• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.51-57
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• 2008

In this paper, wetting and interfacial reaction properties for low Ag containing Sn-Ag-Cu Pb-free solder alloy, i.e., Sn-0.3Ag-0.7Cu were investigated and compared with those of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu. Melting behavior and stress-strain curves of some Sn-xAg-xCu alloys were also measured using a differential scanning calorimeter(DSC) and a tensile test machine, respectively. In order to enhance insufficient wetting properties of Sn-0.3Ag-0.7Cu alloy, the improvement of wetting properties were analyzed by applying fluxes containing higher content of halide or indium adding of 0.2wt.% into the solder alloy. It was concluded that the small addition of indium is more effective for the improvement of wettability in low temperature range of $230{\sim}240^{\circ}C$ than applying flux containing higher content of halide.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.23-28
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• 2009

We investigated the wafer-level MEMS capping process for which cavity formation in Si wafer was not required. Ni caps were formed by electrodeposition on 4" Si wafer and Ni rims of the Ni caps were bonded to the Cu rims of bottom Si wafer by using epoxy. Then, top Si wafer was debonded from the Ni cap structures by using SnBi layer of low melting temperature. As-evaporated SnBi layer was composed of double layers of Bi and Sn due to the large difference in vapor pressures of Bi and Sn. With keeping the as-evaporated SnBi layer at $150^{\circ}C$ for more than 15 sec, SnBi alloy composed of eutectic phase and Bi-rich $\beta$ phase was formed by interdiffusion of Sn and Bi. Debonding between top Si wafer and Ni cap structures was accomplished by melting of the SnBi layer at $150^{\circ}C$.

• Transactions of the Korean hydrogen and new energy society
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• v.24 no.5
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• pp.367-372
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• 2013

Hydrogen storage as a metal hydride is the most promising alternative because of its relatively large hydrogen storage capacities near room temperature. TiMn2-based C14 Laves phases alloys are one of the promising hydrogen storage materials with easy activation, good hydriding-dehydriding kinetics, high hydrogen storage capacity and relatively low cost. In this work, multi-component, hyper-stoichiometric $Ti_{0.85}Zr_{0.13}(Fe_x-V)_{0.56}Mn_{1.47}Ni_{0.05}$ C14 Laves phase alloys were prepared by a vacuum induction melting for a hydrogen storage tank. Since pure vanadium (V) is quite expensive, the substitution of the V element in these alloys has been tried and some interesting results were achieved by replacing V by commercial ferrovanadium (FeV) raw material. In addition, the melt-spinning process, which was applied to the manufacturing of some of these alloys, could make the plateau slopes much flatter, which resulted in the increase of reversible hydrogen storage capacity. The improvement of sloping properties of melt-spun $Ti_{0.85}Zr_{0.13}(Fe_x-V)_{0.56}Mn_{1.47}Ni_{0.05}$ alloys was mainly attributed to the homogeneity of chemical composition.

• Transactions of Materials Processing
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• v.19 no.5
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• pp.311-319
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• 2010

Rare earth metal Ce has a relatively low melting point and high specific gravity. Because of its significantly high affinity to oxygen, nitrogen and sulfur, it is highly usable as a steel refining agent. However, because Ce compound has relatively high specific gravity, it is difficult to be separated from molten steel through floatation, and it degrades the purity of molten steel, or may clog the nozzle in continuous casting. Such problem may be solved by using an appropriate deoxidation agent together with Ce and settling molten steel sufficiently after refining. Thus a fundamental study in the formation behavior of non-metallic inclusion in Ce added Hyper Duplex STS melts was investigated. The addition amount of Ce, melt temperature were considered as experimental variables. A main non-metallic inclusion in mother alloy is 51(wt%MnO) - 27.6(wt%SiO$_2$)- 10.9(wt%$Cr_2O_3$). Non-metallic inclusion was dramatically decreased and the particle size was fined as the amount of Ce increased. Moreover (%MnO) and (%SiO$_2$) of non-metallic inclusion were decreased. But (%$Al_2O_3$)were relatively increased. The number of non-metallic inclusion were decreased and the large particle size were increased by increasing the temperature of molten steel.

• Nuclear Engineering and Technology
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• v.54 no.7
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• pp.2376-2385
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• 2022

Two groups of oxide dispersion-strengthened reduced-activation ferritic/martensitic steels (A and B) were prepared by adding Y, Ti, and Zr into steels through vacuum induction melting to investigate the inclusions, microstructures, mechanical properties of the alloys. Results showed that particles with Y, Ti, and Zr easily formed. Massive, Zr-rich inclusions were found in B steel. Density of micron inclusions in A steel was 1.42 × 10¹⁴ m^-3, and density of nanoparticles was 3.61 × 10¹⁶ m^-3. More and finer MX carbides were found in steel tempered at 650 ℃, and yield strengths (YS) of A and B steel were 714±2 and 664±3.5 MPa. Thermomechanical processing (TMP) retained many dislocations, which improved the mechanical properties. YSs of A and B treated by TMP were 725±3 and 683±4 MPa. The existence of massive Zr-rich inclusions in B steels interrupted the continuity of the matrix and produced microcracks (fracture), which caused a reduction in mechanical properties. The presence of fine prior austenite grain size and inclusions was attributed to the low DBTTs of the A steels; DBTTs of A650 and A700 alloy were -79 and -65 ℃. Tempering temperature reduction and TMP are simple, readily useable methods that can lead to a superior balance of strength and impact toughness in industry applications.

• Journal of the Korean Magnetics Society
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• v.3 no.3
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• pp.201-207
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• 1993

Starting ingot of $Pr_{15}Fe_{77}B_{8}$ were prepared by vacuum induction melting under argon atmosphere. The ingot were induction melted in a quartz crucible and then ejected as a molten alloy throuth a 0.6 mrn orifice onto a rotating cop¬per wheel. An anisotropic magnet was prepared from ribbon by hot deformation techniques. A fully dense precursor magnet first made by pressing ribbons at $680^{\circ}C$ under a pressure of $21.8\;kg/mm^{2}$. A substantially oriented magnets were obtained by die-upset under various conditions. As the compression ratio increases, the $B_{r}$ value increases pronouncedly though $_{i}H_{c}$ decreases. Also, XRD analyses show increased diffraction peak from (006). From these results, it can be known that the magnetic easy axis was formed along the compression axis. As the die-upset speed increases, $_{i}H_{c}$ increases though $B_{r}$ decreases. The $B_{r}$ increases up to $750^{\circ}C$ of die-upset temperature and above this temperature decreases. The value of $4{\pi}M_{s}$ of the $Pr_{15}Fe_{77}B_{8}$ alloy prepared is found to be 11.8 KG. When the alloy was compressed by 0.8 under the die-upset speed of 0.05 m/sec at $750^{\circ}C$, $B_{r}$ was 11.0 KG indicating that the alloy has excellent magnetic anistropy. However, this alloy has some limitation because of low $_{i}H_{c}$.

• Korean Journal of Materials Research
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• v.27 no.7
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• pp.386-391
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• 2017

Using a customized diffusion bonder, we executed diffusion bonding for ring shaped white gold and red gold samples (inner, outer diameter, and thickness were 15.7, 18.7, and 3.0 mm, respectively) at a temperature of $780^{\circ}C$ and applied pressure of 2300 N in a vacuum of $5{\times}10^{-2}$ torr for 180 seconds. Optical microscopy, field emission scanning electron microscopy (FE-SEM), and energy-dispersive X-ray spectroscopy (EDS) were used to investigate the microstructure and compositional changes. The mechanical properties were confirmed by Vickers hardness and shear strength tests. Optical microscopy and FE-SEM confirmed the uniform bonding interface, which was without defects such as micro pores. EDS mapping analysis confirmed that each gold alloy was 14K with the intended composition; Ni and Cu was included as coloring metals in the white and red gold alloys, respectively. The effective diffusion coefficient was estimated based on EDS line scanning. Individual values of Ni and Cu were $5.0{\times}10^{-8}cm^2/s$ and $8.9{\times}10^{-8}cm^2/s$, respectively. These values were as large as those of the melting points due to the accelerated diffusion in this customized diffusion bonder. Vickers hardness results showed that the hardness values of white gold and red gold were 127.83 and 103.04, respectively, due to solid solution strengthening. In addition, the value at the interface indicated no formation of intermetallic compound around the bonding interface. From the shear strength test, the sample was found not to be destroyed at up to 100,000 gf due to the high bonding strength. Therefore, these results confirm the successful diffusion bonding of 14K white-red golds with a diffusion bonder at a low temperature of $780^{\circ}C$ and a short processing time of 180 seconds.

• Journal of Korea Foundry Society
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• v.17 no.6
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• pp.592-597
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• 1997

The microstructure and tensile properties of Mg-Zn-Ca and Mg-Zn-Mn-Ca alloys have been investigated. The alloys were obtained by melting in a low carbon crucible coated with boron nitride under an Ar gas atmosphere to prevent oxidation and combustion. The Mg alloy melt was cast into the metallic mold at room temperature, and cooling part was located at the bottom of mold. The phase formed during solidification of the Mg-Zn-(Mn) alloys containing 0.5%Ca is $Ca_2Mg_6Zn_3$. The yield strength and ultimate tensile strength of the alloys increased with increasing Zn content, but the ductility did not change with increasing Zn content. The addition of Mn improves the yield strength and ultimate tensile strength of the alloys, but the ductility did not change. Tensile fracture of the alloys revealed brittle failure, with cracking along the $Ca_2Mg_6Zn_3$ phase. The variation of stress with strain obeyed the relationship of the ${\sigma}=K{\varepsilon}^n$.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.1-8
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• 2015

Aluminium and its alloys are widely used in brazing various components in automotive industries due to their properties like lightweight, excellent ductility, malleability and formability, high oxidation and corrosion resistance, and high electrical and thermal conductivity. However, high machinability and strength of aluminium alloys are a serious concern during casting operations. The generation of porosity caused by dissolved gases and modifiers affects seriously the strength and quality of cast product. Brazing of Al and its alloys requires careful monitoring of temperature since theses alloys are brazed at around the melting temperature in most of the aluminium alloys. Therefore, the development of low temperature brazing filler alloys as well as superior strength Al alloys for various engineering applications is always in demand. In various heat exchangers and automotive applications, poor strength of Al alloys is due to the inherent porosities and casting defects. The unstable mechanical properties is therefore needed to be controlled by adding various additive elements in the aluminium and its alloys, by a change in the heat treatment procedure or by modifying the microstructure. In this regard, this article reports the effect of various elements added in aluminium alloys to improve microstructure, brazeability, machinability, castability as well as to stabilize the mechanical properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.2
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• pp.119-125
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• 2017

We have studied the effects of Ag on the characteristics of $Sn_{43}Bi_{57}Ag_x$(wt%) lead-free solders for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag3Sn after reacting with some part of Sn atoms, while they did not react with Bi atoms, but decreased the mean size of Bi solid phase and the thickness of solder. When Ag atoms of 3.0 wt% was added to eutectic $Sn_{43}Bi_{57}$(wt%) solder, it showed the optimally useful results that the peel strength of photovoltaic ribbon greatly increased and the sheet resistance of the solder decreased. In the meanwhile, the eutectic $Sn_{43}Bi_{57}$(wt%) solder showed a low melting temperature of $138.9^{\circ}C$, and showed a very similar result regardless of the added amount of Ag atoms.