• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.163-166
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• 1997

Aluminium foam material is a highly porous material having complicated cellular structure defined by randomly distributed air pores in metallic matrix. this structure gives the aluminium a set of properties which cannot be achieved by any of conventional treatments. The properties of aluminium foam material significantly depend on its porosity, so that a desired profile of properties can be tailored by changing the foam density. Melting method is the one of foaming processes, which the production has long been considered difficult to realize becaues of such problems as the low foamability of molten metal, the varying size of. cellular structures, solidification shrinkage and so on. These problems, however, have gradually been solved by researchers and some manufacturers are now producing foamed aluminum by their own methods. Most of all, the parameters of solving problem in electric furnace were stirring temperature, stirring velocity, foaming temper:iture, and so on. But it has not considered about those in induction heating, foaming velocity and foaming temperature in semi-solid state yet. Therefore, this paper presents the effects on these parameter to control cell size, quantity and distribution.

• Current Photovoltaic Research
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• v.1 no.2
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• pp.97-102
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• 2013

Aluminum-doped zinc oxide (AZO) thin films were prepared by dc magnetron sputtering at room temperature and the effect of heat treatment on the structural, electrical and optical properties of the films were examined. As the annealing temperature and time increased, the resistivity decreased and the transmittance improved. All AZO films had c-axis oriented (002) plane of ZnO, regardless of the annealing process employed. As the annealing temperature and time increased, the crystallinity of AZO thin films increased due to the formation of a new ZnO phase in which Al was substituted for Zn. However, at the high annealing temperature of $400^{\circ}C$, the resistivity of the films increased via separation of Zn and Al from ZnO phase due to their low melting points. X-ray diffraction, field emission scanning electron micrograph and Hall effect measurement confirmed the formation of uniformly distributed new grains of ZnO substituted with Al. The variation of Al contents in AZO films was shown to be the primary factor for the changes in resistivity and carrier concentration of the films.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.6
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• pp.83-88
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• 2011

Magnesium alloys have been focussed for the applications for lightweight of vehicle and electronics due to their high strength, low specific density and good damping capacity. This paper deals with the creep strength of Mg-Nd-Zr-Zn alloy. For the alloy, pure magnesium(99.9%) was melt with atmosphere of $0.3%SF_6$ and $25%CO_2$. After melting, 0.3% of zinc was inserted to stir for 10min at elevated temperature of $770^{\circ}C$. Master alloys of Mg-15%Nd and Mg-15%Zr were stirred in furnace. The creep tests were performed to obtain creep rate and rupture in the temperature range of 200 to $220^{\circ}C$ and 280 to $310^{\circ}C$ at an applied stress of 156 to 172MPa and 78 to 94MPa, respectively. The deformation mechanism was predicted dislocation climb from measured apparent activation energy and stress exponent. Also the increaser the temperature and stress the lower the stress exponent and activation energy. Finally, LMP parameter gives good information for the predicted creep rupture life.

• Journal of the Korean Society of Safety
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• v.11 no.1
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• pp.53-59
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• 1996

To protect the damages or the disasters caused by overheating of industrial electric equipments or electric home appliances, a temperature sensitive thermal fuse is generally used in those equipments. Thermal fuses cutoff the current flow when the temperature of the electric equipments are abnormally overheated and over the certain temperature. Therefore thermal fuse is one of the most important elements in the sense of safety. Thermal fuses are classified into two types according to thermally sensitive materials, a low temperature melting alloy and an organic chemical compound. Domestic products of thermal fuses are now only with an organic chemical compound. Domestic products tested by using cutoff test and aging test etc. are satisfied UL specification. It's shown that the accuracy and the precision of the domestic products are as good as those of the overseas products obtained UL mark. However, some of domestic products show the reclosing problem which is mainly related the safety. This problem should be solved to make the reliable thermal fuses. In this paper, our Interest is to find out the causes of reclosing. In the comparison between thermally sensitive materials occurred reclosing and those occurred no reclosing, the test effects show that the characteristics of emitting heat and absorbing heat are different.

• Journal of the Korean Ceramic Society
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• v.56 no.1
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• pp.91-97
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• 2019

The effect of different Ni-containing additives on the sintering behavior and electric conductivity of the proton conducting electrolyte $BaCe_{0.35}Zr_{0.5}Y_{0.15}O_{3-{\delta}}$ (BCZY5) was investigated. Ni-doped, NiO-added, and $BaY_2NiO_5$(BYN)-added (all 4 mol%) BCZY5 samples were prepared by the solid state synthesis method and sintered at $1400^{\circ}C$ for 6 h. Among the three samples, the onset of densification was observed at the lowest temperature for NiO-added BCZY5, which is attributed to the formation of an intermediate phase at a low melting temperature. The BYN-added sample, where no consumption of the constitutional elements of the electrolyte was expected during sintering, exhibited the highest electrical conductivity whereas the doped sample had the lowest conductivity. The electrical conductivities at $500^{\circ}C$ under humid argon atmosphere were measured to be 2.0, 4.8, and $6.2mS{\cdot}cm^{-1}$ for Ni-doped and NiO- and BYN-added samples, respectively.

• Journal of Powder Materials
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• v.27 no.2
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• pp.139-145
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• 2020

The powder manufacturing process using the gas atomizer process is easy for mass production, has a fine powder particle size, and has excellent mechanical properties compared to the existing casting process, so it can be applied to various industries such as automobiles, electronic devices, aviation, and 3D printers. In this study, a modified A4032-xSn (x = 0, 1, 3, 5, and 10 wt.%) alloy with low melting point properties is investigated. After maintaining an argon (Ar) gas atmosphere, the main crucible is tilted; containing molten metal at 1,000℃ by melting the master alloy at a high frequency, and Ar gas is sprayed at 10 bar gas pressure after the molten metal inflow to the tundish crucible, which is maintained at 800℃. The manufactured powder is measured using a particle size analyzer, and FESEM is used to observe the shape and surface of the alloy powder. DSC is performed to investigate the change in shape, according to the melting point and temperature change. The microstructure of added tin (Sn) was observed by heat treatment at 575℃ for 10 min. As the content of Sn increased, the volume fraction increased to 1.1, 3.1, 6.4, and 10.9%.

• Korean Journal of Materials Research
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• v.32 no.3
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• pp.132-138
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• 2022

Zintl phase Mg₃Sb₂ is a promising thermoelectric material in medium to high temperature range due to its low band gap energy and characteristic electron-crystal phonon-glass behavior. P-type Mg₃Sb₂ has conventionally exhibited lower thermoelectric properties compared to its n-type counterparts, which have poor electrical conductivity. To address these problems, a small amount of Sn doping was considered in this alloy system. P-type Mg₃Sb₂ was synthesized by controlled melting, pulverizing, and subsequent vacuum hot pressing (VHP) method. X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to investigate phases and microstructure development during the process. Single phase Mg₃Sb₂ was successfully formed when 16 at.% of Mg was excessively added to the system. Nominal compositions of Mg_3.8Sb_2-xSn_x (0 ≤ x ≤ 0.008) were considered in this study. Thermoelectric properties were evaluated in terms of Seebeck coefficient, electrical conductivity, and thermal conductivity. A peak ZT value ≈ 0.32 was found for the specimen Mg_3.8Sb_1.994Sn_0.006 at 873 K, showing an improved ZT value compared to intrinsic one. Transport properties were also evaluated and discussed.

• Composites Research
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• v.31 no.2
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• pp.63-68
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• 2018

Thermoplastic composite has been limitedly used in high performance aerospace industry due to relatively low mechanical properties even though it has various advantages. But, thermoplastic aromatic polymer composite has recently been researched and utilized much. In this study, PEEK and PPS neat resin film as representative thermoplastic aromatic polymer were processed through continuous heating, cooling and reheating cycle. Property change such as glass transition temperature and melting temperature were identified and crystallinity variation by different cooling rate were evaluated. In the first (heating) run, polymer specimens were kept for 5 minutes at higher temperature than melting point to remove previous thermal history, and crystallization reaction was controlled by adjusting cooling rate to 2, 5, 10, 20 and $40^{\circ}C/minute$ in the second (cooling) run. In the third (heating) run, specimen crystallinity were verified by measuring the melting enthalpy. The initial specimens containing high portion of amorphous structure exhibited cold crystallization and clear glass transition in the first run whereas they did not show in the third run due to the increase of crystalline structure portion. As cooling rate decreases through the second cooling run, the crystallinity of the specimen increased. PEEK polymer had 21.9~39.3% crystallinity depending on cooling rate change whereas PPS polymer showed 29.1~31.2%.

• Journal of the Korean Society of Food Science and Nutrition
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• v.33 no.7
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• pp.1218-1223
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• 2004

This study was conducted to investigate supression functions of retrogradation in Korean rice cake by various surfactants. Samples were manufactured by multifunctional extruder and wrapped with polyethylene wrap at 2$0^{\circ}C$ for four days of storage. In the thermal characteristics studies on supression of retrogradation, the Korean rice cake with various surfactants had lower onset temperature compared to the control. The Korean rice cake with GLF (glycerin fatty acid ester) had the lowest onset temperature. In case of peak temperatures, they showed a similar tendency to the onset temperature. All the Korean rice cakes added with various surfactants had low melting enthalpy values compared to the control. In addition the Korean rice cake with GLF added had the lowest melting enthalpy. Melting spreadabilities of the Korean rice cake added with GLF, SUF, SOF and PST were higher values than that of the control. The n value of Avrami exponent was 0.90 in case of the Korean rice cake added with GLF and its retrogradation was slowly progressed compared to the other samples. The Korean rice cake with GLF had the lowest rate constants of retrogradation. The recrystallinity of the Korean rice cake with GLF was relatively lower than that of the control. The rate constant of retrogradation showed the lowest value in case of GLF. All the Korean rice cakes added with surfactants were in good compared to the control in sensory characteristics. GLF exhibited the best effect in sensory characteristics during storage. In conclusion surfactant showed suppression effect of retrogradation in Korean rice cake, and GLF was best effective.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.