• Journal of the Korean Magnetics Society
• /
• v.9 no.1
• /
• pp.41-47
• /
• 1999

$Buffer/[NiFe/Cu/CoFe(Co)/Cu]_N$ spin valve multilayers prepared by dc magnetron sputtering on a corning glass substrate using NiFe and CoFe(Co) posses different coercivities. Dependence of magnetoresistance on the type and thickness of buffer layer, thickness of Cu, NiFe, stacking number of multilayer, substrate temperature and annealing temperature in the form $[NiFe/Cu/CoFe(Co)/Cu]_N$ spin-valve multilayers were investigated. To evaluate effect of magnetoresistance for this samples, X-ray diffraction analysis, vibrating sample magnetometer analysis, and magnetoresistance measurement (4-probe method) were performed the maximum magnetoresistance ratio and coercivity were 7.5 % and 140 Oe, respectively for $Cr-50{\AA}/[NiFe-20{\AA}/Cu-{\AA}/Co-20{\AA}/Cu-50{\AA}]_10$ at substrate temperature of 9$0^{\circ}C$. Magnetoresistance slope maintained 0.25%/Oe until 15$0^{\circ}C$ of annealing temperature, and then decreased to 0.03%/Oe at 20$0^{\circ}C$. It was confirmed that the main factor of thermal stability was deteriorating of soft magnetic properties in the NiFe layer.

• Journal of the Korean Vacuum Society
• /
• v.19 no.2
• /
• pp.81-90
• /
• 2010

We introduce a novel and versatile approach for preparing self-assembled nanoporous multilayered films with antireflective properties. Protonated polystyrene-block-poly (4-vinylpyrine) (PS-b-P4VP) and anionic polystyrene-block-poly (acrylic acid) (PS-b-PAA) block copolymer micelles (BCM) were used as building blocks for the layer-by-layer assembly of BCM multilayer films. BCM film growth is governed by electrostatic and hydrogen-bonding interactions between the oppositely BCMs. Both film porosity and film thickness are dependent upon the charge density of the micelles, with the porosity of the film controlled by the solution pH and the molecular weight (Mw) of the constituents. PS7K-b-P4VP28K/PS2K-b-PAA8K films prepared at pH 4 (for PS7K-b-P4VP28K) and pH 6 (for PS2K-b-PAA8K) are highly nanoporous and antireflective. In contrast, PS7K-b-P4VP28K/PS2K-b-PAA8K films assembled at pH 4/4 show a relatively dense surface morphology due to the decreased charge density of PS2K-b-PAA8K. Films formed from BCMs with increased PS block and decreased hydrophilic block (P4VP or PAA) size (e.g., PS36K-b-P4VP12K/PS16K-b-PAA4K at pH 4/4) were also nanoporous. Furthermore, we demonstrate that the nanostructured electrochemical sensors based on patterning methods show the electrochemical activities. Anionic poly(styrene sulfonate) (PSS) layers were selectively and uniformly deposited onto the catalase (CAT)-coated surface using the micro-contact printing method. The pH-induced charge reversal of catalase can provide the selective deposition of consecutive PE multilayers onto patterned PSS layers by causing the electrostatic repulsion between next PE layer and catalase. Based on this patterning method, the hybrid patterned multilayers composed of platinum nanoparticles (PtNP) and catalase were prepared and then their electrochemical properties were investigated from sensing $H_2O_2$ and NO gas. This study was based on the papers reported by our group. (J. Am. Chem. Soc. 128, 9935 (2006); Adv. Mater. 19, 4364 (2007); Electro. Mater. Lett. 3, 163 (2007)).

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.153-153
• /
• 1999

platinum 유기착화합물을 사용하여 유리 기판 위에 Pt를 증착시켰다. Pt를 증착하기 위하여 Pt 착화합물을 용해 시킨 후, 유리 기판을 용액속에 담근 후 가열하여 Pt막을 증착하였다. 증착 후 Pt의 면저항은 200~75$\Omega$의 값을 나타내어 비교적 높은 저항값을 나타내었다. 높은 저항값을 낮추기 위해 진공 10-5Torr에서 50, 100, 150, 25$0^{\circ}C$로 열처리를 하였다. 이러한 저항값을 변화의 원인을 살펴보기 위하여 X-선 회절법을 이용하여 결정성의 변화를 살펴보았고, 화학적 조성의 변화는 X-ray 광전자 분광법을 이용하여 조사하였다. 열처리 전 Pt막은 비정질 상태를 나타내었으나, 6$0^{\circ}C$에서 30분간 열처리한 후에는 결정성이 증가하는 것으로 관찰되었다. 열처리 후 결정방향은 {111] 방향이 주 방향이였으며 [002] 방향의 피크도 관찰되었다. 따라서 성장된 막은 다결정 막임을 알 수 있었다. XPS를 이용하여 조성을 조사하여 본 결과 열처리하지 않은 시료의 경우 유기물과 반응하여 Pt의 피크가 넓게 나타나나 열처리 후에는 유기물이 분해되어 Pt의 고유한 피크를 관찰할 수 있었다. 따라서 전기전도도의 변화는 유기물의 분해를 통하여 순수한 Pt로 변해가면서 감소하는 것으로 생각되어 지며 결정성 또한 전기전도도 변화에 중요한 역할을 함을 알 수 있었다. 기존의 방법을 이용하여 Pt를 증착할 경우 기판과 쉽게 박리 되는 현상이 관찰되었으나 본 방법을 이용하여 증착된 Pt 박막의 경우 열처리 후에는 기판과의 접착력이 기존의 방법보다 뛰어나 박리되는 현상이 관찰되지 않았다.$ 이상에서 안정한 것을 볼 수 있었다. 텅스텐 박막은 $\alpha$ 및 $\beta$-W 구조를 가질 수 있으나 본 연구에서 성장된 텅스텐은 $\alpha$-W 구조를 가지는 것을 XRD 측정으로 확인하였다. 성장된 텅스텐 박막의 저항은 구조에 따라서 변화되는 것으로 알려져 있다. 증착조건에 따른 저항의 변화는 SiH4 대 WF6의 가스비, 증착온도에 따라서 변화하였다. 특히 온도가 40$0^{\circ}C$ 이상, SiH4/WF6의 비가 0.2일 경우 텅스텐을 증착시킨 후에 열처리를 거치지 않은 경우에도 기존에 발표된 저항률인 10$\mu$$\Omega$.cm 대의 값을 얻을 수 있었다. 본 연구를 통하여 산화막과의 접착성 문제를 해결하고 낮은 저항을 얻을 수 있었으나, 텅스텐 박막의 성장과정에 의한 게이트 산화막의 열화는 심각학 문제를 야기하였다. 즉, LPCVD 과정에서 발생한 불소 또는 불소 화합물이 게이트의 산화막에 결함을 발생시킴을 확인하였다. 향후, 불소에 의한 게이트 산화막의 열화를 최소화시킬 수 있는 공정 조건의 최저고하 또는 대체게이트 산화막이 적용될 경우, 개발된 연구 결과를 산업체로 이전할 수 있는 가능성이 높을 것을 기대된다.박막 형성 메카니즘에 큰 영향을 미침을 알 수 있었다. 또한 은의 전기화학적 다층박막 성장은 MSM (monolayer-simultaneous-multilayer) 메카니즘을 따름을 확인하였다. 마지막으로 구조 및 양이 규칙적으로 조절되는 전극의 응용가능성이 간단히 논의될 것이다.l 성장을 하였다는 것을 알 수 있었다. 결정성

• Journal of the HCI Society of Korea
• /
• v.10 no.2
• /
• pp.21-26
• /
• 2015

NUI (Natural User Interface) system interprets the user's natural movement or the signals from human body to the machine. sEMG (surface electromyogram) can be observed when there is any effort in muscle even without actual movement, which is impossible with camera and accelerometer based NUI system. In sEMG based movement recognition system, the minimal number of electrodes is preferred to minimize the inconvenience. We analyzed the decrease in recognition accuracy as decreasing the number of electrodes. For the four kinds of movement intention without movement, extension (up), flexion (down), abduction (right), and adduction (left), the multilayer perceptron classifier was used with the features of RMS (Root Mean Square) from sEMG. The classification accuracy was 91.9% in four channels, 87.0% in three channels, and 78.9% in two channels. To increase the accuracy in two channels of sEMG, RMSs from previous time epoch (50-200 ms) were used in addition. With the RMSs from 150 ms, the accuracy was increased from 78.9% to 83.6%. The decrease in accuracy with minimal number of electrodes could be compensated partly by utilizing more features in previous RMSs.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.15 no.1
• /
• pp.73-80
• /
• 2004

In this paper, the implementation and embedding method of the existing air-filled waveguide-filters at millimeter-wave on general PCB substrate is introduced by systematically inserting the vias inside waveguide and mathematically manipulating the simple equations obtained ken the classical circular-post waveguide filter design. All the metal structures placed vertically such as side wall fur perfect ground plane and circular-post for signal control in the air-filled WR-22 waveguide are replaced with several types of via for constructing the bandpass-filter. Side wall and poles inside waveguide are realized by placing a series array of via and tuning the via diameter. The lengths of x, y, z axis are reduced in proportion to root square of employed substrate dielectric constant and especially the length of z axis can be more reduced due to the characteristics of the wave propagation. Because the mass production on PCB is possible without fabricating a large-scaled metal waveguide of WR-22 as input/output ports at millimeter-wave regime, the manufacturing cost is reduced considerably. Finally, when using multilayer process like LTCC for small-sized module, it is one of advantages to use only one layer f3r the filter fabrication. To evaluate the validity of this novel technique, order-3 Chebyshev BPF(Bandpass-Filter) centered at 40 GHz-band with a 2.5 ％ FBW (Fractional Bandwidth) were used. The employed substrate has relative dielectric constant of 2.2 and thickness of 10 mil of Rogers RT/Duroid 5880. Accroding to design and measurement results, a good performance of insertion loss of 2 ㏈ and return loss of -30 ㏈ is achieved at full input/output ports.

• Journal of Korean Society for Atmospheric Environment
• /
• v.24 no.1
• /
• pp.91-99
• /
• 2008

A multilayer tower-type photoreactor, in which $TiO_2$-coated glass-tubes were installed, was used to measure the vapor-phase BTEX removal efficiencies by ozone oxidation ($O_3$/UV), photocatalytic oxidation ($TiO_2$/UV) and the combination of ozone and photocatalytic oxidation ($O_3/TiO_2$/UV) process, respectively. The experiments were conducted under various relative humidities, temperatures, ozone concentrations, gas flow rates and BTEX concentrations. As a result, the BTEX removal efficiency and the oxidation rate by $O_3/TiO_2$/UV system were highest, compared to $O_3$/UV and $TiO_2$/UV system. The $O_3/TiO_2$/UV system accelerated the low oxidation rate of low-concentration organic compounds and removed organic compounds to a large extent in a fixed volume of reactor in a short time. Therefore, $O_3/TiO_2$/UV system as a superimposed oxidation technology was developed to efficiently and economically treat refractory VOCs. Also, this study demonstrated feasibility of a technology to scale up a photoreactor from lab-scale to pilot-scale, which uses (i) a separated light-source chamber and a light distribution system, (ii) catalyst fixing to glass-tube media, and (iii) unit connection in series and/or parallel. The experimental results from $O_3/TiO_2$/UV system showed that (i) the highest BTEX removal efficiencies were obtained under relative humidity ranging from 50 to 55% and temperature ranging from 40 to $50^{\circ}C$, and (ii) the removal efficiencies linearly increased with ozone dosage and decreased with gas flow rate. When applying Langmuir-Hinshelwood model to $TiO_2$/UV and $O_3/TiO_2$/UV system, reaction rate constant for $O_3/TiO_2$/UV system was larger than that for $TiO_2$/UV system, however, it was found that adsorption constant for $O_3/TiO_2$/UV system was smaller than that for $TiO_2$/UV system due to competitive adsorption between organics and ozone.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.4
• /
• pp.1-7
• /
• 1999

We developed Fabrication process of embedded passive components in MCM-D substrate. The proposed MCM-D substrate is based on Cu/photosensitive BCB multilayer. The substrate used is Si wafer and Ti/cu metallization is used to form the interconnect layer. Interconnect layers are formed with 1000$\AA$ Ti/3000$\AA$ Cu by sputtering method and 3$\mu\textrm{m}$ Cu by electrical plating method. In order to form the vias in photosensitive BCB layer, the process of BCB and plasma etch using $C_2F_6$ gas were evaluated. The MCM-D substrate is composed of 5 dielectric layers and 4 interconnect layers. Embedded resistors are made with NiCr and implemented on the $2^{nd}$ dielectric layer. The sheet resistance of NiCr is controlled to be about 21 $\Omega$/sq at the thickness of 600$\AA$. The multi-turn sprial inductors are designed in coplanar fashion on the $4^{th}$ interconnect layer with an underpass from the center to outside using the lower $3^{rd}$ interconnect layer. Capacitors are designed and realized between $1^{st}$ interconnect layer and $2^{nd}$ interconnect layer. An important issue in capacitor is the accurate determination of the dielectric thickness. We use the 900$\AA$ thickness of PECVD silicon nitride film as dielectric. Capacitance per unit area is about 88nF/$\textrm {cm}^2$at the thickness of 900$\AA$. The advantage of this integration process is the compatibility with the conventional semiconductor process due to low temperature PECVD silicon nitride process and thermal evaporation NiCr process.

• Journal of Sensor Science and Technology
• /
• v.7 no.4
• /
• pp.254-262
• /
• 1998

Multilayer Langmuir-Blodgett (LB) films coated on quartz crystal microbalance (QCM) of octa-substituted metallophhtalocyanines ($MPc(OEH)_8$, M = Cu, Co, and Sn) and dihydrogen phthalocyanines ($H_2Pc(OEH)_8$) were used to quantify $NO_2$ concentrations. They were exposed to various concentrations of $NO_2$ in dry $N_2$. Among the four phthalocyanines we tested, the metal-free $H_2Pc(OEH)_8$ was observed to be most sensitive to $NO_2$. However, its LB film showed a partially irreversible behavior, that is part of the frequency change due to $NO_2$ adsorption could not be recovered even after purging with pure $N_2$ gas for an extended period. Examining the spectra of NMR and FTIR revealed fact that the irreversible portion of frequency change was due to ether groups in the linkage between side chains and the Pc unit. In order to remove the effect of such initial deactivation, on $NO_2$ quantification experiment, a freshly fabricated LB film was treated at a high concentration of $NO_2$ so that the ether sites were saturated. A pretreated LB film showed a reproducible performance for repeated uses. The $CuPc(OEH)_8$ LB film showed a satisfactory sensing performance down to as low as 4 ppm. For the $H_2Pc(OEH)_8$ LB film, the lower detection limit was found to be 35ppb of $NO_2$. In order to make the experimental condition more realistic, the carrier gas, dry nitrogen, was replaced by air. It was observed that the presence of oxygen, a weak electron acceptor, reduced the sensitivity and thus increased the sensing limit to hundreds of ppb. Results of experiments with moisture added showed that the interference of moisture was quite severe.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.357-358
• /
• 2005

Compact power amplifier modules (PAM) for WCDMA/KPCS and GSM/WCDMA dual-band applications based on multilayer low temperature co-fired ceramic (LTCC) substrates are presented in this paper. The proposed modules are composed of an InGaP/GaAs HBT PAs on top of the LTCC substrates and passive components such as RF chokes and capacitors which are embedded in the substrates. The overall size of the modules is less than 6mm $\times$ 6mm $\times$ 0.8mm. The measured result shows that the PAM delivers a power of 28 dBm with a power added efficiency (PAE) of more than 30 % at KPCS band. The adjacent-channel power ratio (ACPR) at 1.25-MHz and 2.25-MHz offset is -44dBc/30kHz and -60dBc/30kHz, respectively, at 28-dBm output power. Also, the PAM for WCDMA band exhibits an output power of 27 dBm and 32-dB gain at 1.95 GHz with a 3.4-V supply. The adjacent-channel leakage ratio (ACLR) at 5-MHz and 10-MHz offset is -37.5dBc/3.84MHz and -48dBc/3.84MHz, respectively. The measured result of the GSM PAM shows an output power of 33.4 dBm and a power gain of 30.4 dB at 900MHz with a 3.5V supply. The corresponding power added efficiency (PAE) is more than 52.6 %.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2000.02a
• /
• pp.113-113
• /
• 2000

직접천이형 wide band gap(3.4eV) 반도체중의 하나인 GaN를 청색 및 자외선 laser diode, 고출력 전자장비 등으로 응용하기 위해서는 낮은 접합저항을 갖는 Ohmic contact이 선행되어야 한다. 그러나 만족할만한 p-type GaN의 Ohmic contact은 아직 실현되고 있지 못하며, 이는 GaN와 접합 금속과의 구체적인 반응의 연구를 필요로 한다. 본 연구에서 앞서 Pt, Pt, Ni등의 late transition metal을 p-GaN에 접합시킨 결과 이들은 접합 당시 비교적 평탄하나 후열 처리과정에서 비교적 낮은 온도에서 기판과 열팽창계수의 차이로 인하여 평탄성을 잃어버리면서 barrier height가 증가한다는 사실을 확인하였다. 따라서 본 연구에서는 이러한 열적 불안정성을 극복하기 위하여 Ni과 Pd를 차례로 증착하고 가열하면서 interfacial reaction, film morphology, Fermi level의 움직임을 monchromatic XPS(x-ray photoelectron spectroscopy) 와 SAM(scanning Auger microscopy) 그리고 ex-situ AFM을 이용하여 밝히고자 하였다. 특히 후열처리에 의한 계면 반응에 수반되는 구성 금속원소 간의 합금현상과 금속 층의 평탄성이 밀접한 관계가 있다는 것을 확인하였다. 이러한 합금과정에서 나타나는 금속원소들의 중심 준위의 이동을 체계적으로 규명하기 위해서 Pd1-xNix와 Pd1-xGax 합금들의 표준시료를 arc melting method로 만들어 농도에 따른 금속원소들의 중심 준위의 이동을 측정하여, Pd/Ni/p-GaN 및 Ni/Pd/p-GaN 계에서 열처리 온도에 따른 interfacial reaction을 확인하였다. 그 결과 두 계가 상온에서 nitride 및 alloy를 형성하지 않고 고르게 증착되고, 열처리 온도를 40$0^{\circ}C$에서 $650^{\circ}C$까지 증가시킴에 따라 계면반응의 부산물인 metallic Ga은 증가하고 있으마 nitride는 여전히 형성되지 않는 것을 확인하였다. 증착당시 Ni이 계면에 있는 Pd/Ni/p-GaN의 경우에는 52$0^{\circ}C$까지의 열처리에 의하여 Ni과 Pd가 골고루 섞이고 그 평탄성도 유지되고 barier height의 변화도 없었다. 더 높은 $650^{\circ}C$ 가열에 의해서는 surface free energy가 작은 Ga의 활발한 편석 현상으로 인해 표면은 Ga이 풍부한 Pd-Ga의 합금층으로 덮이고, 동시에 작은 pinhole들이 발생하며 barrier height도 0.3eV 가량 증가하게 된다. 반면에 증착당시 Pd이 계면에 있는 Ni/Pd/p-GaN의 경우에는 40$0^{\circ}C$의 가열까지는 두 금속이 그들 계면에서부터 섞이나, 52$0^{\circ}C$의 가열에 의해 이미 barrier height가 0.2eV 가량 증가하기 시작하였다. 더 높은 $650^{\circ}C$가열에 의해서는 커다란 pinhole, 0.5eV 가량의 barrier height 증가, Pd clustering이 동시에 관찰되었다. 따라서 Ni과 Pd의 일함수는 물론 thermal expansion coefficient가 거의 같으며 surface free energy도 거의 일치한다는 점을 감안하면, 이렇게 뚜렷한 열적 안정성의 차이는 GaN와 contact metal과의 반응시작 온도(disruption onset temperature)의 차이에 기인함을 알 수 있었다. 즉 계면에서의 반응에 의해 편석되는 Ga에 의해 박막의 strain이 이완되면, pinhole 등의 박막결함이 줄어 들고, 이는 계면의 N의 out-diffusion을 방지하여 p-type GaN의 barrier height 증가를 막게 된다.