• Journal of Welding and Joining
• /
• 제19권1호
• /
• pp.82-87
• /
• 2001

The creep-rupture and low cycle fatigue properties of transient liquid phase bonded joints of Ni-base single crystal superalloy, CMSX-2 was investigated using MBF-80 insert metal. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. CMSX-2 was bonded at 1523K for 1.8ks in vacuum, optimum bonding condition. The creep rupture strength and rupture lives of the joints were the almost identical to ones of the base metal. SEM observation of the fracture surfaces of joints after creep rupture test revealed that the fracture surfaces classified three types of region, ductile fracture surface, cleavage fracture surface and interfacial fracture surface. The low cycle fatigue properties of the joints were also the same level as those of base metal. The elongation and reduction of area values of joints were comparable to those of base metal while fell down on creep rupture condition of high temperature.

• 마이크로전자및패키징학회지
• /
• 제19권3호
• /
• pp.15-20
• /
• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1996년도 하계학술대회 논문집 C
• /
• pp.1946-1949
• /
• 1996

We have performed silicon-to-silicon anodic bonding using glass layer deposited by electron beam evaporation. Wafers can be bonded at $135^{\circ}C$ with an applied voltage of $35V_{DC}$, which enables application of this technique to the vacuum packaging of microelectronic devices, because its bonding temperature and voltage are low. From the experimental results, we have found that the evaporated glass layer more than $1\;{\mu}$ m thick was suitable for anodic bonding. The role of sodium ions for anodic bonding was also investigated by theoretical bonding mechanism and experimental inspection.

• 한국재료학회지
• /
• 제17권7호
• /
• pp.361-365
• /
• 2007

A deoxidized low-phosphorous copper processed by eight cycles of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to $400^{\circ}C$. The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to $350^{\circ}C$, however above $400^{\circ}C$ they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. The hardness of the copper decreased slightly with the annealing temperature up to $350^{\circ}C$, however they dropped largely above $400^{\circ}C$. Annealing characteristics of the copper were compared with those of an oxygen free copper processed by ARB and subsequently annealed.

• 한국의류산업학회지
• /
• 제15권3호
• /
• pp.467-476
• /
• 2013

This study investigates the dyeability and the fastness of flame retardant polyester fabric developed by a thermal bonding with a low melting component of flame retardant bicomponent filament (LMFRPC). The fabrics were prepared with flame retardant polyester filaments (FRP) as warp and blended filaments of FRP and LMFRPC as weft. The LMFRPC have a sheath and a core where the core comprises a flame retardant polyester and the sheath comprises a thermoplastic polyester with a low-melting point. The thermal bonding of fabric was conducted in a pin tenter at $170^{\circ}C$ for 60 seconds. Fabric dyeing was conducted with an infrared dyeing machine at various dyeing temperatures and dyeing times. The dyestuffs used in this study were CI disperse Yellow 54, Red 60 and Blue 56 of E-type dyestuff and Orange 30, Red 167 and Blue 79 of S-type dyestuff. This study investigated the morphology of thermal bonded fabric, dyeability and fastness of dyed fabric. Dyeability increased with an increased dyeing temperature. The thermal bonded area increased with the increased LMFRPC content. The dyeability of S-type dyestuff was higher than E-type dyestuff; in addition, the saturated dyeing time was about 20minutes at $130^{\circ}C$ for E and S-type dyestuff. The fastness to washing and rubbing were excellent at a 4-5 Grade.

• 대한전자공학회논문지SD
• /
• 제48권8호
• /
• pp.1-4
• /
• 2011

SiOC 박막과 같은 유무기 하이브리드 저유전 물질에서의 열처리효과에 의한 전기적인 특성의 변화와 유전상수에 관하여 연구하였다. SiOC 박막은 분극에 따른 특성을 분석하기 위해서 TMS과 산소의 혼합가스를 이용한 CVD방법에 의하여 증착되었으며, 300~500도까지 변화하면서 열처리를 하였다. SiOC 박막은 열처리에 의하여 유전상수는 더욱 낮아지며, 400도에서 열처리 한 경우 전기적인 특성이 우수한 것을 확인하였다. XRD 패턴에 의하면 300도이하에서 열처리한 박막과 400도 이상에서 열처리 한 경우 결합구조가 달라지는 것을 알 수 있고 400도 근처에서 급격한 변화가 일어나고 있는 것을 확인하였다.

• 마이크로전자및패키징학회지
• /
• 제30권4호
• /
• pp.8-16
• /
• 2023

디바이스 소형화의 한계에 다다르면서, 이를 극복할 수 있는 방안으로 차세대 패키징 기술의 중요성이 부각되고 있다. 병목 현상을 해결하기 위해 2.5D 및 3D 인터커넥트 피치의 필요성이 커지고 있는데, 이는 신호 지연을 최소화 할 수 있도록 크기가 작고, 전력 소모가 적으며, 많은 I/O를 가져야 하는 등의 요구 사항을 충족해야 한다. 기존 솔더 범프의 경우 미세화 한계와 고온 공정에서 녹는 등의 신뢰성 문제가 있어, 하이브리드 본딩 기술이 대안책으로 주목받고 있으며 최근 Cu/SiO₂ 구조의 문제점을 개선하고자 SiCN에 대한 연구 또한 활발히 진행되고 있다. 해당 논문에서는 Cu/SiO₂ 구조 대비 Cu/SiCN이 가지는 이점을 전구체, 증착 온도 및 기판 온도, 증착 방식, 그리고 사용 가스 등 다양한 증착 조건에 따른 SiCN 필름의 특성 변화 관점에서 소개한다. 또한, SiCN-SiCN 본딩의 핵심 메커니즘인 Dangling bond와 OH 그룹의 작용, 그리고 플라즈마 표면 처리 효과에 대해 설명함으로써 SiO₂와의 차이점에 대해 기술한다. 이를 통해, 궁극적으로 Cu/SiCN 하이브리드 본딩 구조 적용 시 얻을 수 있는 이점에 대해 제시하고자 한다.

• Progress in Superconductivity
• /
• 제12권1호
• /
• pp.41-45
• /
• 2010

Low temperature micro-calorimeters have been employed in the field of high resolution alpha spectrometers. These alpha detectors typically consist of a superconducting or metal absorber and a temperature sensor. The temperature sensor can be a transition edge sensor (TES), a metallic magnetic calorimeter (MMC) or other low temperature detectors for an accurate measurement of temperature change due to an alpha particle absorption. We report a recent study of the heat flow between a replaceable absorber and a temperature sensor. A piece of gold foil in $2.4{\times}2.7{\times}0.03\;mm^3$ is used as an absorber. A $40\;{\mu}m$ diameter Au:Er paramagnetic sensor is attached to another small piece of gold foil in $400{\times}200{\times}30\;{\mu}m^3$ to serve as the temperature sensor. This sensor assembly, Au:Er and gold foil, is placed on a miniature SQUID susceptometer in a gradiometric configuration. The thermal connection between the absorber and the sensor was made with three gold bonding wires. The measured thermal conductance shows a linear dependence to the temperature. The values are in a good agreement with Wiedemann-Franz type thermal conductance of the gold wires.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2004년도 춘계학술대회 논문집
• /
• pp.139-142
• /
• 2004

Nickel base superalloys are widely used for high temperature applications due to heat resisting capability and corrosion resistance at high temperatures. Superalloys with many strengthening alloying elements are frequently used in powder form to alleviate harmful effects of alloy segregation. HIP (hot isostatic pressing) and DB (diffusion bonding) as a form of solid-state bonding process is used to make turbine components, such as integrated turbine rotors. HIP/DB process requires many technical overcomes related to dimensional changes as well as microstructural control. In this research, HIP/DB process for nickel base superalloys, Udimet 720 and MM 247, were investigated with a view to control the dimensional change during the consolidation process. Simple disc-shaped cans were used to select the conceptual die design for the control of the dimensional change especially in radial direction. The change in the shape of consolidated shape was investigated using commercial FE code with constitutive equations fur low temperature plasticity deformation.

• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
• /
• pp.205-206
• /
• 2006

A ball-shape alumina arc-tube for low-wattage lamp was developed by the PIM process. An ultra high purity translucentgrade alumina powder was used. In injection molding process, a hot-runner type mold was developed. The translucent-grade alumina powder was extremely sensitive to contamination so that the injection molding condition and atmosphere control in the furnace should be taken care of with extreme caution. Contamination sources were pinpointed with EPMA. The arc-tube was molded in half and two halves were bonded in the middle by a new bonding technique at room temperature developed in this study.