• Journal of Korea Foundry Society
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• v.20 no.1
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• pp.3-12
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• 2000

The lead content of drinking water has been restricted to less than 15 ppb by Environmental Protection Agency (EPA) in USA. This has led to extensive research and development work at the Materials Technology Laboratory (MTL) of CANMET, a Canadian Government research laboratory, on the development of low-lead and lead-free copper alloys for plumbing applications. Attentionhas also been focused on the environmentally friendly and energy efficient permanent mold casting process to minimize the disposal of foundry sand contaminated by lead due to the use of leaded alloys in the non-ferrous foundries. A new series of alloys called SeBiLOY contaning Bi and Se been introduced to replace lead in the leaded alloys. This paper addresses some important casting characteristics such as fluidity, hot tear resistance, mechanical properties and microstructure of lead-free alloys such as SeBiLOY III and low-lead alloys such as silicon brass, silicon bronze and yellow brass in gravity permanent mold casting.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.1008-1011
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• 2005

It is necessary for the design of lead frame punches in blanking to consider buckling because inner lead pitch of lead frame has been narrowed by miniaturization and high accumulation of semiconductor. In addition, if process variables change in press stamping process, the lift of punches is no longer influenced in wear and punches can be broken suddenly. To prevent the fracture of fine pitch lead frame punches, having considered applying reinforcement to it, this paper verified the design with buckling analysis. This study presents the optimal position and number of reinforcement to be attached to punches. Finally this study presents design rules of attaching reinforcement.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.25-29
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• 1999

The lead frame manufactured by press stamping process, is an important part of semiconductor. The recent technical trend of semiconductor, chip sized and high performance package technology, requires the lead frame to be of more multi-leads and of fine ILP (Inner Lead Pitch). As the ILP is getting finer, its corresponding punch of the stamping die is getting narrower. The punch narrower than its stamping limit has been broken due to local buckling. This paper analyzed the phenomena of punch breakdown. Moreover, the punch design was modified to increase the critical limit of buckling force. This paper, also, suggested new design rules of the punch, which asks the modification of its lead frame design that has to be considered in the stage of semiconductor package design. The new design rules of lead frame design yields a good reliability of semiconductor package as well as a good quality of lead frame.

• Journal of Fisheries and Marine Sciences Education
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• v.10 no.1
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• pp.79-86
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• 1998

In this study, the adhesive effect, blistering behavior and electrochemical polarization behavior of red lead film by the pretreatment work of sandblasting and potassium chromate($K_2CrO_4$) were investigated to prevent the corrosion of gas storage tank under marine environment. The main results obtained are as follows : 1) The adhesive effect of red lead film by the pretreatment work of sandblasting and potassium chromate is more improved than that of red lead film. 2) The blistering occurrence of red lead film by the pretreatment work of sandblasting and potassium chromate is more delayed than that of red lead film. 3) As the anodic potential is increased, corrosion current density of red lead film by the pre treatment work of sandblasting and potassium chromate is lower drained than that of red lead film.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.44 no.4
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• pp.220-226
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• 2021

In supply chain, there are a variety of different uncertainties including demand, service time, lead time, and so forth. The uncertainty of demand has been commonly studied by researchers or practitioners in the field of supply chain. However, the uncertainty of upstream supply chain has also increased. A problem of uncertainty in the upstream supply chain is the fluctuation of the lead time. The stochastic lead time sometimes causes to happen so called the order crossover which is not the same sequences of the order placed and the order arrived. When the order crossover happens, ordinary inventory policies have difficult to find the optimal inventory solutions. In this research, we investigate the lead time distribution in case of the order crossover and explore the resolutions of the inventory solution with the order crossover.

• Elastomers and Composites
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• v.57 no.2
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• pp.48-54
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• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• Proceedings of the Optical Society of Korea Conference
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• 1990.02a
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• pp.69-72
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• 1990

For the effective heat transfering in Lser Diodes, Beam-Lead structure were introduced which is applicable to hybrid Optoelectronic Integrated Circuits. A 5-layer planar structure Laser Diode is fabricated and Beam-Lead is made by Au plating. And carrier was made by etching Si substrate and LD was mounted on a carrier. The thermal resistance was measured and we could certain that Beam-Lead structure behaves well as a heat sink.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.86-88
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• 2003

The characteristic of induction heating solder bump(solder ball: Sn-37Pb, Sn-3.5Ag, Sn-3.0Ag-0.5Cu) has analyzed in this paper. The initial condition of induction heating depends on the time and current. The shape of lead-free solder bump is better than lead solder. The shear strength of lead solder bump has decreased with aging time. The average of shear strength of solder bump is about 10N, 11N, and 11N respectively. The lead-free solder bump's shear strength is better than lead solder and varies irregularly with aging time.

• Toxicological Research
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• v.9 no.2
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• pp.207-215
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• 1993

Lead is an environmental toxicant that causes a marked deficit in cognative development in infants and children. Damage to the hippocampus has been linked to the lead-induced deficit in the learning process. The present study examined the effects of lead on the development of hippocampal neurons in vitro. Hippocampal neurons were incubated with various concentrations in lead acetate (1nM to 30 nM) for 72 hrs from 4 h after plating, and the percentage of living neurons bearing neurites, neurite outgrowth and migration of multipolar neurons in culture were determined.

• Bulletin of the Korean Chemical Society
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• v.7 no.1
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• pp.12-15
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• 1986

Lead tolerance of $Pt/Al_2O_3$ catalysts was evaluated for CO oxidation depending on the properties of the alumina supports and base metals added as promoter. Among the four different alumina supports, the support with a large macropore volume (0.45 cc/g) and 5% Ce has shown the best resistence to lead poisoning. Most of the base metals added to the Pt-catalysts were found to be ineffective for improving lead resistence, but boron has shown an excellent lead tolerence, although it decreases the initial catalytic activity.