• Title/Summary/Keyword: Mask material

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The Development of Face Cover Designs to Activate Outdoor Life (아웃도어 라이프 활성화를 위안 페이스 커버 개발 연구)

  • Kim, Chan-Ju;Ro, Mi-Kyung
    • Journal of the Korean Society of Costume
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    • v.59 no.1
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    • pp.47-59
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    • 2009
  • This paper aimed at the development of face covers which is face protection articles for blocking UV rays and yellow sands, with a view to assist the further activation of outdoor life. The four-stage design process of field study, design, design evaluation, final selection of designs was set up for the effective product development. Field study included on-line and off-line market survey on the products for sale in market and observation on those wearing face covers. Depth interviews were done to know consumer understandings and satisfaction levels for current face covers. The results of market survey showed that most of the face covers currently in the market were mask types, which were produced for the blocking of dust and yellow sands rather than UV ray protection. The major clients of the mask were the women in their 30's-50's and the designs for these clients were very limited. Since the number of younger women and men enjoy the outdoor sports has increased, the face covers for these people should be developed. For this purpose, the direction of new face cover design had 2 points: diversification of design in terms of color, material, shape and giving seasonal differences. 12 designs were designed on the first design stage, but after both wearing test by 16 testees and UV ray blocking test to evaluate these designs, 6 face cover designs were finally selected.

Engineering of Bi-/Mono-layer Graphene Film Using Reactive Ion Etching

  • Irannejad, M.;Alyalak, W.;Burzhuev, S.;Brzezinski, A.;Yavuz, M.;Cui, B.
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.4
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    • pp.169-172
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    • 2015
  • Although, there are several research studies on the engineering of the graphene layers using different etching techniques, there is not any comprehensive study on the effects of using different etching masks in the reactive ion etching (RIE) method on the quality and uniformity of the etched graphene films. This study investigated the effects of using polystyrene and conventional photolithography resist as a etching mask on the engineering of the number of graphene layers, using RIE. The effects were studied using Raman spectroscopy. This analysis indicated that the photo-resist mask is better than the polystyrene mask because of its lower post processing effects on the graphene surface during the RIE process. A single layer graphene was achieved from a bi-layer graphene after 3 s of the RIE process using oxygen plasma, and the bi-layer graphene was successfully etched after 6 s of the RIE process. The bilayer etching time was significantly smaller than reported values for graphene flakes in previous research.

Detection of Flaws in Ceramic Materials Using Non-Destructive Testing (비파괴 검사를 이용한 세라믹 재료의 결함 검출)

  • Kim, Kwang-Baek;Woo, Young-Woon
    • The Journal of the Korea institute of electronic communication sciences
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    • v.5 no.3
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    • pp.321-326
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    • 2010
  • A method that can decide the existence and the severeness of flaws in ceramic materials through the use of non-destructive testing by image processing techniques, is proposed in this paper. The edges of the acquired image are first extracted using Sobel mask and the regions of the image are clustered using another mask after that. Histogram stretching is applied to each of the regions to enhance the image region-wise and objects are extracted by an edge following algorithm. Morphological information is incorporated to remove noise and detect flawed regions. The proposed method can detect flaws in the acquired images and the experimental results also supports that.

Fabrication of Nano-Sized Ni-ferrite Powder from Waste Solution Produced by Shadow Mask Processing (새도우마스크 제조공정 중 발생되는 폐액으로부터 니켈 페라이트 나노 분말 제조)

  • 유재근;서상기
    • Journal of Powder Materials
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    • v.10 no.4
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    • pp.262-269
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    • 2003
  • Nano-sized Ni-ferrite powder was fabricated by spray pyrolysis process using the waste solution resulting from shadow mask processing. The average particle size of the powder was below 100 nm. The effects of the concentration of raw material solution, the nozzle tip size and air pressure on the properties of powder were studied. As the concentration increased, the average particle size of the powder gradually increased and its specific surface area decreased, but size distribution was much wider and the fraction of the Ni-ferrite phase greatly increased as the concentration increasing. As the nozzle tip size increased from 1 mm to 2 mm, the average particle size of the powder decreased. In case of 3 mm nozzle tip size, the average particle size of the powder increased slightly. On the other hand, in case of 5 mm nozzle tip size, average particle size of the powder decreased. Size distribution of the powder was unhomogeneous, and the fraction of the Ni-ferrite phase decreased as the nozzle tip size increasing. As air pressure increased up to 1 kg/$cm^2$, the average particle size of the powder decreased slightly, on the other hand, the fraction of the Ni-ferrite phase was almost constant. In case of 3kg/$cm^2$ air pressure, average particle size of the powder and the fraction of the Ni-ferrite phase remarkably decreased, but size distribution was narrow.

Modeling with Thin Film Thickness using Machine Learning

  • Kim, Dong Hwan;Choi, Jeong Eun;Ha, Tae Min;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.2
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    • pp.48-52
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    • 2019
  • Virtual metrology, which is one of APC techniques, is a method to predict characteristics of manufactured films using machine learning with saving time and resources. As the photoresist is no longer a mask material for use in high aspect ratios as the CD is reduced, hard mask is introduced to solve such problems. Among many types of hard mask materials, amorphous carbon layer(ACL) is widely investigated due to its advantages of high etch selectivity than conventional photoresist, high optical transmittance, easy deposition process, and removability by oxygen plasma. In this study, VM using different machine learning algorithms is applied to predict the thickness of ACL and trained models are evaluated which model shows best prediction performance. ACL specimens are deposited by plasma enhanced chemical vapor deposition(PECVD) with four different process parameters(Pressure, RF power, $C_3H_6$ gas flow, $N_2$ gas flow). Gradient boosting regression(GBR) algorithm, random forest regression(RFR) algorithm, and neural network(NN) are selected for modeling. The model using gradient boosting algorithm shows most proper performance with higher R-squared value. A model for predicting the thickness of the ACL film within the abovementioned conditions has been successfully constructed.

A Study on Edge Detection Considering Center Pixels of Mask (마스크의 중심 화소를 고려한 에지 검출에 관한 연구)

  • Park, Hwa-Jung;Jung, Hwae-Sung;Kim, Nam-Ho
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2022.10a
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    • pp.136-138
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    • 2022
  • Edge detection includes information such as the shape, position, size, and material of an object with respect to an image, and is a very important factor in analyzing the characteristics of the image. Existing edge detection methods include Sobel edge detection filter, Roberts edge detection filter, Prewitt edge detection filter, and LoG (Lapacian of Gaussian) using secondary differentials. However, these methods have a disadvantage in that the edge detection results are somewhat insufficient because a fixed weight mask is applied to the entire image area. Therefore, in this paper, we propose an edge detection algorithm that increases edge detection characteristics by considering the center pixel in the mask. In addition, in order to confirm the proposed edge detection performance, it was compared through simulation result images.

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Mask Patterning for Two-Step Metallization Processes of a Solar Cell and Its Impact on Solar Cell Efficiency (태양전지 2 단계 전극형성 공정을 위한 마스크 패턴공정 및 효율에 대한 영향성 연구)

  • Lee, Chang-Joon;Shin, Dong-Youn
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.36 no.11
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    • pp.1135-1140
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    • 2012
  • Two-step metallization processes have been proposed to achieve high-efficiency silicon solar cells, where the front-side grids are formed by silver plating after the formation of a nickel seed layer with a mask. Because the conventional mask patterning process is performed by an expensive selective printing method using either UV resist or phase change ink, however, the combination of a simple coating and laser-selective ablation processes is proposed in this study as an alternative means. As a masking material, the solar cell wafer was coated with either inexpensive wax having a low melting temperature or a fluorocarbon solution, and then, an electrode image was patterned by selectively removing the masking material using the laser. It was found that the fluorocarbon coating was not only superior to the wax coating in terms of pattern uniformity but it also increased the efficiency of the solar cell by 0.16%, as confirmed by statistical f and t tests.

The Study of WET Cleaning Effect on Deep Trench Structure for Trench MOSFET Technology (Trench MOSFET Technology의 Deep Trench 구조에서 WET Cleaning 영향에 대한 연구)

  • Kim, Sang-Yong;Jeong, Woo-Yang;Yi, Keun-Man;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.88-89
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    • 2009
  • In this paper, we investigated about wet cleaning effect as deep trench formation methods for Power chip devices. Deep trench structure was classified by two methods, PSU (Poly Stick Up) and Non-PSU structure. In this paper, we could remove residue defect during wet. cleaning after deep trench etch process for non-PSU structure device as to change wet cleaning process condition. V-SEM result showed void image at the trench bottom site due to residue defect and residue component was oxide by EDS analysis. In order to find the reason of happening residue defect, we experimented about various process conditions. So, defect source was that oxide film was re-deposited at trench bottom by changed to hydrophobic property at substrate during hard mask removal process. Therefore, in order to removal residue defect, we added in-situ SCI during hard mask removal process, and defect was removed perfectly. And WLR (Wafer Level Reliability) test result was no difference between normal and optimized process condition.

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Modeling of Silicon Etch in KOH for MEMS Based Energy Harvester Fabrication (MEMS기반 에너지 하베스터 제작을 위한 실리콘 KOH 식각 모형화)

  • Min, Chul-Hong;Gang, Gyeong-Woo;Kim, Tae-Seon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.3
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    • pp.176-181
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    • 2012
  • Due to the high etch rate and low fabrication cost, the wet etching of silicon using KOH etchant is widely used in MEMS fabrication area. However, anisotropic etch characteristic obstruct intuitional mask design and compensation structures are required for mask design level. Therefore, the accurate modeling for various types of silicon surface is essential for fabrication of three-dimensional MEMS structure. In this paper, we modeled KOH etch profile for MEMS based energy harvester using fuzzy logic. Modeling results are compared with experimental results and it is applied to design of compensation structure for MEMS based energy harvester. Through Fuzzy inference approaches, developed model showed good agreement with the experimental results with limited etch rate information.