• Title/Summary/Keyword: Local Package

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Design of the Network Streaming Service based on Linux (Linux 상에서의 Network Streaming Service 설계)

  • 김영만;박홍재;허성진;최완
    • Proceedings of the Korean Information Science Society Conference
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    • 2004.10c
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    • pp.370-372
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    • 2004
  • 본 논문에서는 개방형 운영체제인 리눅스상에서 package streaming service를 제공하는 Network Streaming Service(통칭 NSS)를 설계하는 문제를 다룬다. NSS는 client가 serve 측에 설치된 소프트웨어 package를 마치 client 자신의 local disk상에 이미 인스톨된 패키지를 실행하는 것처럼 동작하도록 해준다. NSS는 client측의 NSS Mounter, Package Streaming Consumer, NSS Configurator와 server측의 NSS Load Balancer, Package Streaming Supplier, NSS Manager, Accounting & Security Manager로 구성되며 local disk caching과 background prefetching 기능을 사용하여 향상된 서비스를 제공한다.

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Development of Jeju Local Food Tour Package and Economic Value Estimation based on Contingent Valuation Method (제주 향토음식을 활용한 음식관광상품 개발 및 CVM을 적용한 경제적 가치 평가)

  • Ahn, So-jung;Yoon, Ji-young
    • Journal of the East Asian Society of Dietary Life
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    • v.26 no.4
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    • pp.346-358
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    • 2016
  • Local food reflects the identity and image of a specific region. It is also a core element for determining tourists' experience of a region. The purpose of the present study was to develop a Jeju food tour package using local foods and estimate the economic value of the suggested tour package using Contingent Valuation Method (CVM). Five food tour packages were developed by researchers. In order to modify and measure the value of each package, an expert panel survey was conducted, and 'package 5' was selected as a food tour scenario for the tourist survey. A survey was conducted on 295 domestic tourists who visited Jeju within the past 10 years in order to evaluate the economic value and feasibility of the Jeju food tour package. A total fo 72.9% of respondents answered that they were willing to pay for the Jeju local food tour, and the willingness to pay (WTP) range was between ₩45,000 and ₩105,000. The primary factors correlated with WTP was food expenses, followed by leisure experience expenses, interest in local foods, education level, visit frequency and age. The WTP of the Jeju local food tour was calculated with the significantly affected factors using stepwise regression model. The result of the present study reveal that tourists' WTP increased with higher food expenses, education level, and age group. The average value of food expenses, education level, and age were substituted into the formula derived from the regression analysis, yielding 58,385.752 KRW as the WTP. The expected economic value created by exploiting the Jeju local food tour was shown to be 700 billion KRW per year, calculated by multiplying WTP of the food tour packages by the number of tourists. This study examined the feasibility and plan of the food tour package to increase the economic value of Jeju local food. In the case of the culinary tour program based on Jeju local food launching, the estimated economic effect was great. Therefore, in-depth research to merchandise the Jeju local food tour program is needed.

Local Buckling Analysis of the Punch in stamping Die and Its Design Modification (타발금형펀치의 국부 좌굴해석 및 설계변경)

  • Kim, Yong-Yun;Lee, Dong-Hun
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.3 s.96
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    • pp.25-29
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    • 1999
  • The lead frame manufactured by press stamping process, is an important part of semiconductor. The recent technical trend of semiconductor, chip sized and high performance package technology, requires the lead frame to be of more multi-leads and of fine ILP (Inner Lead Pitch). As the ILP is getting finer, its corresponding punch of the stamping die is getting narrower. The punch narrower than its stamping limit has been broken due to local buckling. This paper analyzed the phenomena of punch breakdown. Moreover, the punch design was modified to increase the critical limit of buckling force. This paper, also, suggested new design rules of the punch, which asks the modification of its lead frame design that has to be considered in the stage of semiconductor package design. The new design rules of lead frame design yields a good reliability of semiconductor package as well as a good quality of lead frame.

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Character Design Research for Local Brand Marketing -Focused on the package design for fastfood Bibimbob, 'Mix-bob' (지역브랜드 마케팅을 위한 캐릭터패키지 디자인 연구 -전주비빔밥 응용 패스트푸드 '믹스밥' 패키지 개발을 중심으로)

  • Joh, Yun-Sook
    • Cartoon and Animation Studies
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    • s.45
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    • pp.283-298
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    • 2016
  • Design is a fatal factor to differentiate and survive one product from the other in fierce competition of the market, when other conditions such as price or quality makes no much difference. Among many marketing tools, package design is known as a direct communication that visualizes and forms the very initial brand image of a product. Package design is not only for packing, transporting, storing and loading but for engraving the brand image in a consumers' mind and lead them to purchasing. One of recent package design trands is various ways of using character, not just as a printed image on the surface but as a part of three dimensional structure of package. If it succeed, the package design could give out the secondary fun and impact to the consumers. The package design with an effective character is itself a great marketing tool and valuable design asset, which can bring a further profit to the company. Especially, character-package can be a powerful and effective marketing method for various local products, in needs of further publication and sales with limited cost. It should motivate the sales of the products by grabbing their attention and taken as a souvenir. This research takes a character package as a useful marketing method for a local brand in Jeonju, South Korea, and tries to design a three dimensional package using its own character. Through the process, the research aims to propose an important design strategy for repositioning or enhancing an existing brand.

Secure and Efficient Package Management Techniques in Closed Networks (폐쇄망에서의 안전하고 효율적인 소프트웨어 패키지 관리 방안)

  • Ahn, Gun-Hee;An, Sang-Hyuk;Lim, Dong-Kyun;Jeong, Su-Hwan;Kim, Jaewoo;Shin, Youngjoo
    • KIPS Transactions on Computer and Communication Systems
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    • v.11 no.4
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    • pp.119-126
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    • 2022
  • In this paper, we present important factors and methodologies that we have to follow for secure and efficient package management systems in a closed network. By analyzing previous works, we present several security considerations for the existing package management systems. Based on the consideration, we propose guidelines regarding the use of package management systems in the closed network. More specifically, we propose the development of new package management tools, utilization of physical storage media, utilization of local backup repositories, package updates, and downgrade batches for secure and efficient package management.

Evaluation of Thermal Deformation Model for BGA Packages Using Moire Interferometry

  • Joo, Jinwon;Cho, Seungmin
    • Journal of Mechanical Science and Technology
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    • v.18 no.2
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    • pp.230-239
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    • 2004
  • A compact model approach of a network of spring elements for elastic loading is presented for the thermal deformation analysis of BGA package assembly. High-sensitivity moire interferometry is applied to evaluate and calibrated the model quantitatively. Two ball grid array (BGA) package assemblies are employed for moire experiments. For a package assembly with a small global bending, the spring model can predict the boundary conditions of the critical solder ball excellently well. For a package assembly with a large global bending, however, the relative displacements determined by spring model agree well with that by experiment after accounting for the rigid-body rotation. The shear strain results of the FEM with the input from the calibrated compact spring model agree reasonably well with the experimental data. The results imply that the combined approach of the compact spring model and the local FE analysis is an effective way to predict strains and stresses and to determine solder damage of the critical solder ball.

Non-linear Temperature Dependent Deformation Analysis of BGA Package Using Moire Interferometry (모아레 간섭계를 이용한 BGA 패키지의 비선형 열변형 해석)

  • Ju Jin Won;Han Bongtae
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.28-32
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    • 2003
  • Thermo-mechanical behavior of a ceramic ball grid array(CBGA) package assembly and wire bond ball grid array(WB-PBGA) package assemblies are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation(warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. The locations of the critical solder ball in WB-PBGA package assemblies are documented.

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Submicro-displacement Measuring System with Moire Interferometer and Application to the Themal Deformation of PBGA Package (무아레 간섭계 초정밀 변위 측정장치의 설계 및 PBGA 패키지 열변형 측정에의 응용)

  • Oh, Ki-Hwan;Joo, Jin-Won
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.11
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    • pp.1646-1655
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    • 2004
  • A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

What can local governments do to help people returning to rural areas? (귀농.귀촌 활성화를 위한 농촌 지방자치단체의 과제)

  • Kim, Jeong-Seop
    • Journal of Agricultural Extension & Community Development
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    • v.16 no.3
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    • pp.533-556
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    • 2009
  • Recently, the number of people who return to rural areas for farming is increasing rapidly. This attracted public attention so that the Ministry of Food, Agriculture, Forestry and Fisheries announced officially comprehensive countermeasures to help those returning to rural areas. But there is not sufficient consideration of the role of local governments in the above countermeasures. Policy package to help returning people establish themselves in rural area include many soft programs that requires governance, delicate implementation process and expertise to advise. Therefore, the local governments should have appropriate governance and perspectives.

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