• 제목/요약/키워드: Layered manufacturing process

검색결과 74건 처리시간 0.026초

Statistical Qualitative Analysis on Chemical Mechanical Polishing Process and Equipment Characterization

  • Hong, Sang-Jeen;Hwang, Jong-Ha;Seo, Dong-Sun
    • Transactions on Electrical and Electronic Materials
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    • 제12권3호
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    • pp.115-118
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    • 2011
  • Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

장신구 활용에 적합한 3D프린팅 방법론 비교 연구 (Comparative Study on the 3D Printing Methodology suitable for Jewelry)

  • 장진희;고승근
    • 한국융합학회논문지
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    • 제11권2호
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    • pp.225-230
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    • 2020
  • 3D프린팅의 활용은 매우 혁신적이면서 유용한 기술이다. 하지만 장신구 분야에서는 3D프린팅 기술은 제작방법의 한 분야로서 한정적 으로 사용되는 기술이다. 이러한 3D프린팅의 한계를 극복하기 위해 3D프린팅 출력방식 중 가장 대중적이며 조형활동에 적합한 출력방식을 선정하고 출력시간, 조건을 한정하여 장신구에 적용 가능성을 알아보기 위해 비주조과정과 주조과정 각각의 방법을 통해 시제품까지 완성하고 이를 비교해 보았다. 그 결과, FDM출력 방식은 비용과 시간적인 측명에서 매우 긍정적인 장점이 있지만 표면에 적층구조가 지워지지 않으며 출력과정시 발생되는 필라멘트의 잔여물로 인해 선 조형을 표면시 완성도가 떨어지는 단점이 있었다. DLP출력방식은 표면처리가 고르며 완성도가 높은 반면, 비용과 시간적인 측면에서 효율성이 떨어지는 단점이 있었다. 하지만 두 출력방법 모두 장신구 활용 가능하며 향후 디자인에 맞는 다양한 출력방법연구가 이루어져 장신구에 3D 작품연구가 활발히 수행되기를 바란다.

Statistical Qualitative Analysis on Chemical Mechanical Polishing Process and Equipment Characterization

  • Hong, Sang-Jeen;Hwang, Jong-Ha;Seo, Dong-Sun
    • Transactions on Electrical and Electronic Materials
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    • 제12권2호
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    • pp.56-59
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    • 2011
  • The characterization of the chemical mechanical polishing (CMP) process for undensified phophosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been used by experimenters to understand the relationship between the input variables and responses of interest in a simple and efficient way, and it typically is beneficial for determining the appropriatesize of experiments with multiple process variables and making statistical inferences for the responses of interest. The equipment controllable parameters used to operate the machine consist of the down force of the wafer carrier, pressure on the back side wafer, table and spindle speeds (SS), slurry flow (SF) rate, pad condition, etc. None of these are independent ofeach other and, thus, the interaction between the parameters also needs to be understoodfor improved process characterization in CMP. In this study, we selected the five controllable equipment parameters the most recommendedby process engineers, viz. the down force (DF), back pressure (BP), table speed (TS), SS, and SF, for the characterization of the CMP process with respect to the material removal rate and film uniformity in percentage terms. The polished material is undensified PSG which is widely used for the plananization of multi-layered metal interconnects. By statistical modeling and the analysis of the metrology data acquired from a series of $2^{5-1}$ fractional factorial designs with two center points, we showed that the DF, BP and TS have the greatest effect on both the removal rate and film uniformity, as expected. It is revealed that the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that process control based on a better understanding of the process is the key to success in current semiconductor manufacturing, in which the size of the wafer is approaching 300 mm and is scheduled to continuously increase up to 450 mm in or slightly after 2012.

Analysis of issues in gate recess etching in the InAlAs/InGaAs HEMT manufacturing process

  • Byoung-Gue Min;Jong-Min Lee;Hyung Sup Yoon;Woo-Jin Chang;Jong-Yul Park;Dong Min Kang;Sung-Jae Chang;Hyun-Wook Jung
    • ETRI Journal
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    • 제45권1호
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    • pp.171-179
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    • 2023
  • We have developed an InAlAs/InGaAs metamorphic high electron mobility transistor device fabrication process where the gate length can be tuned within the range of 0.13㎛-0.16㎛ to suit the intended application. The core processes are a two-step electron-beam lithography process using a three-layer resist and gate recess etching process using citric acid. An electron-beam lithography process was developed to fabricate a T-shaped gate electrode with a fine gate foot and a relatively large gate head. This was realized through the use of three-layered resist and two-step electron beam exposure and development. Citric acid-based gate recess etching is a wet etching, so it is very important to secure etching uniformity and process reproducibility. The device layout was designed by considering the electrochemical reaction involved in recess etching, and a reproducible gate recess etching process was developed by finding optimized etching conditions. Using the developed gate electrode process technology, we were able to successfully manufacture various monolithic microwave integrated circuits, including low noise amplifiers that can be used in the 28 GHz to 94 GHz frequency range.

시공표면평탄에 따른 3D 프린팅 적층형상 정량분석 (Quantitative Analysis of 3D Printing Layered Shape according to the Flatness of Construction Surface)

  • 박진수;김경택
    • 대한토목학회논문집
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    • 제42권2호
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    • pp.257-261
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    • 2022
  • 건축물의 디자인 자유도 향상, 작업자 안전 향상, 비교적 쉬운 납기예측 등의 이점으로 건설 산업에 적용된 3D 프린팅 기술(Additive manufacturing, AM)은 각종 효과성의 검증과 산업적용이 진행되고 있다. 다만, 기존기술대비 낮은 성숙도로 인해, 건축AM기술의 전주기에 발생하는 새로운 문제들을 해소하기 위한 연구들이 진행 중이다. 본 논문에서는 이러한 문제점 중에서도 현장 환경에 건축물을 적층 시공하는 과정에서, 낮은 시공표면평탄이 적층 제조 형상물에 미치는 영향을 확인한다. 특히 레이저 스캐닝을 통한 3차원 재구성 및 정량 분석을 통해, 낮은 평탄도로 인한 불균일한 적층형상물을 분석하고, 이를 해소하기 위한 적층시공전략을 제안한다.

FDM 3D 프린터 최적 공정 변수 선정을 위한 공정 윈도우 평가법 (Estimation of Process Window for the Determination of the Optimal Process Parameters in FDM Process)

  • 안일혁
    • 한국융합학회논문지
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    • 제9권8호
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    • pp.171-177
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    • 2018
  • 3D 프린팅 기술에 있어서, 각각의 기술들은 고품질의 출력물을 얻기 위해서는 최적화해야 할 다양한 인자들을 가지고 있다. FDM (fused deposition modeling) 방식의 3D 프린터 또한 최적화해야 할 다수의 인자들이 있다. 그 중에서도 노즐 온도와 노즐 이송 속도는 가장 기본이 되는 인자라고 할 수 있다. 안정적인 출력이 가능한 두 인자의 조합을 찾는 것은 FDM 장비를 이용한 출력에 있어서 가장 먼저 선행되어야 할 일이다. 본 연구에서는 다양한 두 인자 조합에 따라 단일 라인 출력을 수행하였고, 얻어진 출력 결과물을 평가를 통하여 안정적인 출력이 가능한 범위를 선정하는 새로운 방법을 제시하였다. 제시한 방법을 통하여 평가한 안정적 조건 범위들을 동일 범위 조건 아래에서 다층 단일 라인 출력을 통하여 검증하였다. 그 결과, 단일 라인과 다층 단일 라인 출력이 동일한 안정적 범위를 보이고 있음을 확인 할 수 있었다. 이는 본 논문에서 제안한 단일 라인 평가법을 다층 출력의 안정성을 그대로 반영할 수 있음을 보여 준다. 이상의 결과들로 볼 때, 제안한 방법은 간단한 실험과 측정 방법을 이용하여 손쉽게 수행 될 수 있다는 점과 공정 변수들의 최적화를 위한 기본 데이터를 제공한다는 점에서도 그 의미를 찾을 수 있었다.

다중금속복합층 핵연료 피복관의 필거링 공정에 관한 유한 요소 해석 연구 (Finite Element Analysis of Pilgering Process of Multi-Metallic Layer Composite Fuel Cladding)

  • 김태용;이정현;김지현
    • 한국압력기기공학회 논문집
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    • 제13권2호
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    • pp.75-83
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    • 2017
  • In severe accident conditions of light water reactors, the loss of coolant may cause problems in integrity of zirconium fuel cladding. Under the condition of the loss of coolant, the zirconium fuel cladding can be exposed to high temperature steam and reacted with them by producing of hydrogen, which is caused by the failure in oxidation resistance of zirconium cladding materials during the loss of coolant accident scenarios. In order to avoid these problems, we develop a multi-metallic layered composite (MMLC) fuel cladding which compromises between the neutronic advantages of zirconium-based alloys and the accident-tolerance of non-zirconium-based metallic materials. Cold pilgering process is a common tube manufacturing process, which is complex material forming operation in highly non-steady state, where the materials undergo a long series of deformation resulting in both diameter and thickness reduction. During the cold pilgering process, MMLC claddings need to reduce the outside diameter and wall thickness. However, multi-layers of the tube are expected to occur different deformation processes because each layer has different mechanical properties. To improve the utilization of the pilgering process, 3-dimensional computational analyses have been made using a finite element modeling technique. We also analyze the dimensional change, strain and stress distribution at MMLC tube by considering the behavior of rolls such as stroke rate and feed rate.

Rheology of PP/Clay Hybrid Produced by Supercritical $CO_2$ Assisted Extrusion

  • Lee, Sang-Myung;Shim, Dong-Cheol;Lee, Jae-Wook
    • Macromolecular Research
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    • 제16권1호
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    • pp.6-14
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    • 2008
  • Polypropylene (PP)-layered silicate nanocomposites were developed using a new processing method involving a supercritical carbon dioxide ($scCO_2$)-assisted co-rotating twin-screw extrusion process. The nanocomposites were prepared through two step extrusion processes. In the first step, the PP/clay mixture was extruded with $CO_2$ injected into the barrel of the extruder and the resulting foamed extrudate was cooled and pelletized. In the second step, the foamed extrudate was extruded with venting to produce the final PP/clay nanocomposites without $CO_2$. In this study, organophilic-clay and polypropylene matrix were used. Maleic anhydride grafted polypropylene (PP-g-MA) was used as a compatibilizer. This study focused on the effect of $scCO_2$ on the dispersion characteristics of the clays into a PP matrix and the rheological properties of the layered silicate based PP nanocomposites. The dispersion properties of clays in the nanocomposites as well as the rheological properties of the nanocomposites were examined as a function of the PP-g-MA concentration. The degree of dispersion of the clays in the nanocomposites was analyzed by X-ray diffraction and transmission electron microscope. Various rheological properties of the nanocomposites were measured using a rotational rheometer. In the experimental results, the $scCO_2$ assisted continuous manufacturing extrusion system was used to successfully produce the organophilic-clay filled PP nanocomposites. It was found that $scCO_2$ had a measurable effect on the clay dispersion in the polymer matrix and the melt intercalation of a polymer into clay layers.

진공챔버 내 프리트 이용 진공유리 봉지공정 최적화에 관한 연구 (A Study on Optimization of Vacuum Glazing Encapsulating Process using Frit inside a Vacuum Chamber)

  • 박상준;이영림
    • 한국산학기술학회논문지
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    • 제14권2호
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    • pp.567-572
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    • 2013
  • 냉난방을 사용하는 가정에서는 대부분 창문을 통해 열손실이 이루어지고 있는데 이를 방지하기 위해 Low-E 유리, 복층유리 또는 진공유리가 사용되고 있다. 본 논문에서는 진공유리 제작공정의 최종공정인 봉지공정에 대한 연구가 수행되었는데 기존 상압 접합이 아닌 진공챔버 내 접합이 고려되었다. 봉지과정의 효율성을 위해 진공챔버 내에서 히터온도에 따른 프리트 용융온도 및 접합시간을 최적화하였고 열응력으로 인한 유리 파손을 방지하기 위해 유리 예열온도를 최적화하였다. 이러한 결과를 바탕으로 성공적으로 진공유리를 제작하였고 측정된 열관류율은 약 $5.7W/m^2K$로 진공유리 내부압력은 약 $10^{-2}$ torr로 판명되었다.

리버스 엔지니어링으로 생성된 데이터를 이용한 쾌속 조형 기술 연구 (Rapid Prototyping from Reverse Engineered Geometric Data)

  • 우혁제;이관행
    • 한국정밀공학회지
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    • 제16권1호통권94호
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    • pp.95-107
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    • 1999
  • The design models of a new product in general are created using clay models or wooden mock-ups. The reverse engineering(RE) technology enables us to quickly create the CAD model of the new product by capturing the surface of the model using laser digitizers or coordinate measuring machines. Rapid prototyping (RP) is another technology that can reduce the product development time by fabricating the physical prototype of a part using a layered manufacturing technique. In reverse engineering process, however, the digitizer generates an enormous amount of point data, and it is time consuming and also inefficient to create surfaces out of these data. In addition, the surfacing operation takes a great deal of time and skill and becomes a bottleneck. In rapid prototyping, a faceted model called STL file has been the industry standard for providing the CAD input to RP machines. It approximates the CAD model of a part using many planar triangular patches and has drawbacks. A novel procedure that overcomes these problems and integrates RE with RP is proposed. Algorithms that drastically reduce the point clouds data have been developed. These methods will facilitate the use of reverse engineered geometric data for rapid prototyping, and thereby will contribute in reducing the product development time.

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