• Title/Summary/Keyword: MOCVD method

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Stress Determination in Epitaxial Lead Titanate Films by Asymmetric X-ray Diffraction Method

  • Uchida, Hiroshi;Kiguchi, Takanori;Wakiya, Naoki;Shinozaki, Kazuo;Mizutani, Nobuyasu
    • The Korean Journal of Ceramics
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    • v.6 no.4
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    • pp.385-389
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    • 2000
  • Residual stresses in epitaxial films were measured by X-ray diffraction method. Lattice strains of the (hkl) planes measured along particular Ψ-angles were converted to the in-plane stress according to the equation of stress-strain tensor conversion. Residual tensile stresses were observed in epitaxial PbTiO$_3$ films deposited on (100) SrTiO$_3$ substrate. Tensile stresses approximately 0.9 GPa were measured in Pb-rich films, while it increased to approximately 2.0 GPa with the decreasing of Pb content in the case of Pb-poor films, which ascribed to the formation of lead and oxygen vacancies (expressed as x in Pb$_1-x$TiO$_3-x$).

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Optical properties of the $A1_{0.15}$$Ga_{0.85}$N/GaN thin film ($A1_{0.15}$$Ga_{0.85}$N/GaN 박막의 광학적 특성)

  • 정상조;차옥환;서은경;김영실;신현길;조금재;남승재
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.6
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    • pp.553-557
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    • 1999
  • In order to investigate the optical properties of the $Al_XGa_{1-X}N/GaN$ thin film grown by metalorganic chemical vapor deposition (MOCVD) method, the photoluminescene (PL), photocurrent (PC) and persistent photoconductivity (PPC) measurements were carried out at room temperature. The band gap of the $A1_x$$Ga_{1-x}$N/GaN was determined to 3.70 eV by the PL and PC measurements. The PC measurement on the light illumination from the top of the $A1_x$$Ga_{1-x}$N/GaN thin film provides peaks at 3.70, 3.43, and around 2.2 eV. The PC spectrum by the illumination passing through from the substrate of the sample can be shown at 3.43 eV together with a broad tail band from the GaN band edge to around 2.23 eV. The photocurrent quenching and anomalous PPC decay observed in PPC measurements indicate that metastable electron states are fomed in the band gap of GaN layer to trap electrons which can be tunneled the potential barrier for long recovery time.

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Fabrication and Its Characteristics of HgCdTe Infrared Detector (HgCdTe를 이용한 Infrared Detector의 제조와 특성)

  • 김재묵;서상희;이희철;한석룡
    • Journal of the Korea Institute of Military Science and Technology
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    • v.1 no.1
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    • pp.227-237
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    • 1998
  • HgCdTe Is the most versatile material for the developing infrared devices. Not like III-V compound semiconductors or silicon-based photo-detecting materials, HgCdTe has unique characteristics such as adjustable bandgap, very high electron mobility, and large difference between electron and hole mobilities. Many research groups have been interested in this material since early 70's, but mainly due to its thermodynamic difficulties for preparing materials, no single growth technique is appreciated as a standard growth technique in this research field. Solid state recrystallization(SSR), travelling heater method(THM), and Bridgman growth are major techniques used to grow bulk HgCdTe material. Materials with high quality and purity can be grown using these bulk growth techniques, however, due to the large separation between solidus and liquidus line on the phase diagram, it is very difficult to grow large materials with minimun defects. Various epitaxial growth techniques were adopted to get large area HgCdTe and among them liquid phase epitaxy(LPE), metal organic chemical vapor deposition(MOCVD), and molecular beam epitaxy(MBE) are most frequently used techniques. There are also various types of photo-detectors utilizing HgCdTe materials, and photovoltaic and photoconductive devices are most interested types of detectors up to these days. For the larger may detectors, photovoltaic devices have some advantages over power-requiring photoconductive devices. In this paper we reported the main results on the HgCdTe growing and characterization including LPE and MOCVD, device fabrication and its characteristics such as single element and linear array($8{\times}1$ PC, $128{\times}1$ PV and 4120{\times}1$ PC). Also we included the results of the dewar manufacturing, assembling, and optical and environmental test of the detectors.

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Effects of Oxygen on Preparation of TiO2 Thin Films by MOCVD (MOCVD법에 의한 TiO2 박막의 제조에 미치는 산소의 영향)

  • Yu, Seong-Uk;Park, Byeong-Ok;Jo, Sang-Hui
    • Korean Journal of Crystallography
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    • v.6 no.2
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    • pp.111-117
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    • 1995
  • TiO2 thin films were prepared on a (100)silicon wafer using a chemical vapor deposition(CVD) method. The deposition experiments were performed using the TTIP in the deposition temperature ransing from 200 content. The deposition rate of TiO2 was increased with the substrate temperature and the oxygen content. The thickness of the deposited thin film and the compositional analysis of this thin films with theoxygen content were measured using Ellipsometry, SEM and ESCA, respectively. The deposited thin film was composed of a bilayer, external TiO2 and internal Ti. Carbon as a residual impurity was found to remain when zero sccm O2 was purged into a reaction chamber and the composition of the deposited thin film was found to change Ti into TiO in a deeper layer. However, when 600sccm O2 was supplied to a reaction chamber, it has been found to reside less carbon content than without O2. Finally, in the condition of 1200sccm O2, no impurity level of carbon was observed and a deeper layer consisted of the Ti composite, even though the deposited surface was composed of TiO2.

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$TiO_2$ Thin Film Patterning on Modified Silicon Surfaces by MOCVD and Microcontact Printing Method

  • 강병창;이종현;정덕영;이순보;부진효
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.77-77
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    • 2000
  • Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

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Comparative studies of ohmic metallization on p-GaAsSb (금속에 따른 p-GaAsSb 오믹접촉의 전기적 특성에 관한 비교 연구)

  • Cho, Seung-Woo;Jang, Jae-Hyung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.33-36
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    • 2004
  • 탄소 도핑$(5{\times}10^{19}\;cm^{-3})$된 p-type GaAsSb 에피층 위에, Ti/Pt/Au, Pd/Au, Pd/Ir/Au를 이용한 다층 오믹 접촉을 제작하였다. MOCVD(metal-organic chemical vapor deposition)를 이용하여 성장시킨 이 p-GaAsSb의 정공 이동도는 탄소의 도핑 농도가 매우 높음에도 불구하고, $50\;cm^2/Vs$로 측정되었다. 오믹 접촉의 전기적 특성을 측정하기 위하여 TLM(Transfer length method)를 이용하였다. Pd/Ir/Au을 이용한 오믹접촉의 specific contact resistivity는 $10^{-8}\;ohm-cm^2$ 보다 작은 수치를, transfer length는 100 nm보다 작은 수치를 보였으며, Ti/Pt/Au을 이용한 ohmic contact의 specific contact resistivity는 $10^{-7|\;ohm-cm^2$ 보다 작은 수치를, transfer length는 400 nm보다 작은 수치를 나타내었다.

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Design and Fabrication of Laser Diode Integrated with Peltier Cooler (열전 냉각기가 집적된 레이저 다이오드)

  • 이상일;박정호
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.1
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    • pp.159-165
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    • 1995
  • A double-heterostructure mesa-stripe-geometry laser diode integrated with thermoelectric Peltier cooler has been designed and fabricated. Epi-layers have been grown by metal organic chemical vapor deposition(MOCVD) method. Peltier cooling effect has been measured for devices with a mesa width of 14$\mu$m and a cavity length of 380$\mu$m. The effects of thermoelectric cooling could be shown by measuring the optical output of the laser with the increase of the current in the thermoelectric cooler. While the input courrent of the laser was maintained at 250mA, the optical output was decreased from 4.8mW to 3.8mW due to heating, but with the thermoelectric cooler on the optical output power was recovered by more than 40%. The results show that the complicated cooling device is not needed since the cooling can be achevied by the developement of the fabrication processing.

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Optimization of inlet velocity profile for uniform epitaxial growth (균일한 에피층 성장을 위한 입구 유속분포 최적화)

  • Cho W. K.;Choi D. H.;Kim M.-U.
    • 한국전산유체공학회:학술대회논문집
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    • 1998.11a
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    • pp.121-126
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    • 1998
  • A numerical optimization procedure is developed to find the inlet velocity profile that yields the most uniform epitaxial layer in a vertical MOCVD reactor. It involves the solution of fully elliptic equations of motion, temperature, and concentration; the finite volume method based on SIMPLE algorithm has been adopted to solve the Navier-Stokes equations. The overall optimization process is highly nonlinear and has been efficiently treated by the sequential linear programming technique that breaks the non-linear problem into a series of linear ones. The optimal profile approximated by a 6th-degree Chebyshev polynomial is very successful in reducing the spatial non-uniformity of the growth rate. The optimization is particularly effective to the high Reynolds number flow. It is also found that a properly constructed inlet velocity profile can suppress the buoyancy driven secondary flow and improve the growth-rate uniformity.

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Photocatalytic Behavior of TiO2 Films : Thickness and Roughness Dependence

  • Kim, Hark Jin;Yoo, Seon Mi;Yu, Sora;Lee, Wan In
    • Rapid Communication in Photoscience
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    • v.2 no.1
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    • pp.1-8
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    • 2013
  • Transparent $TiO_2$ films in various thicknesses were prepared by sol-gel and MOCVD method, respectively, and their photocatalytic activities in decomposing gaseous 2-propanol were evaluated. The surfaces and grain structures of the prepared films were characterized by FESEM, XRD, and AFM. It was found that the photocatalytic activities of $TiO_2$ films were greatly dependent on the film thickness and surface roughness: The photocatalytic activity increases with the increase of film thickness, while it decreases with the increase of surface roughness. We have proposed that these phenomena originate from the transfer of photogenerated electron and hole pairs from the bulk to the surface of $TiO_2$ film. Several experimental evidences supporting this mechanism have also been provided.

Free exciton transitions and Varshni′s coeffecients for GaN epitaxial layers grown by horizontal LP - MOCVD

  • Lee, Joo-in;Leem, Jae-Young;Son, J.S.;Viswanath, A. Kasi
    • Journal of Korean Vacuum Science & Technology
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    • v.4 no.3
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    • pp.63-67
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    • 2000
  • We have studied the photoluminescence properties of undoped epitaxial layers of GaN on sapphire substrate grown by horizontal low pressure metal organic chemical vapor deposition method in the temperature range of 9-300 K. At 9 K the spectra are dominated by the well resolved interband free excitons A and B as well as bound excitons. Temperature dependence of free exciton transitions was studied and Varshni's coefficients for the temperature variation of bandgap were determined.

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