• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.50-53
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• 2003

Most companies use technologies such as stereolithography, selective laser sintering, and fused deposition modeling to make parts for such small consumer products as telephones, heads, and shoes. The largest part that the existing RP systems can make is only 600 mm in length. Because most RP systems build parts by depositing, solidifying, or sintering material point-by-point, making larger objects takes a long time. and in many cases, large objects won't fit the build size. A new effective thick-layered RP process. Transfer type Variable Lamination Manufacturing using expandable polystyrene foam (VLM-ST) has been developed with thick layers and sloped surfaces. In this paper, a scaledown model of F16 Fighter with the length of 800 mm is rapidly fabricated using the VLM-ST process. In order to build a CAD model of F16 larger than 600 mm in length, the approach in VLM-ST is to build larger parts in multiple sub-parts and then glue them together. The fabricated result shows that the VLM-ST process employing thick layers and sloped surfaces is adequate for creating the real-sized large objects in the diverse fields such as automobiles, electric home appliances, electronics. and etc.

• 한국지반신소재학회논문집
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• 제6권1호
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• pp.39-43
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• 2007

열융착법을 이용하여 보강과 배수기능을 가진 니들펀치 및 스펀본딩 부직포의 지오컴포지트를 제조하였다. 이 다층 부직포의 물성(인장, 인열 및 파영강도, 투수도 등)은 열융착법을 사용하여 제조될 경우 온도, 압력, 접착시간 등의 공정인자에 좌우된다. 따라서, 열융착법으로 제조된 지오컴포지트의 공정인자와 물성의 최적화는 매우 중요하다. 본 연구에서는 인공신경망(ANN)을 사용하여 지오컴포지트의 제조공정 최적화를 위한 알고리즘이 개발되었다. 지오컴포지트의 공정인자를 변화시켜 부직포 성능변화를 예측하기 위한 신경망 모사가 적용되었으며, 분석결과에 대한 제조방법의 효과를 조사하였다.

• 대한안전경영과학회지
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• 제6권4호
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• pp.155-170
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• 2004

Among the semiconductor If-chips, unlike memory chips, a majority of Application Specific IC(ASIC) products are produced by customer orders, and meeting the customer specified due date is a critical issue for the case. However, to the one who understands the nature of semiconductor manufacturing, it does not take much effort to realize the difficulty of meeting the given specific production due dates. Due to its multi-layered feature of products, to be completed, a semiconductor product(called device) enters into the fabrication manufacturing process(FAB) repeatedly as many times as the number of the product specified layers, and fabrication processes of individual layers are composed with similar but not identical unit processes. The unit process called photo-lithography is the only process where every layer must pass through. This re-entrant feature of FAB makes predicting and planning of due date of an ordered batch of devices difficult. Parallel machines problem in the photo process, which is bottleneck process, is solved with restricted roll out algorithm. Roll out algorithm is a method of solving the problem by embedding it within a dynamic programming framework. Restricted roll out algorithm Is roll out algorithm that restricted alternative states to decrease the solving time and improve the result. Results of simulation test in condition as same as real FAB facilities show the effectiveness of the developed algorithm.

• 한국생산제조학회지
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• 제23권4호
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.

• 한국레이저가공학회지
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• 제11권4호
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.73-82
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• 2003

최근 인쇄회로기판(printed wiring board, PWB)은 마이크로 전자패키지분야에서 디자인 또는 제조측면에서 핵심기술로 인식되고 있다. PWB는 열적특성이 다른 여러 재료가 적층되어 있는 구조이고 제조공정을 지나는 동안에 각 층의 재료는 서로 다른 열팽창률을 나타나게 되어 워피지, 수축, 크기 등의 많은 불량을 발생시킨다. PWB의 열변형 특성은 제조공정 변수 중 솔더레지스트의 부피변화에 의하여 많은 영향을 받으므로 본 연구에서는 각각 2층, 4층 PBGA 및 CSP의 열변형 특성을 솔더레지스트 공정에 따라 분석하고자 하였다. 솔더레지스트의 부피분율이 30%이상일 경우, 2층 PWB의 열변형이 4층 PWB보다 최대 40%로 높게 측정되었다. 이와 같은 이유는 4L PWB는 고인성 특성을 지닌 프리프레그와 동박이 추가적으로 적층되어 있으므로 솔더레지스트의 열변형을 상쇄시키기 때문이다. 반면에 솔더레지스트의 부피분율이 30%이하일 경우, PWB의 층수 및 디자인에 관계없이 유사한 열변형 특성을 나타내었다.

• International Journal of Precision Engineering and Manufacturing
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• 제8권3호
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• pp.14-19
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• 2007

Rapid prototyping (RP) technology can fabricate any 3D physical model regardless of geometric complexity using the layered manufacturing (LM) process. Stereolithography (SL) is the best-known example of RP technology. In general, the surface quality of a raw SL-generated part is unsatisfactory for industrial purposes due to the step artefact created by the LM process. Despite of the increased number of applications for SL parts, this side effect limits their uses. In order to improve their surface quality, additional post-machining finishing, such as traditional grinding, is required, but post-machining is time consuming and can reduce the geometric accuracy of a part. Therefore, this study proposes a post-machining technology combining coating and grinding processes to improve the surface quality of SL parts. Paraffin wax and pulp are used as the coating and grinding materials. By grinding the coating wax only up to the boundary of the part, the surface smoothness can be improved without damaging the surface. Finally, moulding and casting experiments were performed to confirm the suitability of the SL parts finished using the proposed process with rapid tooling (RT) techniques.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.240-241
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• 2007

In general, high temperature superconducting coated conductors have intermediary buffers layer consisting of seed, diffusion barrier and cap layers. Simplification of the oxide materials buffer architecture in the fabrication of high temperature superconducting coated conductors is required because the deposition of multi-layers buffer architecture leads to a longer manufacturing time and a higher cost process of coated conductors. Thus, single buffer layer deposition seems to be important for practical coated conductor manufacturing process. In this study, a single gradient layered buffer deposition process of YZO for low cost coated conductors has been tried using DC reactive sputtering technique. About several thick YZO gradient single buffer layers deposited by DC co-sputtering process were found to act as a diffusion layer.

• 한국기계가공학회지
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• 제20권8호
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• pp.18-24
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• 2021

Polymers, polymer compounds, are very moldable at low temperatures and have good strength against weight, and hence, are often used in the interior and exterior materials of cars. Owing to the increasing environmental problems, emission regulations have become stricter, which has increased the use of lightweight polymers as substitutes for metal materials. Therefore, as the use of polymer increases, extensive research is being conducted on the bonding technology of polymers, such as polyurethane and epoxy. However, the increased cost and environmental pollution by adhesives caused by the polymer manufacturing plant depend on the chemical composition or the manufacturer's mix ratio. To compensate for this issue, a laser beam is irradiated through a highly permeable polymer (PC) placed on top of an absorbent polymer (ABS) to transfer the laser output to the ABS polymer and fuse them at the interface. Moreover, enabling laser penetrating bonding by placing a stainless steel wire mesh between the two polymers can achieve improved bonding strength compared to conventional heterogeneous polymer bonding.

• 한국기계가공학회지
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• 제9권1호
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• pp.81-86
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• 2010

This paper investigated into process characteristics of AlTiN coated layers for machining to the direction of upper and lower in plastic mold material (KP-4) with the cemented carbide ball endmill with the diameter of 8mm coated AlTiN layers (1~4) step by step using machining center. The material used in experiments was KP-4 that was machined by three types of inclined angles; $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$ As estimated mechanical properties of AlTiN coated layers, it was shown the most result in the condition of three layered coating that the coating that the coating depth, the hardness of the coated layer and the surface roughness of the coated layer were $13{\mu}m$, Hv 3027.3 and $0.042{\mu}m$, respectively. The cutting component was better at the condition of upper direction than that of lower direction in all experimental conditions and indicated to be less which the bigger angle of the material was increased the effective diameter of the tool.