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Modeling of Silicon Etch in KOH for MEMS Based Energy Harvester Fabrication

MEMS기반 에너지 하베스터 제작을 위한 실리콘 KOH 식각 모형화

  • Min, Chul-Hong (School of Computer Science and Engineering, The Catholic University) ;
  • Gang, Gyeong-Woo (School of Information, Communications and Electronics Engineering, The Catholic University) ;
  • Kim, Tae-Seon (School of Information, Communications and Electronics Engineering, The Catholic University)
  • 민철홍 (가톨릭대학교 컴퓨터공학과) ;
  • 강경우 (가톨릭대학교 정보통신전자공학부) ;
  • 김태선 (가톨릭대학교 정보통신전자공학부)
  • Received : 2012.02.13
  • Accepted : 2012.02.16
  • Published : 2012.03.01

Abstract

Due to the high etch rate and low fabrication cost, the wet etching of silicon using KOH etchant is widely used in MEMS fabrication area. However, anisotropic etch characteristic obstruct intuitional mask design and compensation structures are required for mask design level. Therefore, the accurate modeling for various types of silicon surface is essential for fabrication of three-dimensional MEMS structure. In this paper, we modeled KOH etch profile for MEMS based energy harvester using fuzzy logic. Modeling results are compared with experimental results and it is applied to design of compensation structure for MEMS based energy harvester. Through Fuzzy inference approaches, developed model showed good agreement with the experimental results with limited etch rate information.

Keywords

References

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