• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.201-201
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• 2010

본 연구에서는 RF magnetron co-sputtering을 이용하여 Zn-O-Ga 구성비에 따른 광투과도 및 전기적 특성을 연구하였다. 타겟으로 ZnO 및 $Ga_2O_3$ 소결체를 이용하였으며, 두 개의 RF magnetron sputter의 RF power를 동시에 조절하여 타겟의 구성비를 조절하였으며, 기판과 타겟의 거리를 25 mm~75 mm 범위 내에 조절하여 거리에 따른 Zn-O-Ga 박막의 광투과 특성 및 전기적 특성을 관찰하였다. $Ga_2O_3$ 소결체의 magnetron sputter의 RF power를 30 watt에서 100 watt로 증가함에 따라 박막내의 Ga 성분은 0.5%에서 7.4%로 증가하였으며 Zn 성분은 46.3%에서 40.9%로 O성분은 53.2%에서 51.6%로 각각 줄어들었다. 이에 따라 ZnO의 우선방위 (002) 결정각($2{\theta}$)은 34.24에서 33.87로 줄어들었으며, 이동도 $5.5\;cm^2/Vs$ 에서 $1.99\;cm^2/Vs$ 정도로 감소하는 경향을 보였다. 광투과도는 가시광선 영역에서 85% 이상 보였으며, carrier 밀도는 $0.5\;{\sim}\;4.0^*10^{20}/cm^3$로 증가함에 따라 이동도는 $1.5{\sim}5.5\;cm^2/Vs$로 투명전도막의 특성을 보였다.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.465-472
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• 2005

Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetron­sputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of e and cycle time of A, the characteristics and thickness of the deposited copper film are controlled. As $\theta$ value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at $\theta=0.33$ and cycle time of 30 min. The uniformity of copper film shows $5\%$ in our experimental range.

• Journal of the Korean institute of surface engineering
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• v.25 no.5
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• pp.235-252
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• 1992

(Ti, Al)N films were deposited on 304 stainless steel sheet by D.C. magnetron sputtering using Al target and Ti plate. The high temperature oxidation of (T, Al)N films with the variation of composition has been investigated. The chemical composition of (Ti, Al)N films with the variation of composition has been investigated. The chemical composition of (Ti, Al)N films was similar to the sputter area ratio of titanium to aluminum target by means of EDS and AES survey. The high temperature oxidation test of (Ti, Al)N showed that (Ti, Al)N has better high temperature resistance than TiN and TiC films. TiC films were cracked at 40$0^{\circ}C$ in air TiN films quickly were oxidised at $600^{\circ}C$, were spalled more than $700^{\circ}C$. But (Ti, Al)N films are relatively stable to$ 900^{\circ}C$. The good resistance to high temperature oxida-tion of (Ti, Al)N films are due to the formation of dense Al2O3 and TiO2 oxide layer. Especially, Al2O3 oxide layer is more important. The results obtained from this study show, it is believe that the (Ti, Al)N film by D.C. magnetron sputtering is promising for the use of high temperature and wear resistance mate-rials.

• The Korean Journal of Ceramics
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• v.7 no.2
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• pp.85-92
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• 2001

Thin films of ZnO and Al doped ZnO were prepared by rf magnetron sputter techniques. When the oxygen fraction in Ar-O$_2$ sputter gas was about 2.0%, the films exhibited the composition of Zn:O=1.05:1. The films prepared at 250 W contain larger grains than the films grown at 100 W. However, high deposition rate seems to deteriorates the crystallinity as well as Al-substitution, resulting in lower concentration of mobile electrons. The Al-doped ZnO films which were deposited at $500^{\circ}C$ show resistance of 1$\times$10$^-2$ Wcm; optical band gap of the films ranges from 3.25 to 3.40 eV. These electrical and optical features are related with microstructural as well as crystalline characteristics of the films.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.52 no.3
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• pp.107-112
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• 2003

Amorphous carbon nitride thin films have been deposited on silicon (100) by reactive magnetron sputtering method. The basic depositon parameters varied were the r.f. power(up to 250 W), the deposition pressure in the reactor(up to 100 mtorr) and Ar:$N_2$ gas ratio. FT-IR and X-ray photoelectron spectra showed the presence of different carbon-nitrogen bonds in the films. The surface topography of the films was studied by scanning electron microscopy(SEM) and atomic force microscopy(AFM).

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.249-249
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• 2015

Silver films have been of considerable interest for years due to their better performance relative to other metal films for engineering applications. A series of multi-layer silver coatings with different thickness (i.e. 0.3 um to 1.5 um) were prepared on Aluminium substrate containing copper undercoat by direct current (DC) magnetron sputtering method. For the comparative purpose, similar thickness silver coatings were prepared by electrolytic deposition method. Microstructural, morphological, and mechanical characteristics of the silver coatings were evaluated by means of scanning electron microscope (SEM), X-ray diffraction (XRD), Surface roughness test, microhardness test and nano-scratch test. From the results, it has been elucidated that the silver films prepared by DC magnetron sputtering method has superior properties in comparison to the wet coating method. On the other hand, DC magnetron sputtering method is relatively easier, faster, eco-friendly and more productive than the electrolytic deposition method that uses several kinds of hazardous chemicals for bath formulation. Therefore, a New Work Item Proposal (NWIP) for the test methods standardization of DC magnetron sputtered silver coatings has recently been proposed via KATS, Korea and a NP ballot is being progressed within a technical committee "ISO/TC107-metallic and other inorganic coating".

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.309-312
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• 2007

Sputter deposition followed by surface treatment was studied using reactive RF plasma as a method for preparing titanium oxide($TiO_{2}$) films on indium tin oxide(ITO) coated glass substrate for dye-sensitized solar cells(DSSCs). Anatase structure $TiO_{2}$ films deposited by reactive RF magnetron sputtering under the conditions of $Ar/O_{2}$(5%) mixtures, RF power of 600W and substrate temperature of $400^{\circ}C$ were surface-treated by inductive coupled plasma(ICP) with $Ar/O_{2}$ mixtures at substrate temperature of $400^{\circ}C$, and thus the films were applied to the DSSCs, The $TiO_{2}$ Films made on these exhibited the BET specific surface area of 95, the pore volume of $0.3cm^{2}$ and the TEM particle size of ${\sim}25$ nm. The DSSCs made of this $TiO_{2}$ material exhibited an energy conversion efficiency of about 2.25% at $100mW/cm^{2}$ light intensity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.1008-1015
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• 2001

Thin films of vanadium oxide(VO$\_$x/) have been deposited by r.f. magnetron sputtering from V$_2$O$\_$5/ target in gas mixture of argon and oxygen. The oxygen/(oxygen+argon) partial pressure ratio is changed from 0% to 8%. Crystal structure, chemical composition, bonding, optical and electrical properties of films sputter-deposited under different oxygen gas pressures are characterized through XPS, AES, RBS, FTIR, optical absorption and electrical conductivity measurements. V$_2$O$\_$5/ and lower oxides co-exist in sputter-deposited films and as the oxygen partial pressure is increased the films become more stoichiometric V$_2$O$\_$5/. The increase of O/V ratio with increasing oxygen gas pressure is attributed to the partial filling of oxygen vacancies through diffusion. It is observed that the oxygen atoms located on the V-O plane of V$_2$O$\_$5/ layer participate more readily in the oxidation process. With increasing oxygen gas pressure indirect and direct optical band gaps are increased, but thermal activation energies are decreased.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1245-1247
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• 1995

In this paper, Analyzed structual property using SEM and XRD. The longer distance between substrate and target enhance crystalographic orientation of (110)plane, but inhibit growth of (002)plane. Also, deposited ZnO thin film on electrode layer inhibit crystalographic orientation of (002)plane, expecially Al electrode inhibit stronger than Pt layer. And using fabricated transducer, analyzed eletric and frequency characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.206-206
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• 2009

RF Magnetron Sputtering 방법을 통해 ZnS:Mn 박막 형광체를 증착한 다층 TFEL (Thin-Film Electroluminescent) Backlight 소자를 제작하였다. Alumina 기판 위에 Au 전극과 PMN 후막 유전체를 Screen printing 기법으로 층을 형성하였다. 그 위에 MgO 박막 유전체를 E-Beam 장비를 이용하여 증착 후, ZnS:Mn 박막 형광체를 50 W 의 저전력으로 약 8000 ${\AA}$ 두께로 증착하였다. 형광체는 Sputter 증착 시 Sulfur 부족 현상을 보상해주기 위해 ZnS:Mn (0.5%) Target 에 2 at % 의 Sulfur를 첨가하였으며, 상부 전극으로 사용할 ITO 는 DC Magnetron Sputter 를 이용하여 증착하였다. 어닐링 공정은 Air 분위기에서 급속 열처리 장치 (RTA, Rapid Thermal Annealing) 을 이용하여 600 $^{\circ}C$에서 20 분 진행하였다. 이러한 과정들을 통해 저전압 고휘도의 TFEL Backlight 소자를 제조할 수 있었다.