good agreement with the previous theoretical predictions. The 0 K heats of formation, ${\Delta}H^{\circ}_{f0}$, have been predicted to be 890, 1095, 1101, and 1110 kJ/mol for tropylium, ortho-, meta-, and para-tolyl cations by taking the experimental value of 919 kJ/mol for the benzyl cation as the base level. The relative stability between tolyl cations is in the order of ortho

• Transactions on Electrical and Electronic Materials
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• 제12권2호
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• pp.56-59
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• 2011

The characterization of the chemical mechanical polishing (CMP) process for undensified phophosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been used by experimenters to understand the relationship between the input variables and responses of interest in a simple and efficient way, and it typically is beneficial for determining the appropriatesize of experiments with multiple process variables and making statistical inferences for the responses of interest. The equipment controllable parameters used to operate the machine consist of the down force of the wafer carrier, pressure on the back side wafer, table and spindle speeds (SS), slurry flow (SF) rate, pad condition, etc. None of these are independent ofeach other and, thus, the interaction between the parameters also needs to be understoodfor improved process characterization in CMP. In this study, we selected the five controllable equipment parameters the most recommendedby process engineers, viz. the down force (DF), back pressure (BP), table speed (TS), SS, and SF, for the characterization of the CMP process with respect to the material removal rate and film uniformity in percentage terms. The polished material is undensified PSG which is widely used for the plananization of multi-layered metal interconnects. By statistical modeling and the analysis of the metrology data acquired from a series of $2^{5-1}$ fractional factorial designs with two center points, we showed that the DF, BP and TS have the greatest effect on both the removal rate and film uniformity, as expected. It is revealed that the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that process control based on a better understanding of the process is the key to success in current semiconductor manufacturing, in which the size of the wafer is approaching 300 mm and is scheduled to continuously increase up to 450 mm in or slightly after 2012.

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.115-118
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• 2011

Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.