• 제목/요약/키워드: MFM capacitor

검색결과 7건 처리시간 0.019초

High Security FeRAM-Based EPC C1G2 UHF (860 MHz-960 MHz) Passive RFID Tag Chip

  • Kang, Hee-Bok;Hong, Suk-Kyoung;Song, Yong-Wook;Sung, Man-Young;Choi, Bok-Gil;Chung, Jin-Yong;Lee, Jong-Wook
    • ETRI Journal
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    • 제30권6호
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    • pp.826-832
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    • 2008
  • The metal-ferroelectric-metal (MFM) capacitor in the ferroelectric random access memory (FeRAM) embedded RFID chip is used in both the memory cell region and the peripheral analog and digital circuit area for capacitance parameter control. The capacitance value of the MFM capacitor is about 30 times larger than that of conventional capacitors, such as the poly-insulator-poly (PIP) capacitor and the metal-insulator-metal (MIM) capacitor. An MFM capacitor directly stacked over the analog and memory circuit region can share the layout area with the circuit region; thus, the chip size can be reduced by about 60%. The energy transformation efficiency using the MFM scheme is higher than that of the PIP scheme in RFID chips. The radio frequency operational signal properties using circuits with MFM capacitors are almost the same as or better than with PIP, MIM, and MOS capacitors. For the default value specification requirement, the default set cell is designed with an additional dummy cell.

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P(VDF-TrFE) 유기물 강유전체를 활용한 질화갈륨 네거티브 커패시턴스 전계효과 트랜지스터 (Investigation of GaN Negative Capacitance Field-Effect Transistor Using P(VDF-TrFE) Organic/Ferroelectric Material)

  • 한상우;차호영
    • 전기전자학회논문지
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    • 제22권1호
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    • pp.209-212
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    • 2018
  • 본 논문에서는 P(VDF-TrFE)유기물 강유전체 기반 metal-ferroelectric-metal (MFM) capacitor 와 차세대 반도체 물질인 질화갈륨 반도체를 활용한 네거티브 커패시턴스 전계효과 트랜지스터를 제작 및 분석 하였다. 27 nm의 두께의 P(VDF-TrFE) MFM 커패시터의 분극지수는 4 MV/cm에서 $6{\mu}C/cm^2$ 값을 나타내었으며 약 65 ~ 95 pF의 커패시턴스 값을 나타내었다. 강유전체의 커패시턴스와 전계효과 트랜지스터의 커패시턴스 매칭을 분석하기 위해 제작된 P(VDF-TrFE) MFM 커패시터는 GaN 전계효과 트랜지스터의 게이트 전극에 집적화 되었으며 집적화되기 전 104 mV/dec 의 문턱전압 이하 기울기에서 82 mV/dec 값으로 개선된 효과를 보였다.

Tunable RF 기기 적용을 위한 ALD-HfO2의 마이크로파 대역 강유전체 특성 고찰 (Study on the Ferroelectric Properties of ALD-HfO2 in Microwave Band for Tunable RF Apparatus)

  • 한상우;이창현;이정해;차호영
    • 전기전자학회논문지
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    • 제22권3호
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    • pp.780-785
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    • 2018
  • 본 논문에서는 tunable RF 기기에 적용이 가능한 $HfO_2$ 강유전체를 활용하여 metal-ferroelectric-metal (MFM) 커패시터를 구현하였으며 마이크로파 대역주파수 까지 전압에 따른 커패시턴스 tunability 특성을 고찰 하였다. 1kHz부터 5GHz 대역에 이르기까지 광범위한 범위의 커패시턴스-전압 특성을 분석하였으며 커패시턴스 tunability는 500 MHz 이상의 주파수에서 2.5 GHz 대역까지 ~3 %의 tunability가 유지되는 것을 확인 하여 마이크로파 주파수 대역에서 ALD $HfO_2$기반 전자 제어 가변 커패시터의 사용 가능성을 입증하였다.

초박막 폴리머 강유전체 박막의 특성 (Characteristics of Ultra-thin Polymer Ferroelectric Films)

  • 김광호
    • 반도체디스플레이기술학회지
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    • 제19권4호
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    • pp.84-87
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    • 2020
  • The properties of ultra-thin two-dimensional (2D) organic ferroelectric Langmuir-Blodgett (LB) films of the poly(vinylidene fluoride-trifluoroethylene) [P(VDF-TrFE)] were investigated to find possible applicability in flexible and wearable electronics applications. In the C-V characteristics of the MFM capacitor of 2-monolayer of 5 nm films, a butterfly hysteresis curve due to the ferroelectricity of P(VDF-TrFE) was confirmed. Typical residual polarization value was measured at 2μC/㎠. When the MFM capacitor with ultra-thin ferroelectric film was measured by applying a 10 Hz bipolar pulse, it was shown that 65% of the initial polarization value in 105 cycles deteriorated the polarization. The leakage current density of the 2-monolayer film was maintained at about 5 × 10-8 A/㎠ for the case at a 5MV/cm electric field. The resistivity of the 2-monolayer film in the case at an electric field at 5 MV/cm was more than 2.35 × 1013 Ω·cm.

Hf0.5Zr0.5O2 강유전체 박막의 다양한 분극 스위칭 모델에 의한 동역학 분석 (Switching Dynamics Analysis by Various Models of Hf0.5Zr0.5O2 Ferroelectric Thin Films)

  • 안승언
    • 한국재료학회지
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    • 제30권2호
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    • pp.99-104
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    • 2020
  • Recent discoveries of ferroelectric properties in ultrathin doped hafnium oxide (HfO2) have led to the expectation that HfO2 could overcome the shortcomings of perovskite materials and be applied to electron devices such as Fe-Random access memory (RAM), ferroelectric tunnel junction (FTJ) and negative capacitance field effect transistor (NC-FET) device. As research on hafnium oxide ferroelectrics accelerates, several models to analyze the polarization switching characteristics of hafnium oxide ferroelectrics have been proposed from the domain or energy point of view. However, there is still a lack of in-depth consideration of models that can fully express the polarization switching properties of ferroelectrics. In this paper, a Zr-doped HfO2 thin film based metal-ferroelectric-metal (MFM) capacitor was implemented and the polarization switching dynamics, along with the ferroelectric characteristics, of the device were analyzed. In addition, a study was conducted to propose an applicable model of HfO2-based MFM capacitors by applying various ferroelectric switching characteristics models.

PZT 박막 캐퍼시터의 특성에 기여하는 PZT-전극계면층의 영향 (Effects of PZT-Electrode Interface Layers on Capacitor Properties)

  • 김태호;구준모;민형섭;이인섭;김지영
    • 한국재료학회지
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    • 제10권10호
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    • pp.684-690
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    • 2000
  • Metal-Ferroelectric-Metal(MFM) 구조의 개퍼시터에서 $Pb(Zr,Ti)O_3(PZT)$-전극 계면층이 PZT 박막 특성에 기여하는 영향을 알아보기 위하여 Pt/PZT/계면층/Pt/$TiO_2/SiO_2$/Si 구조의 캐퍼시터를 제작하였다. 계면층으로 사용될 물질들 중에서 $PbTiO_3(PT)$ 층을 sol-gel 방법으로 형성하였으며, PbO, $ZrO_2,\;TiO_2$ 층들을 reactive sputtering 방법으로 형성하였다. PZT박막을 구성하는 원소들로 이루어진 단순 산화물들의 특성을 평가하기 위하여 PbO, $ZrO_2,\;TiO_2$를 계면층으로 사용하여 $600^{\circ}C$에서 열처리를 실시하였고, 이 경우에는 $TiO_2$가 가장 우수하게 PZT의 결정립 크기를 미세하게 하는 효과를 보였으나, 두께가 증가함에 따라 표면 거칠기가 증가하고 anatase 상으로 남기 때문에 강유전특성이 열화되었다. 반면에 PT 박막을 계면층으로 사용한 경우에는 결정립 크기의 감소와 더불어 전기적인 특성도 향상되었다. 또한 PZT의 핵생성 위치를 판단하기 위하여 PT 삽입층의 위치를 변화하며, 실험한 결과, 하부전극과 PZT 박막의 계면에 PT 삽입층을 형성하였을 경우에 가장 효과적인 seed로서의 역할을 하였다.

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강유전체 Hf0.5Zr0.5O2 박막의 퍼니스 어닐링 효과 연구 (Furnace Annealing Effect on Ferroelectric Hf0.5Zr0.5O2 Thin Films)

  • 조민관;유정규;박혜련;강종묵;공태호;정용찬;김지영;김시준
    • 한국전기전자재료학회논문지
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    • 제36권1호
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    • pp.88-92
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    • 2023
  • The ferroelectricity in Hf0.5Zr0.5O2 (HZO) thin films is one of the most interesting topics for next-generation nonvolatile memory applications. It is known that a crystallization process is required at a temperature of 400℃ or higher to form an orthorhombic phase that results in the ferroelectric properties of the HZO film. However, to realize the integration of ferroelectric HZO films in the back-end-of-line, it is necessary to reduce the annealing temperature below 400℃. This study aims to comprehensively analyze the ferroelectric properties according to the annealing temperature (350-500℃) and time (1-5 h) using a furnace as a crystallization method for HZO films. As a result, the ferroelectric behaviors of the HZO films were achieved at a temperature of 400℃ or higher regardless of the annealing time. At the annealing temperature of 350℃, the ferroelectric properties appeared only when the annealing time was sufficiently increased (4 h or more). Based on these results, it was experimentally confirmed that the optimization of the annealing temperature and time is very important for the ferroelectric phase crystallization of HZO films and the improvement of their ferroelectric properties.