• ETRI Journal
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• v.7 no.2
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• pp.40-42
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• 1985

전자부품의 고장률은 그부품 고유의 activation 에너지에 의해 결정되며 이 activation 에너지는 온도의 변화에 관계없이 일정하다. 본고에서는 온도 변화에 따른 부품의 고장률과 activation 에너지와의 관계를 검토함으로서 MIL-HDBK-217의 부품고장률 예측방법을 분석하였다.

• Journal of the Korean Society of Systems Engineering
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• v.12 no.2
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• pp.9-18
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• 2016

Machine switch type control panel is widely used for machine tools in Korea. They, however, have some difficulties in identifying the current operating status of machine tools especially when exposed to cutting oil. And also they have quality problems of operating failures. A new capacitor touch type machine control panel is developed and its reliability is predicted. MIL-HDBK-217F and Teclordia SR-332 are used for its reliability prediction and the prediction results are compared.

• Journal of Applied Reliability
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• v.11 no.2
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• pp.141-149
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• 2011

Environment Conversion Factors, which are stipulated in System Reliability Toolkit, have a lot of advantages once applied in a reliability data handbook such as NPRD-95, during the process of reliability prediction. However, the factors have a restriction in their applications because they don't deal with a few environments, e.g., Missile Launch (ML). In this study, environment factors of various components from MIL-HDBK-217F were analyzed to address this problem. Statistical computations showed that converting from Airborne Rotary Wing (ARW) to Missile Launch (ML) was the most coherent by comparing coefficient of determination. In addition, conversion factors from System Reliability Toolkit and those from the statistical calculations were evaluated in terms of their similarities.

• Aerospace Engineering and Technology
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• v.4 no.1
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• pp.203-210
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• 2005

Prototype model of MDU(Master Data Unit), to be employed on KSLV-I, has been developed and tested being interfaced with other units. Before stepping into the development of engineering and flight model phases, we have carried out reliability prediction of prototype MDU in order to assure availability of the unit. This paper describes the method of reliability prediction of prototype MDU and prediction results based on MIL-HDBK-217F, 'Electronic Reliability Design Handbook'.

• Journal of Korean Society for Quality Management
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• v.39 no.4
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• pp.507-515
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• 2011

MIL-HDBK-217 has played a pivotal role in reliability prediction of electronic equipments for more than 30 years. Recently, RIAC developed a new methodology $217Plus^{TM}$which officially replaces MIL-HDBK-217. Sensitivity analysis of the 217Plus component models to various parameters has been performed and meaningful observations have been drawn in this study. We first briefly reviewed the $217Plus^{TM}$ methodolog and compared it with the conventional model, MIL-HDBK-217. We then performed sensitivity analysis $217Plus^{TM}$ component models to various parameters. Based on the six parameters and an orthogonal array selected, we have performed indepth analyses concerning parameter effects on the model. Our result indicates that, among various parameters, operating temperature and temperature rise during operation have the most significant impacts on the life of a component, and thus a design robust to high temperature is the most importantly required. Next, year of manufacture, duty cycle, and voltage stress are weaker but may be significant when they are in heavy load conditions. Although our study is restricted to a specific type of diodes, the results are still valid to other cases. The results in this study not only figure out the behavior of the predicted failure rate as a function of parameters but provide meaningful guidelines for practical applications.

• Journal of Industrial Technology
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• v.28 no.B
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• pp.215-226
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• 2008

MIL-HDBK-217 has widely been used for electronics reliability predictions. Recently, the $217Plus^{TM}$ has been developed by DoD RIAC and may replace MIL-HDBK-217. A overview of the $217Plus^{TM}$ has been performed in this paper. We first reviewed the overall concepts and reliability prediction procedures. We then explained the component models and the system level model with process grading concepts. Bayesian approach incorporating field data into the predicted failure rate is another feature of this methodology.

• IE interfaces
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• v.21 no.1
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• pp.85-95
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• 2008

Reliability prediction serves many purposes during the life of a system, so several methods have been developed to predict the parts and systems reliability. MIL-HDBK-217F, among the those methods, has been widely used as a requisite tool for the reliability prediction which is applied to nuclear power plants and their safety regulations. This paper presents the reliability prediction for the DSP(Digital Signal Processor) module composed of three assemblies. One of the assemblies has a monitoring and self test function which is used to enhance the module reliability. The reliability of each assembly is predicted by MIL-HDBK-217F. Based on these predicted values, Markov modelling is finally used to predict the module reliability. Relax 7.7 software of Relax software corporation is used because it has many part libraries and easily handles Markov processes modelling.

• Journal of Applied Reliability
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• v.11 no.4
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• pp.399-407
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• 2011

Reliability evaluation of One-Shot system which flies at speed of Mach must be evaluated as the result of many firing tests. But many firing tests are impossible because of budget deficit. Consequently the reliability prediction which substitutes firing tests is used. The accuracy of reliability prediction is decided according to a quantity of accumulated test data. If the test data is insufficient, the direction of prediction can not be set. So we propose the reliability prediction method which applies MIL-HDBK-217 Plus. MIL-HDBK-217 Plus is described about reliability prediction method without sufficient test data. So we apply MIL-HDBK-217 Plus to the rocket motor system, and we accomplish a modeling and a reliability prediction about the system.

• Journal of Industrial Technology
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• v.27 no.B
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• pp.255-261
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• 2007

Product reliability plays a significantly important role these days. This study has been performed to examine the widely being used specifications, MIL-HDBK-217 and SR-332 for electronic parts. We specifically selected an electronic ballast of the low wattage fluorescent lamp for the study. We briefly reviewed the reliability specifications with the basic concepts of the ballast. We then valuated failure rates of the parts using MIL-HDBK-217 and SR-332 specifications. Since the quality and environment factor values are subjectively determined for failure rate evaluations, we excluded them for comparison.

• Electronics and Telecommunications Trends
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• v.9 no.2
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• pp.77-86
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• 1994

부품 고장률은 시스템 신뢰도를 계산하는데 기본이 되는 요인이다. 신뢰도 예측은 부품고장률에서 회로팩, 블록, 서브시스템 및 시스템 신뢰도 순으로 계산되는 Bottom-up 방식으로 수행되기 때문이다. 본 고에서는 부품 고장률 계산시 일반적으로 사용되고 있는 미 국방부 전자부품 신뢰도 예측방법인 MIL-HDBK-217를 이용한 Microcircuit의 부품 고장률 계산방법을 나타냈다. 또한 Microcircuit의 신뢰도를 MIL-HDBK-217 예측방법 및 예측결과와 외국 예측방법 및 예측결과로 비교하여 나타냈다.