• Title/Summary/Keyword: MEMS sensors

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Non-invasive acceleration-based methodology for damage detection and assessment of water distribution system

  • Shinozuka, Masanobu;Chou, Pai H.;Kim, Sehwan;Kim, Hong Rok;Karmakar, Debasis;Fei, Lu
    • Smart Structures and Systems
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    • v.6 no.5_6
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    • pp.545-559
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    • 2010
  • This paper presents the results of a pilot study and verification of a concept of a novel methodology for damage detection and assessment of water distribution system. The unique feature of the proposed noninvasive methodology is the use of accelerometers installed on the pipe surface, instead of pressure sensors that are traditionally installed invasively. Experimental observations show that a sharp change in pressure is always accompanied by a sharp change of pipe surface acceleration at the corresponding locations along the pipe length. Therefore, water pressure-monitoring can be transformed into acceleration-monitoring of the pipe surface. The latter is a significantly more economical alternative due to the use of less expensive sensors such as MEMS (Micro-Electro-Mechanical Systems) or other acceleration sensors. In this scenario, monitoring is made for Maximum Pipe Acceleration Gradient (MPAG) rather than Maximum Water Head Gradient (MWHG). This paper presents the results of a small-scale laboratory experiment that serves as the proof of concept of the proposed technology. The ultimate goal of this study is to improve upon the existing SCADA (Supervisory Control And Data Acquisition) by integrating the proposed non-invasive monitoring techniques to ultimately develop the next generation SCADA system for water distribution systems.

A CMOS Switched-Capacitor Interface Circuit for MEMS Capacitive Sensors (MEMS 용량형 센서를 위한 CMOS 스위치드-커패시터 인터페이스 회로)

  • Ju, Min-sik;Jeong, Baek-ryong;Choi, Se-young;Yang, Min-Jae;Yoon, Eun-jung;Yu, Chong-gun
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2014.10a
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    • pp.569-572
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    • 2014
  • This paper presents a CMOS switched-capacitor interface circuit for MEMS capacitive sensors. It consist of a capacitance to voltage converter(CVC), a second-order ${\Sigma}{\Delta}$ modulator, and a comparator. A bias circuit is also designed to supply constant bias voltages and currents. This circuit employes the correlated-double-sampling(CDS) and chopper-stabilization(CHS) techniques to reduce low-frequency noise and offset. The designed CVC has a sensitivity of 20.53mV/fF and linearity errors less than 0.036%. The duty cycle of the designed ${\Sigma}{\Delta}$ modulator output increases about 5% as the input voltage amplitude increases by 100mV. The designed interface circuit shows linearity errors less than 0.13%, and the current consumption is 0.73mA. The proposed circuit is designed in a 0.35um CMOS process with a supply voltage of 3.3V. The size of the designed chip including PADs is $1117um{\times}983um$.

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Etching Characteristics of Micro Blaster for MEMS Applications (MEMS 공정에 적용하기 위한 마이크로 블라스터 식각 특성)

  • Cho, Chan-Seob;Bae, Ig-Soon;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.20 no.3
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    • pp.187-192
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    • 2011
  • Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

Fabrication and characterization of fine pitch IR image sensor using a-Si (비정질 실리콘을 이용한 미세 피치 적외선 이미지 센서 제조 및 특성)

  • Kim, Kyoung-Min;Kim, Byeong-Il;Kim, Hee-Yeoun;Jang, Won-Soo;Kim, Tae-Hyun;Kang, Tai-Young
    • Journal of Sensor Science and Technology
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    • v.19 no.2
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    • pp.130-136
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    • 2010
  • The microbolometer array sensor with fine pitch pixel array has been implemented to the released amorphous silicon layer supported by two contact pads. For the design of focal plane mirror with geometrical flatness, the simple beam test structures were fabricated and characterized. As the beam length decreased, the effect of beam width on the bending was minimized, Mirror deformation of focal plane in a real pixel showed downward curvature by residual stress of a-Si and Ti layer. The mirror tilting was caused by the mis-align effect of contact pad and confirmed by FEA simulation results. The properties of bolometer have been measured as such that the NETD 145 mK, the TCR -2 %/K, and thermal time constant 1.99 ms.

The amplifier-circuit design of EEG sensor based on MEMS (초소형정밀기계기술이 적용된 뇌파센서의 신호 증폭 회로설계)

  • Choi, Sung-Ja;Lee, Seung-Han;Cho, Young-Taek;Cho, Han-Wook
    • Proceedings of the KIEE Conference
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    • 2015.07a
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    • pp.1427-1428
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    • 2015
  • MEMS(Micro Electro-mechanical System) are getting attention as promising industry in the 21st century. Car air bags, acceleration sensors, and medical, information appliances are being actively applied in MEMS. This paper suggest the electrical electrodes of brain signal applied MEMS model and the prototype design for EEG signal amplification circuit. Also, we suggest an independent BCI(Brain Computer Interface) system with brain electrical signal of electrode models and wireless communication platform.

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A study on the design and fabrication of electrostatically actuatedRF MEMS switches (정전 구동형 RF MEMS 스위치의 설계 및 제작에 관한 연구)

  • Park, Jae-Hyoung
    • Journal of Sensor Science and Technology
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    • v.19 no.4
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    • pp.320-327
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    • 2010
  • In this paper, electrostatically actuated direct contact type RF MEMS switches have been designed and demonstrated. As driving structures of the switch, cantilever, bridge, and torsion spring beam structures are used and the actuation voltage characteristics of the switches have been compared and discussed. The designed RF switches are fabricated with the surface micromachining technology using the electroplated gold and nickel structures. The characteristics of the fabricated switches are measured and analyzed. The switch, which is fabricated using the 510 ${\mu}m$-length bridge structure with the thickness of 1.5 ${\mu}m$, is actuated with 15 V driving voltage. The insertion losses are less than 0.2 dB over the measured frequency ranges from 0 to 20 GHz and the isolations are more than 30 dB.

MEMS Technology for Biophotonic Applications (바이오포토닉스응용을 위한 MEMS 미세광학소자의 개발)

  • Jeong, Gi-Hun
    • Proceedings of the Optical Society of Korea Conference
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    • 2009.02a
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    • pp.387-388
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    • 2009
  • Biophotonics is an emerging area in a fusion of biology and photonics, especially in advanced bioimaging, optical biosensors, photomodulation, and biochip optical read-out, and optical manipulation. This emerging area also creates many opportunities for interdisciplinary study of biology and photonics. Micro-Electro-Mechanical-System(MEMS) is an attractive technology in miniaturizing sensors and actuactors. For last decade, it has contributed to the development for active and passive small and integrated optical components in optical communication. Recently, this technology is also merging into biology for high sensitive biosensing and high resolution and fast bioimaging in small form factor. In this talk, some key advantages of small optical components and recent biophotonic MEMS achievement will be discussed for miniaturized advanced biophotonic systems.

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Thermo-mechanical Design for On-orbit Verification of MEMS based Solid Propellant Thruster Array through STEP Cube Lab Mission

  • Oh, Hyun-Ung;Ha, Heon-Woo;Kim, Taegyu;Lee, Jong-Kwang
    • International Journal of Aeronautical and Space Sciences
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    • v.17 no.4
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    • pp.526-534
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    • 2016
  • A MEMS solid propellant thruster array shall be operated within an allowable range of operating temperatures to avoid ignition failure by incomplete combustion due to a time delay in ignition. The structural safety of the MEMS thruster array under severe on-orbit thermal conditions can also be guaranteed by a suitable thermal control. In this study, we propose a thermal control strategy to perform on-orbit verification of a MEMS thruster module, which is expected to be the primary payload of the STEP Cube Lab mission. The strategy involves, the use of micro-igniters as heaters and temperature sensors for active thermal control because an additional heater cannot be implemented in the current design. In addition, we made efforts to reduce the launch loads transmitted to the MEMS thruster module at the system level structural design. The effectiveness of the proposed thermo-mechanical design strategy has been demonstrated by numerical analysis.

Sub-ppm level MEMS gas sensor (서브 피피엠 레벨 미세기전 가스 센서)

  • Ko, Sang-Choon;Jun, Chi-Hoon;Song, Hyun-Woo;Park, Seon-Hee
    • Journal of Sensor Science and Technology
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    • v.17 no.3
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    • pp.183-187
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    • 2008
  • A sub-ppm level MEMS gas sensor that can be used for the detection of formaldehyde (HCHO) is presented. It is realized by using a zinc oxide (ZnO) thin-film material with a Ni-seed layer as a sensing material and by bulk micromachining technology. To enhance sensitivity of the MEMS gas sensor with Ni-seed layer was embedded with ZnO sensing material and sensing electrodes. As experimental results, the changed sensor resistance ratio for HCHO gas was 9.65 % for 10 ppb, 18.06 % for 100 ppb, and 35.7 % for 1 ppm, respectively. In addition, the minimum detection level of the fabricated MEMS gas sensor was 10 ppb for the HCHO gas. And the measured output voltage was about 0.94 V for 10 ppb HCHO gas concentration. The noise level of the fabricated MEMS gas sensor was about 50 mV. The response and recovery times were 3 and 5 min, respectively. The consumption power of the Pt micro-heater under sensor testing was 184 mW and its operating temperature was $400^{\circ}C$.