• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Transactions of the Korean hydrogen and new energy society
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• v.14 no.1
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• pp.35-45
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• 2003

Polymer electrolyte fuel cells(PEFC) have been considered to be a suitable candidate for residential, portable and mobile applications, due to their high efficiency and power density, even at low operating temperature. KIER developed a 5kW class PEFC system for residential application and operated the system for over 1,000 hours. To develop a 5kW PEFC system, performance of a cell was improved through successive tests of single cell of small and large area. Fabrication of three 2,5 kW class stacks, design and fabrication of natural gas reformer, design of auxiliary equipments such as DC/DC converter, DC/AC inverter and humidifying units were carried out along with integration of components, operation and evaluation of total system. During the development period from 1999 to 2001, MEA(membrane electrode assembly) fabrication technologies, design and fabrication technologies for separators, stacking technologies and so on were developed, thereby providing basis for developing stacks of higher efficiency and power density in the future. Experience of development of natural gas reformer opened possibilities to use various kinds of fuels. Main results obtained from the development of a 5kW class PEFC system for residential application are summarized.

• Korean Journal of Optics and Photonics
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• v.31 no.2
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• pp.96-104
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• 2020

A catadioptric omnidirectional zoom optical system using a hybrid lens (COZOSH) that performs simultaneously two functions of a lens and a mirror was designed at the visible wavelength range for daytime unmanned surveillance, and its performance was analyzed. The hybrid lens has lots of advantages in terms of fabrication and assembly of a COZOSH, because of the obviation of a lens boring process and reduction of the number of optical components. Additionally, we designed the COZOSH to expand the compressed inner-image region of a donut image at low spatial frequencies. As a result, the optimized design performance of the optical system that satisfies all initial design specifications was obtained from calculation of the modulation transfer function, spot diagram, and tolerance analysis. We confirmed that the COZOSH is a passively athermalized optical system under conditions of temperature variation from -30℃ to 50℃, by using athermalization analysis during zooming.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.11A
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• pp.1053-1058
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• 2006

In this paper, We proposed a efficient OSA(Optical Sub-Assembly) packaging method in use 1.31/1.49um bi-directional hybrid-integrated PLC chip for low-cost OSA in optical access network system applications as GE-PON in FTTH. Fabricated OSA with passive optical fiber alignment and nonhermetic plastic package method and measured optical coupling efficiency and electric-optical characteristics. Its performance is feasible to satisfy the GE-PON ONU specifications with the results as less than 0.5dB coupling losses within 40um alignment of z-axis and less than -24dBm sensitivity. It also has good temperature characteristics to sustain optical output power more than 1.5mW and 10dB extinction ratio, less than 0.3dB tracking error.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.16 no.2
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• pp.233-242
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• 2018

To overcome the low mechanical strength and corrosion behavior of a carbon steel canister at high temperature condition of a deep borehole, SiC ceramics were studied as an alternative material for the disposal canister. In this paper, a design concept for a SiC canister, along with an outer stainless steel container, was proposed, and its manufacturing feasibility was tested by fabricating several 1/3 scale canisters. The proposed canister can contain one PWR assembly. The outer container was also prepared for the string formation of SiC canisters. Thermal conductivity was measured for the SiC canister. The canister had a good thermal conductivity of above $70W{\cdot}m^{-1}{\cdot}K^{-1}$ at $100^{\circ}C$. The structural stability was checked under KURT environment, and it was found that the SiC ceramics did not exhibit any change for the 3 year corrosion test at $70^{\circ}C$. Therefore, it was concluded that SiC ceramics could be a good alternative to carbon steel in application to deep borehole disposal canisters.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.261-267
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• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• Journal of the Korean Society of Marine Environment & Safety
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• v.25 no.7
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• pp.906-913
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• 2019

To evaluate the removal performance of PO₄-P and NH₃-N, laboratory experiments were conducted by filling a container with oyster shells, pyrolyzed at 100℃ (POS100), 600℃ (POS600) and 800℃ (POS800), and passing artificial wastewaters through the container. The pH in the ef luent was found to increase due to CaO eluted from oyster shell. Removal amounts of PO₄-P of ~23.1 mg/kg, 16.1 mg/kg, and 15.9 mg/kg were obtained when POS100, POS600, and POS800, respectively, were used; therefore, the highest PO₄-P removal amount was obtained when POS100 was used. It is considered that Ca and dolomite in the oyster shells adsorbed and precipitated PO₄-P. Removal amounts of NH₃-N were of ~3.56 mg/kg, 5.72 mg/kg, and 3.97 mg/kg were obtained when POS100, POS600, and POS800, respectively, were used The low removal rate for NH₃-N is probably due to unstable nitrification, use of sealed containers, and the effect of NH₃-N being converted to NH₄⁺ upon increasing pH. Based on these results, pyrolyzed oyster shell is expected to promote changes in PO₄-P and NH₃-N concentrations through chemical reactions. These results can also be used for basic research in the development of wastewater treatment.