• Bulletin of the Korean Chemical Society
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• v.24 no.8
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• pp.1215-1218
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• 2003

An analysis of the bonding situation in CaM₂P₂ (M=Fe, Ni) with ThCr₂Si₂ structure is made in terms of DOS and COOP plots. The main contributions to covalent bonding are due to M-P and P-P interactions in both compounds. Particularly, the interlayer P-P bonding by variation in the transition metal is examined in more detail. It turns out that the shorter P-P bonds in CaNi₂P₂ form as a result of the decreasing electron delocalization into ${{\sigma}_p}^*$ of P₂ due to the weaker bonding interaction between the metal d and ${{\sigma}_p}^*$ as the metal d band is falling from Fe to Ni.

• Proceedings of the Korea Concrete Institute Conference
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• 2004.05a
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• pp.88-91
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• 2004

It is generally known that the bonding strength of RC(Reinforced Concrete) flexural members strengthened by fiber sheet composites are sufficient and the bonding failure does not occur until the sheet failed. However, many researchers have been reported that, before the failure of the sheet, the bonding failure happens even though the bonding length is sufficient. This study was carried out to evaluate the effectiveness of shear key and U strip on flexural behavior of reinforced concrete beam structures. The ply number of CFS(Carbon Fiber Sheet), location of shear key, and existence or not of U strip were selected as the main test variables. Test results show that the behavior of a beam of which shear key is located in the nearby. of support and U strip is not existent, and having CFS of 1 ply is mostly improved.

• Journal of the Korean Society of Industry Convergence
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• v.9 no.3
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• pp.183-190
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• 2006

Generally, application of steel pile as deep foundation member needs specials requirement for the connection method between steel pipe and concrete footing. To investigate real compressive behavior of connection member between steel pipe pile and concrete footing, three specimens were tested with carefully designed experimental system. Main test variable is the connection method between steel pipe pile and concrete footing. The bolted bonding method and hook bonding method was considered as the connection method in this study. From the test results gained from experiment, it was conformed that two types of connection method have the almost same compressive resistance capacity. Therefore, we can conclude that these two connection methods can be used as the strengthening method to verify the compressive composite action of concrete and steel pipe pile.

• Electronics and Telecommunications Trends
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• v.36 no.3
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• pp.23-33
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• 2021

Two main technologies of III-V/Si laser diode for optical communication, direct epitaxial growth, and wafer bonding were studied. Until now, the wafer bonding has been vigorously studied and seems promising for the ideal III-V/Si laser. However, the wafer bonding process is still complicated and has a limit of mass production. The development of a concise and innovative integration method for silicon photonics is urgent. In the future, the demand for high-speed data processing and energy saving, as well as ultra-high density integration, will increase. Therefore, the study for the hetero-junction, which is that the III-V compound semiconductor is directly grown on Si semiconductor can overcome the current limitations and may be the goal for the ideal III-V/Si laser diode.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.242-247
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• 2009

On the Transient Liquid Phase Bonding (TLPB) phenomenon with the MBF-50 insert metal at narrow gap (under 100), it takes long time for the bonding and the homogenizing. Typically, isothermal solidification is controlled by the diffusion of depressed element of B and Si. However, the amount of B and Si in the MBF-50 filler metal is large. This is reason of the long bonding time. Also, the MBF-50 filler metal did not contained Al and Ti which are ${\gamma}^{\prime}$ phases former. This is reason of the long homogenizing time. From the bonding phenomenon with the MBF-50 insert metal, we search main factors on the bonding mechanism and select several insert-metals for using the wide-gap TLPB. New insert-metals contained Al and Ti which are ${\gamma}^{\prime}$ phases former and decrease the B then the MBF-50. When the new insert-metal was used on the TLPB, the bonding time was decreased about 1/10 times and homogenizing heat treatment was no needed. In spite of the without homogenizing, the volume fraction of ${\gamma}^{\prime}$ phases in the boned interlayer was equal to homogenizing heat treated specimen which was TLPB with the MBF-50. Finally, the new insert metal named WG1 for the wide-gap TLPB is more efficient then the MBF-50 filler metal without decreasing the bonding characteristic.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.803-808
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• 2002

A computer-aided alloy-designing technique to develop the insert metal for transient liquid phase (TLP) bonding was applied to high aluminum Ni-base superalloys. The main procedure of a mathematical programming method was to obtain the optimal chemical composition through rationally compromising the plural objective performances of insert metal by a grid-search which involved data estimation from the limited experimental data using interpolation method. The objective function Z which was introduced as an index of bonding performance of insert metal involved the melting point, hardness (strength), formability of brittle phases and void ratio (bonding defects) in bond layer as the evaluating factors. The contour maps of objective function Z were also obtained applying the interpolation method. The compositions of Ni-3.0%Cr-4.0%B-0.5%Ce (for ${\gamma}$/${\gamma}$/${\beta}$ type alloy) and Ni3.5%Cr-3.5%B-3%Ti (for ${\gamma}$/${\gamma}$ type alloy) which optimized the objective function were determined as insert metal. SEM observations revealed that the microstructure in bond layers using the newly developed insert metals indicated quite sound morphologies without forming microconstituents and voids. The creep rupture properties of both joints were much improved compared to a commercial insert metal of MBF-80 (Ni-15.5%Cr-3.7%B), and were fairly comparable to those of base metals.

• Korean Journal of Child Studies
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• v.26 no.6
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• pp.189-200
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• 2005

The main objectives of this study are to examine the relationships among the Bu-Ja- Yu-Chin-SungCheong, child's self differentiation and interpersonal relationship and to compare the effects of the cultural virtues. Bu-Ja-Yu-Chin-Sung-Cheong which is the Korean traditional parent-child affective bonding defined as a characteristic of relationship between parents and children within Korean culture by Choi, sang jin. The subject of the study are 656 students from 4 different elementary schools in Seoul : they were 5 and 6th grades. The study was executed by surveying them with questionnaire and the results were analyzed through co-relation analysis and multiple regression. Findings were: (l)the Korean traditional parent-child affective bonding has a positive effect on self differentiation and interpersonal relationship of a child. (2)The Korean traditional bonding has a impact on a child's acceptance of others and social behavior. However, according to the level of a child's self differentiation a child's dominance-ascendance, ostentation-narcism interpersonal relationship inclination increased.

• Journal of the Korean Society of Combustion
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• v.22 no.3
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• pp.47-52
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• 2017

The propellant tile and crack which account for the greatest proportion of solid rockets are profoundly affected by viscosity and mechanical properties of solid propellant. In this paper HTPB/AP/Al system propellant has been researched for the viscosity, mechanical properties and burning properties with type and contents of bonding agents. The viscosity of propellant was changed significantly depending on the type and contents of bonding agents, and mechanical properties of HTPB/AP/Al system propellant were also varied. Considering both lower viscosity and stable mechanical properties, the optimum type and contents of bonding agents can be identified as the main factors to the HTPB/AP/Al system propellant.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.22-23
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• 2016

This study aims to derive the optimal condition that ensures the monolithicity of ultra-high performance concrete (UHPC), through the evaluation of bonding shear performance with respect to the time of cold joint occurrence during the placement. From the direct shear test, while the normalized bonding shear strength reduction of UHPC with the delay time of 15 minutes was the lowest at around 8%, a dramatic degradation of bonding shear performance was observed after 15 minutes. XRD analysis of the middle and surface sections was performed in order to analyze the composition of the thin film formed at the surface of UHPC, and as a result, the main ingredient appeared to be SiO₂ from the XRD pattern of middle and surface sections, which is believed to be the result of the rising of SiO₂-based filler, used as anadmixture in this study, toward the surface, due to its low specific gravity.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.29-33
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• 2012

The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good die. Among several new process techniques Cu-to-Cu wafer bonding is the key process to be optimized for the high density and high performance IC manufacturing. In this study two main challenges for Cu-to-Cu wafer bonding were evaluated: misalignment and bond quality of bonded wafers. It is demonstrated that the misalignment in a bonded wafer was mainly due to a physical movement of spacer removal step and the bond quality was significantly dependent on Cu bump dishing and oxide erosion by Cu CMP.