• 센서학회지
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• 제17권1호
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• pp.75-80
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• 2008

In this work, we optimized a microbolometer for application of a $CO_2$ detector by using MEMS technology. We fabricated a stable thermal isolation structure by varying the lengths of supporting legs which affect bolometer performance. We could fabricate more stable thermal isolation structure for the microbolometer through the results of ANSYS simulations, and minimize the fabrication processes by using bulk micromachining to use a $CO_2$ detector. The microbolometer shows a detectivity of $2.5{\times}109$ cmHz$^{1/2}$/W at a chopper frequency of 8 Hz and a bias current of $6.25\;{\mu}A$ with a vacuum package of about $3.0{\times}10.3$ torr. Therefore, we put to conclusion that the microbolometer optimized in this experiment could be useful for the application of a $CO_2$ detector.

• 한국항공우주학회지
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• 제46권4호
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• pp.315-323
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• 2018

캔 위성은 음료수 캔 크기로 위성의 전반적인 시스템을 모사할 수 있어 교육프로그램 일환으로서 큰 각광을 받고 있으며, 국내에서는 2012년도부터 매년 캔 위성 경연대회가 개최되고 있다. 본 논문에서 제안된 캔 위성은 2015년도 국내 캔 위성 경연대회에 출전한 P.P.T CanSat으로 태양에너지 무선전송시스템 및 피에조, 풍력 에너지 하베스팅 시스템을 통해 생성된 전력으로 LED 점멸 및 MEMS기반의 센서 모듈을 자가 구동하는 것을 임무목표로 한다. 본 논문에서는 상기 캔 위성의 시스템 설계 및 주요 임무 탑재체 기능검증 시험, 비행시험, 실패원인 분석 및 재시험에 대해 기술하였다.

• 비파괴검사학회지
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• 제31권5호
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• pp.522-528
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• 2011

인간의 청각기능을 보조하거나 대체할 수 있는 차세대 인공와우기술의 개발은 기존 인공와우의 단점인 잦은 충전, 장애 노출 등을 극복하고 향상된 음감을 전달할 수 있는 기술로서 세계적으로 많은 연구를 수행하고 있다. 본 연구에서는 달팽이관의 기저막이 갖는 주파수 분리 기능 및 유모세포(haircell)의 이온채널 작용에 의한 생체 전기신호 발생 기능을 할 수 있는 PVDF(polyvinylidene fluoride) 압전 박막형 인공기저막을 설계, 제작 및 시험평가를 하고자 하였다. 생체 기저막과 유사한 주파수 분리 특성을 갖는 사다리꼴 형상의 인공기저막을 제작하고, MEMS 공정을 이용한 전극 증착 및 유체 유동이 가능한 챔버를 형성하였다. 또한 인공기저막의 거동을 측정하기 위하여 비접촉 LDV측정 장비, 스피커, 기준 마이크로폰 등을 사용하여 실험 장치를 구성하였다. 기계적 성능시험 결과, PVDF 압전박막형 인공기저막은 입사하는 음파의 주파수 분리를 잘 수행할 수 있음을 실험적으로 입증하였다.

• 반도체디스플레이기술학회지
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• 제5권2호
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• pp.33-36
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• 2006

Many issues arose to use the Pb-free solder as adhesive materials in MEMS ICs and packaging. Then this study for easy and simple sealing method using adhesive materials was carried out to maintain hermetic characteristic in MEMS Package. In this study, Hermetic characteristic using negative PR (XP SU-8 3050 NO-2) as adhesive at the interface of Si test coupon/glass substrate and Si test coupon/LTCC substrate was examined. For experiment, the dispenser pressure was 4 MPa and the $200\;{\mu}m{\Phi}$ syringe nozzle was used. 3.0 mm/sec as speed of dispensing and 0.13 mm as the gap between Si test coupon and nozzle was selected to machine condition. 1 min at $65^{\circ}C$ and 15 min at $95^{\circ}C$ as Soft bake, $200\;mj/cm^2$ expose in 365 nm wavelength as UV expose, 1 min at $65^{\circ}C$ and 6 min at $95^{\circ}C$ as Post expose bake, 60 min at $150^{\circ}C$ as hard bake were selected to activation condition of negative PR. Hermetic sealing was achieved at the Si test coupon/ glass substrate and Si test coupon/LTCC substrate. The leak rate of Si test coupon/glass substrate was $5.9{\times}10^{-8}mbar-l/sec$, and there was no effect by adhesive method. The leak rate of Si test coupon/LTCC substrate was $4.9{\times}10^{-8}mbar-l/sec$, and there was no effect by dispensing cycle. Better leak rate value could be achieved to use modified substrate which prevent PR flow, to increase UV expose energy and to use system that controls gap automatically with vision.

• Structural Engineering and Mechanics
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• 제22권4호
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• pp.433-447
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• 2006

The problem of very large deflection of a circular cantilever arc device subjected to inward or outward polar force is studied. An exact elliptic integral solution is derived for the two cases and the results are checked using large displacement finite element analysis via the ANSYS package by performing a new novel modeling simulation technique for this problem. Excellent agreements have been obtained between the exact analytical solution and the numerical approach. From this study, a design chart for engineers is developed to predict the required value for the inward polar force for the device to switch on for a given angle forming the circular arc (${\theta}_o$). This study has several interesting applications in mechanical engineering, integrated circuit technology, nanotechnology and especially in microelectromechanical systems (MEMs) such as a MEM circular device switch subjected to attractive or repulsive magnetic forces due to the attachments of two magnetic poles at the fixed and at the free end of the circular cantilever arc switch device.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.23-34
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• 2013

Over the past several decades in the microelectronics industry, devices have gotten smaller, thinner, and lighter, without any accompanying degradation in quality, performance, and reliability. One permanent and deniable trend in packaging as well as wafer fabrication industry is system integration. The proliferating options for system integration, recently, are driving change across the overall semiconductor industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solution. The trend toward 3D system integration and miniaturization in a small form factor has accelerated even more with the introduction of smartphones and tablets. In this paper, the key issues and state of the art for system integration in the packaging process are introduced, especially, focusing on ease transition to next generation packaging technologies like through silicon via (TSV), 3D wafer-level fan-out (WLFO), and chip-on-chip interconnection. In addition, effective solutions like fine pitch copper pillar and MEMS packaing of both advanced and legacy products are described with several examples.

• 한국자동차공학회논문집
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• 제16권2호
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• pp.58-65
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• 2008

The finite element programs have been developed for structure, collision, flow, dynamics, heat transfer, acoustics, electromagnetism, MEMS (Micro Electro Mechanical Systems), and etc. These programs can be classified as either "package" program or "single purpose" program. Single purpose programs usually have convenient and powerful functions, but these programs have limited expandability to different fields of analysis. Therefore, the method to converter the analysis results of single purpose program to other programs is needed. In the research, multi-body data conversion methods of 1) finite element model and 2) solid model were created to convert fluid analysis result of CFD-ACE+ to ANSYS data structure. Automatic boundary condition algorithms were developed for blade, and finite element model was compared with solid model. It is expected that, by sealess data transfer, the Multi-body Data Conversion Program could reduce the development period of torque converters.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.129-132
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}\;pa{\cdot}m^3/cm^2$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1957-1962
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• 2008

As a field of MEMS, micro-heater fabricated by Au is being introduced and developed in recent years. Previous studies about thermal properties of various forms of micro-heater were not sufficient. In this work, numerical and experimental analysis of the heat generation and the temperature distribution of micro-heater packages for 8 different geometric cases were studied. We fabricated a micro-heater package with silicon wafer, on which Cr/Au layer was laminated before 8 geometric forms of micro-heater were patterned. In each cases, temperature distribution was measured with IR thermal camera. According to the experimental results, which show a good agreement with the results analyzed by CFD, it was found that at 0.5W, the temperature of micro-heater chip which contained $20000{\mu}m$-long, serpentine shaped micro-heater was elevated to a relatively high temperature of $78^{\circ}C$ Consequently, we proposed a geometry of micro-heater which has effective thermal characteristics.

• 한국전기전자재료학회논문지
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• 제17권5호
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• pp.515-520
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• 2004

We report on the development of a Piezoelectric valvc that is designed to have a high reliability for fluid control systems, such as mass flow control, transportation and chemical analysis. The valve was fabricated using a MCA(multilayer ceramic actuator), which has a low consumption power, high resolution and accurate control. The fabricated valve is composed of MCA, a valve actuator die and an seat die. The design of the actuator dic was done by FEM(finite element method) modeling, respectively. And, the valve seat die with 6 trenches was made. and the actuator die, which possible to optimize control to MCA, was fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the scat/actuator die structure. PDMS(poly dimethylsiloxane) sealing pad was fabricated to minimize a leak-rate. It was also bonded to scat die and stainless steel package. The flow rate was 9.13 sccm at a supplied voltage of 100 V with a 50 % duty ratio and non-linearity was 2.24 % FS. From these results, the fabricated MCA valve is suitable for a variety of flow control equipments, a medical bio-system, semiconductor fabrication process, automobile and air transportation industry with low cost, batch recess and mass production.