• Tribology and Lubricants
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• v.32 no.2
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• pp.56-60
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• 2016

Sapphire has a high hardness and strength and chemical stability as a superior material. It is used mainly as a material for a semiconductor as well as LED. Recently, the cover glass industry used by a sapphire is getting a lot of attention. The sapphire substrate is manufactured through ingot sawing, lapping, diamond mechanical polishing (DMP) and chemical mechanical polishing (CMP) process. DMP is an important process to ensure the surface quality of several nm for CMP process as well as to determine the final form accuracy of the substrate. In DMP process, the material removal is achieved by using the mechanical energy of the relative motion to each other in the state that the diamond slurry is disposed between the sapphire substrate and the polishing platen. The polishing platen is one of the most important factors that determine the material removal characteristics in DMP. Especially, it is known that the geometric characteristics of the polishing platen affects the material removal amount and its distribution. This paper investigated the material removal characteristics and the effects of the polishing platen groove in sapphire DMP. The experiments were preliminarily carried out to evaluate the sapphire material removal characteristics according to process parameters such as pressure, relative velocity and so on. In the experiment, the monitoring apparatus was applied to analyze process phenomena in accordance with the processing conditions. From the experimental results, the correlation was analyzed among process parameters, polishing phenomena and the material removal characteristics. The material removal equation based on phenomenological factors could be derived. And the experiment was followed to investigate the effects of platen groove on material removal characteristics.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.6
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• pp.701-708
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• 2011

Although Titanium material has superior properties, it belongs to difficult-to-machine materials. The present research applies magnetic abrasive finishing to precision machining of internal-face of titanium pipes, and analyzed & assessed the influence of grinding conditions on magnetic abrasive effects through the removed amount and surface roughness of materials. There was the influence on grinding properties according to change of rotational speed, a total input of mixed powder and an input of grinding liquid, and when the total input, rotational speed and ratio of electrolytic iron versus magnetic abrasives are 8g and 1000rpm, it was most advantageous in aspects of surface roughness and material removal amount, and the grinding liquid remarkably improved the surface roughness and material removal amount only with addition of trace amounts of light oil rather than dry machining conditions. And a result of considering the influence on grinding properties by using an inert gas (Argon gas) for improving grinding properties of the internal-face of titanium pipe, the present research has obtained improvement effects in the removal amount and surface roughness through utilization of an inert gas.

• Tribology and Lubricants
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• v.33 no.5
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• pp.228-233
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• 2017

Chemical Mechanical Polishing of chemically stable sapphire substrates is dominantly affected by the mechanical processing of abrasives, in terms of the material removal rate. In this study, we investigated the effect of electrostatic force between the abrasives and substrate, on the polishing. If potassium chloride (KCl) is added to slurry, water molecules are decomposed into $H^+$ and $OH^-$ ions, and the amount of ions in the slurry changes. The zeta potential of the abrasives decreases with an increase in the amount of $H^+$ ions in the stern layer; consequently, the electrostatic force between the abrasives and substrate decreases. The change in zeta potential of abrasives in the slurry is affected by the slurry pH. In acidic zones, the amount of ions bound to the abrasives increases if the amount of $H^+$ ions is increased by adding KCl. However, in basic zones, there is no change in the corresponding amount. In acidic zones, zeta potential decreases as molar concentration of potassium increases; however, it does not change significantly in basic zones. The removal rate tends to decrease with increase in molar amount of potassium in acidic zones, where zeta potential changes significantly. However, in basic zones, the removal rate does not change with zeta potential. The tendencies of zeta potential and that of the frictional force generated during polishing show strong correlation. Through experiments, it is confirmed that the contact probability of abrasives changes according to the electrostatic force generated between the abrasives and substrate, and variation in removal rate.

• KSBB Journal
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• v.23 no.6
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• pp.535-540
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• 2008

In this study, the effects of several factors such as initial nitrate concentration, C/N ratio, biomass amount and external carbon source on denitrification process were investigated using synthetic wastewater and sludge obtained from wastewater treatment facility. As a result, the condition of lower initial nitrate concentration was increased to the removal rate of nitrate than that of high concentration. The increases of C/N ratio and initial biomass amount were linearly enhanced the removal rate. The use of ethanol as external carbon source was shown the highest removal yield than that of others.

• Journal of Institute of Convergence Technology
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• v.6 no.2
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• pp.25-28
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• 2016

Recently, due to the climate change by global warming, the amount of snow has increased. The situations were demanded to use many snow removal materials. The snow removal materials that used in Korea were solid chloride deicing material. That is calcium chloride($CaCl_2$) and sodium chloride(NaCl). Solid chloride baesd snow removal materials have various property, for example good freezing point depression, deliquescence and economical solvents. However, there are problems such as water pollution, high corrosiveness and ecocide. For such reason, development of eco-friendly deicer was required obligatorily. This study investigated development situation of eco-friendly deicer materials.

• Journal of Environmental Science International
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• v.16 no.6
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• pp.745-750
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• 2007

Large scale of loess has been applied on the south - sea shore of the Korean peninsula to treat red tides, due to many fishery's devastation by red tides every year. However, coastal ecosystem is ruined by the huge amount of loess applied every year. Almost all creatures, living under water such as sea weeds, clams, and fishes, where loess was applied, are disappearing. In this paper, alternative methods of the loess application are investigated. The amount of loess could be reduced by the alternative methods, Especially, loess mixed with calcium oxide has excellent effects to reduce Cochlodinium polykrikoides numbers. It was found that when loess is used with calcium oxide(CaO), removal efficiency of red tides is highly increased. Moreover, the amount of loess could be reduced dramatically.

• Restorative Dentistry and Endodontics
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• v.47 no.1
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• pp.13.1-13.13
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• 2022

Objectives: This study evaluated the efficacy of 3 reciprocating systems and the effects of 2 instruments for irrigant activation on filling material removal. Materials and Methods: Forty mesiobuccal roots of maxillary molars were prepared up to size 25.06 and obturated. Micro-computed tomography (micro-CT) examination #1 was performed. Teeth were then divided into 4 groups (n = 10), according to the retreatment protocol: (1) manual, (2) Reciproc Blue, (3) WaveOne Gold, and (4) X1 Blue. Micro-CT examinations #2 and #3 were performed after filling removal and repreparation, respectively. Next, all teeth were divided into 2 new groups (n = 20) according to the irrigant activation protocol: XP Clean (XP Clean size 25.02) and Flatsonic (Flatsonic ultrasonic tip). Micro-CT examination #4 was performed after irrigant activation. Statistical analysis was performed with a significance level set at 5%. Results: WaveOne Gold removed a significantly greater amount of filling material than the manual group (p < 0.05). The time to reach the WL was similar for all reciprocating systems (p > 0.05). X1 Blue was faster than the manual group (p < 0.05). Only manual group improved the filling material removal after the repreparation stage (p < 0.05). Both activation protocols significantly improved the filling material removal (p < 0.05), without differences between them (p > 0.05). Conclusions: None of the tested instruments completely removed the filling material. X1 Blue size 25.06 reached the working length in the shortest time. XP Clean and Flatsonic improved the filling material removal.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.211-213
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• 1999

In this paper, we documented the controlling oxide removal amount on the pattern wafer using removal rate and removal thickness of blanket wafer. There was the strong correlation relationship for both(correlation factor:0.7109). So, we could confirm the repeatability as applying for STI CMP process from the obtained linear formular. As the result of repeatability test, the difference of calculated polishing time and actual polishing time was 3.48 seconds based on total 50 lots. If this time is converted into the thickness, it is from 104$\AA$ to 167$\AA$. It is possible to be ignored because it is under the process margin.

• Tribology and Lubricants
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• v.32 no.4
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• pp.119-124
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• 2016

In the sapphire wafering process, lapping is a crucial operation in order to reduce the damaged layer and achieve the target thickness. Many parameters, such as pressure, velocity, abrasive, slurry and plate, affect lapping characteristics. This paper presents an experimental investigation on the effect of the plate groove on the material removal rate and roughness of the wafer. We select the spiral pattern and rectangular type as the groove shapes. We vary the groove density by controlling the groove shape dimension, i.e., the groove width and pitch. As the groove density increases to 0.4, the material removal rate increases and gradually reaches a saturation point. When the groove density is low, the pressing load is mostly supported by the thick film, and only a small amount acts on the abrasives resulting to a low material removal rate. The roughness decreases on increasing the groove density up to 0.3 because thick film makes partial participations of large abrasives which make deep scratches. From these results, we could conclude that the groove affects the contact condition between the wafer and plate. At the same groove density, the pitch has more influence on reducing the film thickness than the groove width. By decreasing the groove density with a smaller pitch and larger groove width, we could achieve a high material removal rate and low roughness. These results would be helpful in understanding the groove effects and determining the appropriate groove design.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.6
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• pp.15-21
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• 2006

This work deals with the electrical conductivity of dielectric on output parameters such as metal removal rate and surface roughness value of a carbon steel(SM25C) and sintered carbides cut by wire electrical discharge machining (WEDM). Dielectric has several functions like insulation, ionization, cooling, the removal of waste metal particles. The presence of minute metal particles(debris) in spark gap contaminates and lowers the breakdown strength of dielectric. And it is considered that too much debris in spark gap is generally believed to be the cause of arcing. Experimental results show that increases of cobalt amount in carbides affects the metal removal rate and worsens the surface quality as a greater quantity of solidified metal deposits on the eroded surface. Lower electrical conductivity of the dielectric results in a lower metal removal rate because the gap between wire electrode and workpiece reduced. Especially, the surface characteristics of rough-cut workpiece and wire electrode were analyzed too. Debris were analyzed also through scanning electron microscopy(SEM) and surface roughness tester. Micro cracks and some of electrode material are found on the workpiece surface by energy dispersive spectrometer(EDS).