• 한국정밀공학회지
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• 제20권12호
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• pp.183-190
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• 2003

In this paper, investigated are the machining characteristics such as material removal rate and machining time with respect to discharge area and capacitance in micro electrical discharge machining (MEDM). As discharge area determined by the electrode size and capacitance change, the optimal feedrate to allow the minimum machining time changes. The smaller discharge area is, the lower MRR becomes because of the area effect. As the capacitance increases, MRR also increases. However there is the limit capacitance beyond which the MRR does not increase anymore. As the discharge area increases, the limit capacitance also increases.

• 산업경영시스템학회지
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• 제30권2호
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• pp.8-14
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• 2007

The powder blasting process has become an important machining technique for the cost effective fabrication of micro devices. This process is similar to sand blasting, and effectively removes hard and brittle materials. A large number of investigations on the abrasive jet machining with such output parameters as material removal rate, penetration and surface roughness have been carried out and reported by various authors. To achieve higher surface roughness, to increase material removal rate and to identify the influence of blasting parameters on the output parameters, we use the taguchi method which is one of the design methods of experiments. We can select process parameters to optimize the blasting process of glass. Experimental results indicate that the taguchi method is useful as a robust design methodology for the powder blasting process.

• 반도체디스플레이기술학회지
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• 제6권3호
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• pp.1-6
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• 2007

The integrated thermal-chemical-mechanical (TCM) material removal model presented in the companion paper is dynamically simulated in this work. The model is applied to a Cu CMP process for the simulation and the results of the three individual ingredients composing the model are presented separately first. These results are then incorporated to calculate the total material removal rate (MRR) of the Cu CMP. It is shown that the non-linear trend of MRR with respect to the applied mechanical power (i.e., non-Prestonian behavior), which is not well explained with the models established in principle on conventional contact mechanics, may be due to the chemical reaction(s) varying non-linearly with the temperature in the wafer.

• 반도체디스플레이기술학회지
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• 제6권2호
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• pp.35-40
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• 2007

An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.

• Membrane and Water Treatment
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• 제7권6호
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• pp.507-520
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• 2016

The effect of ZnO on cellulose acetate in the removal of benzophenone-3 (BP-3) was investigated. The benzophenone-3 (BP-3) which is an endocrine disrupting chemical (EDC) was completely removed (100%) from the drinking water using Cellulose Acetate (CA) and zinc oxide (ZnO) composite membranes. The membranes were prepared by DIPS method and the filtration experiments were conducted by dead end filtration unit. The macrostructure of the membrane were studied by ATR-IR and XRD Spectra's. Atomic force microscopy (AFM) and Scanning electron microscopy (SEM) were used to study the micro properties of the membranes. The laboratory experiments such as water uptake study and pure water flux performed to confirm the increasing hydrophilicity. The enhancing hydrophilicity was confirmed with respect to higher the concentration of nanoparticles. Evaluation of BP-3 removal was carried in different experimental conditions, such as, different Trans membrane pressure and different concentration of feed. The membrane with low pressure showed better performance by rejecting 100% of BP-3. However, 1 ppm, 3 ppm and 6 ppm of feed solution was used and among them 3 ppm of feed solution gives 100% rejection. The ZnO nanoparticales enhances the performance of CA membrane by showing maximum rejection.

• 한국전기전자재료학회논문지
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• 제17권10호
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• pp.1041-1048
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• 2004

Chemical mechanical polishing (CMP) process was studied in terms of tribology in this paper. CMP performed by the down force and the relative motion of pad and wafer with slurry is typically tribological system composed of friction, wear and lubrication. The piezoelectric quartz sensor for friction force measurement was installed and the friction force was detected during CMP process. Various friction signals were attained and analyzed with the kind of pad, abrasive and abrasive concentration. As a result of experiment, the lubrication regime is classified with ηv/p(η, v and p; the viscosity, relative velocity and pressure). The characteristics of friction and material removal mechanism is also different as a function of the kind of abrasive and the abrasive concentration in slurry. Especially, the material removal per unit distance is directly proportional to the friction force and the non~uniformity has relation to the coefficient of friction.

• Membrane and Water Treatment
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• 제13권6호
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• pp.321-335
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• 2022

Copper-based Metal-organic framework (MOF) namely ([Cu (INA)₂]-MOF) is synthesized by ball milling and characterized using scanning electron microscopy (SEM) for the topography, microstructure, and elemental evidence determination, powdered X-ray diffraction (XRD) for the crystallinity measurement, thermogravimetric (TG) analysis was performed to determine the thermal stability of the material, and Fourier transformed infrared (FTIR) spectroscopy for functional groups identification. The use of [Cu (INA)₂]-MOF as hazardous removal material of β-agonists as persistent hazardous micro-pollutants in our environmental water is first reported in this study. The removal efficiency of the Cu-MOF is successfully determined to be 97.7% within 40 minutes, and the MOF has established an exceptional removal capacity of 835 mg L^-1 with 95 % percent removal on Clenbuterol (CLB) even after the 5th consecutive cycle. The Langmuir model of the adsorption isotherms was shown to be more favourable, while the pseudo-second-order model was found to be favoured in the kinetics. The reaction was exothermic and spontaneous from a thermodynamic standpoint, and the higher temperatures were unfavourable for the adsorption study of the CLB. As a result, the studied MOF have shown promising properties as possible adsorbents for the removal of CLB in wastewater.

• 융복합기술연구소 논문집
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• 제6권2호
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• pp.25-28
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• 2016

Recently, due to the climate change by global warming, the amount of snow has increased. The situations were demanded to use many snow removal materials. The snow removal materials that used in Korea were solid chloride deicing material. That is calcium chloride($CaCl_2$) and sodium chloride(NaCl). Solid chloride baesd snow removal materials have various property, for example good freezing point depression, deliquescence and economical solvents. However, there are problems such as water pollution, high corrosiveness and ecocide. For such reason, development of eco-friendly deicer was required obligatorily. This study investigated development situation of eco-friendly deicer materials.

• 한국전기전자재료학회논문지
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• 제17권2호
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.38-42
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• 2004

In this research, we used discharge tube without dielectric bead or with dielectric beads($SiO_2$, $Al_2O_3$, or $ZrO_2$), and discharge in water for removal of Escherichia coli. At the result of experiments, the removal characteristics of Escherichia coli appeared relation ratio to input voltage. Because, the electric field of discharge tube is increased when input voltage is increased. And, discharge tube used dielectric bead($ZrO_2$), the removal characteristics of Escherichia coli was better than cases of else.