• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.481-482
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• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.551-552
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• 2006

The miniature fuel cells have emerged as a promising power source for applications such as cellular phones, small digital devices, and autonomous sensors to embedded monitors or to micro-electro mechanical system (MEMS) devices. Several chemicals run candidate at a fuel in those systems, such as hydrogen. methanol, ethanol, acetic acid, and di-methyl ether (DME). Among them, hydrogen shows most efficient fuel performance. However, there are some difficulties in practical application for portable power sources. Therefore, more recently, there have been many efforts for development of micro-reformer to operate highly efficient micro fuel cells with liquid fuels such as methanol, ethanol, and DME In our experiments, we have integrated a micro-fuel processor system using low temperature co-fired ceramics (LTCC) materials. Our integrated micro-fuel processor system is containing embedded heaters, cavities, and 3D structures of micro- channels within LTCC layers for embedding catalysts (cf. Figs. 1 and 2). In the micro-channels of LTCC, we have loaded $CuO/ZnO/Al_2O_3$ catalysts using several different coating methods such as powder packing or spraying, dipping, and washing of catalyst slurry.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1210-1215
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• 2010

The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.170-174
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• 2005

A numerical system to extract effective elastic properties of polycrystalline thin-films for MEMS devices is developed. In this system, the statistical model based on lattice system is used for modeling the microstructure evolution simulation and the key kinetics parameters of given micrograph, grain distributions and deposition process can be extracted by inverse method proposed in the system. In this work, effects of kinetics parameters on the extraction of effective elastic properties of polycrystalline thin-films are studied by using statistical method. Effects of the fraction of the potential site($f_p$) among the parameters for deposition process of microstructure on the extraction of effective elastic properties of polycrystalline thin-films are investigated. For this research, polysilicon is applied to this system as the polycrystalline thin-films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.809-812
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• 2002

This paper presents the structures for a CPW shunt RF switch using MEMS(Micro Electro Mechanical System). Recent development in MEMS technology has made the design and fabrication of micro-mechanical switches as new switching elements. The micro-mechanical switches have low insertion loss, negligible power consumption, and good isolation compared to semiconductor switches. The fabricated structure shows an insertion loss of 2dB at 20GHz When a bias voltages of 12V is apply.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.44 no.5
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• pp.455-462
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• 2016

Output Characteristics of the spaceborn image sensor such as infrared(IR) sensor are varied according to time elapses and sensor repetition on/off operation. As a result, the quality of IR sensor image is decreased. Therefore, spaceborne image sensor require a periodic calibration using a black body system by correcting a non-uniformity of the sensor. In this paper, we proposed a MEMS-based black body system that can implement the high temperature uniformity at various standard temperatures ranging from low to high temperature and easily estimate the representative surface temperature. In addition, it has advantages lightweight, low-power and high accuracy. The feasibility of the proposed MEMS-based black body system was verified through the thermal analysis.

• Journal of Welding and Joining
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• v.22 no.4
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• pp.24-28
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• 2004

마이크로 접합 공정은 미세 부품이나 박판의 접합에 사용되며, 이를 위해 다양한 공정이 개발되었다. 최근 MEMS(Micro Electro Mechanical System)활용 범위가 증가하고 있으며, MEMS에 사용되는 미세한 구조물의 접합이나 패키징에 접합 공정이 활용되고 있다. MEMS는 발전 단계이지만 전자 패키징(electronic packaging)은 성숙 단계인 반도체 산업에 사용되고 있다.(중략)

• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.259-270
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• 2010

MEMS(micro electro mechanical systems) is a technology for the manufacture hyperfine structure, as a micro-sensor and a driving device, by a variety of materials such as silicon and polymer. Many study for utilizing the MEMS applications have been performed in variety of fields, such as light devices, high frequency equipments, bio-technology, energy applications and other applications. Especially, the field of Bio-MEMS related with bio-technology is very attractive, because it have the potential technology for the miniaturization of the medical diagnosis system. Bio-MEMS, the compound word formed from the words 'Bio-technology' and 'MEMS', is hyperfine devices to analyze biological signals in vitro or in vivo. It is extending the range of its application area, by combination with nano-technology(NT), Information Technology(IT). The LOC(lab-on-a-chip) in Bio-MEMS, the comprehensive measurement system combined with Micro fluidic systems, bio-sensors and bio-materials, is the representative technology for the miniaturization of the medical diagnosis system. Therefore, many researchers around the world are performing research on this area. In this paper, the application, development and market trends of Bio-MEMS are investigated.

• Journal of the KSME
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• v.52 no.8
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• pp.46-50
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• 2012

BioMEMS(Micro Electro Mechanical System）기술은 MEMS 기술을 바이오 분야에 적용함으로써 극소량의 체액(피 타액 등)으로 각종 진단 검사를 신속하게 처리할 수 있어, 기존 중대형 의료기기의 소형화, 고기능화 및 저렴화가 가능하게 하는 기술이다. 최근 유전자 정보가 규명되면서, 정보통신기술과 접목이 더욱 가속화되고 있고, 인간의 유전자 정보를 활용한 새로운 의약품 개발과 유전자 진단기기나 의료 시술이 눈부시게 발달하고 있다. 이 글에서는 바이오칩에서 큰 주목을 받고 있는 분야인 랩 온 어 칩, 특히 감염질환인 인플루엔자 등의 진단을 위한 연구 동향을 살펴본다.

• Smart Structures and Systems
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• v.12 no.6
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• pp.679-694
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• 2013

In this paper the application of the Interpolation Damage Detection Method to the numerical model of a suspension bridge instrumented with a network of Micro-Electro-Mechanical System sensors is presented. The method, which, in its present formulation, belongs to Level II damage identification method, can identify the presence and the location of damage from responses recorded on the structure before and after a seismic damaging event. The application of the method does not require knowledge of the modal properties of the structure nor a numerical model of it. Emphasis is placed herein on the influence of recorded signals noise on the reliability of the results given by the Interpolation Damage Detection Method. The response of a suspension bridge to seismic excitation is computed from a numerical model and artificially corrupted with random noise characteristic of two families of Micro-Electro-Mechanical System accelerometers. The reliability of the results is checked for different damage scenarios.