Overview of the 217Plus^TM, Electronic System Reliability Prediction Methodology

전기전자 시스템 신뢰성 예측 방법론 217Plus^TM의 개요

MIL-HDBK-217 has widely been used for electronics reliability predictions. Recently, the $217Plus^{TM}$ has been developed by DoD RIAC and may replace MIL-HDBK-217. A overview of the $217Plus^{TM}$ has been performed in this paper. We first reviewed the overall concepts and reliability prediction procedures. We then explained the component models and the system level model with process grading concepts. Bayesian approach incorporating field data into the predicted failure rate is another feature of this methodology.